A color tunable lighting module is described which includes at least three solid state lighting emitters (such as light emitting diodes) and at least two wavelength converting elements (such as phosphors). The three solid state lighting emitters are formed of the same semiconductor material system and the light generated by them has dominant wavelengths in the blue-green-orange range of the optical spectrum. The two wavelengths converters are used re-emit some of the light from two of the emitters in broader spectra having longer dominant wavelengths, while the third emitter is selected to emit light at a wavelength between the dominant wavelengths of the light from the two emitters and the two converters. A control system may be employed to monitor and control the module and the lighting module can be optimized for tunable high color quality white light applications.

A color tunable lighting module is described which includes at least three solid state lighting emitters (such as light emitting diodes) and at least two wavelength converting elements (such as phosphors). The three solid state lighting emitters are formed of the same semiconductor material system and the light generated by them has dominant wavelengths in the blue-green-orange range of the optical spectrum. The two wavelengths converters are used re-emit some of the light from two of the emitters in broader spectra having longer dominant wavelengths, while the third emitter is selected to emit light at a wavelength between the dominant wavelengths of the light from the two emitters and the two converters. A control system may be employed to monitor and control the module and the lighting module can be optimized for tunable high color quality white light applications.

An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount.

An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount.

An LED array is mounted on a base that is thermally coupled to a heat spreader. At least one aperture is provided between the support area and an edge of the heat spreader. The heat spreader may be coupled to a thermal pad which has sufficient thermal conductivity and is sufficiently thin to allow the thermal resistivity between the heat spreader and a corresponding heat sink to be below a predetermined value.

An LED array is mounted on a base that is thermally coupled to a heat spreader. At least one aperture is provided between the support area and an edge of the heat spreader. The heat spreader may be coupled to a thermal pad which has sufficient thermal conductivity and is sufficiently thin to allow the thermal resistivity between the heat spreader and a corresponding heat sink to be below a predetermined value.

The present application relates to a light emitting diode module comprising: a light source device (11), a cover (10) for said light source device (11), the cover (10) being arranged to connect to an optical device (21); wherein said cover (10) comprises a heat conducting part (24, 34) which has an at least one order of magnitude higher thermal conductivity than the remaining part of the cover (10) and which is arranged to thermally connect said light source device (11) with said optical device (21). The present application further relates to a corresponding cover for a light source device (11) in a light emitting diode module (1).

The present application relates to a light emitting diode module comprising: a light source device (11), a cover (10) for said light source device (11), the cover (10) being arranged to connect to an optical device (21); wherein said cover (10) comprises a heat conducting part (24, 34) which has an at least one order of magnitude higher thermal conductivity than the remaining part of the cover (10) and which is arranged to thermally connect said light source device (11) with said optical device (21). The present application further relates to a corresponding cover for a light source device (11) in a light emitting diode module (1).

A display panel comprising a first substrate and a second substrate cell-assembled with the first substrate, wherein the first substrate is provided with at least one annular protrusion made of frit with the same center point, and the second substrate is provided with an encapsulating zone to fit the annular protrusion, the encapsulating zone comprising at least one annular groove, the amount of which is less than or equal to that of the annular protrusion(s). Embodiments of the present disclosure further provide a packaging method and a display device. An OLED display panel can be ensured to have good internal sealing property by means of its package, and its service life is prolonged.

Examples of the present disclosure disclose an LED light distribution structure, a light source module and a lamp. The LED light distribution structure includes a ring-shaped light distribution element and a plurality of LED chips; the ring-shaped light distribution element is provided with a light source cavity in a ring shape, and the light source cavity has a ring center and a center line surrounding the ring center in a ring shape; the plurality of LED chips are arranged in a ring shape in the light source cavity, each of the LED chips includes an LED and a chip substrate, and the LED is on the chip substrate; and LEDs on all the LED chips are uniformly arranged along a ring-shaped wiring line, the ring-shaped wiring line is in a concentric ring with the center line, and the ring-shaped wiring line is located inside or outside of the center line.