C25F7/00

System and methods for electrochemical grinding with a screen

A system and methods are provided for electrochemical grinding a workpiece. In one embodiment, a method includes controlling potentials to grinding tool and the workpiece, controlling applying electrolyte, and controlling grinding of the workpiece by the grinding tool. The method may also include determining screen replacement when there is sufficient metal plated.

INTEGRATING NANOPORE SENSORS WITHIN MICROFLUIDIC CHANNEL ARRAYS USING CONTROLLED BREAKDOWN

Nanopore arrays are fabricated by controlled breakdown in solid-state membranes integrated within polydimethyl-siloxane (PDMS) microfluidic devices. This technique enables the scalable production of independently addressable nanopores. By confining the electric field within the microfluidic architecture, nanopore fabrication is precisely localized and electrical noise is significantly reduced during sensing.

PRINTING OF THREE-DIMENSIONAL METAL STRUCTURES WITH A SACRIFICIAL SUPPORT
20170365484 · 2017-12-21 ·

A method for 3D printing includes printing a first metallic material on a substrate as a support structure (48). A second metallic material, which is less anodic than the first metallic material, is printed on the substrate as a target structure (46), in contact with the support structure. The support structure is chemically removed from the target structure by applying a galvanic effect to selectively corrode the first metallic material.

NANOPORE FORMING METHOD AND USES THEREOF
20220380930 · 2022-12-01 ·

The invention relates to a method for making nanopores in thin layers or monolayers of transition metal dichalcogenides that enables accurate and controllable formation of pore within those thin layer(s) with sub-nanometer precision.

NANOPORE FORMING METHOD AND USES THEREOF
20220380930 · 2022-12-01 ·

The invention relates to a method for making nanopores in thin layers or monolayers of transition metal dichalcogenides that enables accurate and controllable formation of pore within those thin layer(s) with sub-nanometer precision.

ELECTROCHEMICAL POLISHING OF NON-UNIFORM FEATURES
20170355032 · 2017-12-14 · ·

A method of controlling a working gap between one or more cathodic tools and an anodic workpiece in an electrochemical material dissolution process, the method comprising: providing a cathodic tool and an anodic workpiece defining a working gap therebetween, the cathodic tool and the workpiece being at least partially immersed in a conductive electrolyte solution; providing a negative electrical potential to the cathodic tool; monitoring one or more of the electrical potential, current, current density and charge between the cathodic tool and the anode to determine the working gap between the cathodic tool and the anode; and, controlling one or more process parameters to maintain one or more of the working gap and electrochemical working conditions between the cathodic tool and anodic workpiece at a targeted value.

METHOD FOR ELECTROCHEMICAL ROUGHENING OF THIN FILM ELECTRODES

The present invention relates to surface roughening methods and more particularly to a method for electrochemical roughening of thin film macro- and micro-electrodes. In one embodiment, an electrochemical etch template is formed comprising polymer particles adsorbed on a surface of a substrate to be roughened, followed by electrochemically etching of exposed regions of the substrate between the polymer particles in the electrochemical etch template so as to selectively roughen the surface of the substrate. In another embodiment, a surface of the electrode is immersed in either a adsorbing acidic solution, such as sulfuric acid, or a non-adsorbing acidic solution, such as perchloric acid, followed by electrochemically pulse etching the surface of the substrate at a narrow frequency range for adsorbing acidic solutions, or at a wide frequency range for non-adsorbing acidic solutions.

METHOD FOR ELECTROCHEMICAL ROUGHENING OF THIN FILM ELECTRODES

The present invention relates to surface roughening methods and more particularly to a method for electrochemical roughening of thin film macro- and micro-electrodes. In one embodiment, an electrochemical etch template is formed comprising polymer particles adsorbed on a surface of a substrate to be roughened, followed by electrochemically etching of exposed regions of the substrate between the polymer particles in the electrochemical etch template so as to selectively roughen the surface of the substrate. In another embodiment, a surface of the electrode is immersed in either a adsorbing acidic solution, such as sulfuric acid, or a non-adsorbing acidic solution, such as perchloric acid, followed by electrochemically pulse etching the surface of the substrate at a narrow frequency range for adsorbing acidic solutions, or at a wide frequency range for non-adsorbing acidic solutions.

Electrode for electrochemical measurement, electrolysis cell for electrochemical measurement, analyzer for electrochemical measurement, and methods for producing same

Provided are an electrode, an electrolysis cell, and an electrochemical analyzer that improve the long-term stability of analysis data. A working electrode, a counter electrode, and reference electrode are disposed in an electrolysis cell. The working electrode is obtained by forming a lead wire in a composite material having platinum or a platinum alloy as a base material, in which a metal oxide is dispersed, or in a laminated material obtained by laminating a valve metal and platinum such that the cross sectional crystal texture in the thickness direction of the platinum is formed in layers and the thickness of each layer of the platinum is 5 micrometers or less. The metal oxide is selected from among zirconium oxide, tantalum oxide, and niobium oxide, and the metal oxide content of the platinum or the platinum alloy is 0.005 to 1 wt % in terms of the zirconium, tantalum, or niobium metal.

Electronic circuit production
11266023 · 2022-03-01 · ·

Electrolytic Etching/Deposition System. A system for continuous circuit fabrication comprising means for storing and dispensing the substrate, means for laminating the substrate, means for printing the substrate, means for optical inspection of the substrate, means for photolithography of the substrate, means for drying the substrate, means for developing the substrate, means for washing the substrate and means for electroplating the substrate.