A composite cooling film including non-fluorinated organic polymeric layer, a metal layer disposed inwardly of the non-fluorinated organic polymeric layer, and an antisoiling, ultraviolet-absorbing hardcoat layer that is disposed outwardly of the non-fluorinated organic polymeric layer.

The present disclosure discloses a nano-separation refrigeration system and discloses a refrigeration circulation method, wherein the nano-separation refrigeration system includes an evaporator provided with an inlet and an outlet; a condenser provided with a condensation cavity, a gas inlet, a gas outlet, and a liquid outlet, wherein a molecular sieve membrane is disposed in the condensation cavity between the gas inlet and the gas outlet, and the molecular sieve membrane is configured to separate a mixed gas; a first connecting pipe having one end connected to the outlet and the other end to the gas inlet; a second connecting pipe having one end connected to the liquid outlet and the other end to the inlet; a third connecting pipe having one end connected to the gas outlet and the other end to the inlet.

The invention provides a heat pump system and method comprising a Shape-Memory Alloy (SMA) or Negative Thermal Expansion (NTE) core (2a, 2b) positioned in a housing and adapted to absorb heat and store energy in response to a first fluid inputted at a first temperature. The housing is configured to receive a second fluid via an inlet wherein a device changes pressure in the housing to cause the SMA or NTE core to change state to release the heat absorbed into the second fluid. An outlet is adapted to output the second fluid at a higher temperature than the first temperature.

The cooling systems and methods of the present disclosure involve modular fluid coolers and chillers configured for optimal power and water use based on environmental conditions and client requirements. The fluid coolers include wet media, a first fluid circuit for distributing fluid across wet media, an air to fluid heat exchanger, and an air to refrigerant heat exchanger. The chillers, which are fluidly coupled to the fluid coolers via pipe cages, include a second fluid circuit in fluid communication with the air to fluid heat exchanger and a refrigerant circuit in thermal communication with the second fluid circuit and in fluid communication with the air to refrigerant heat exchanger. Pipe cages are coupled together to allow for expansion of the cooling system when additional cooling capacity is needed. The fluid coolers and chillers are configured to selectively operate in wet or dry free cooling mode, partial free cooling mode, or mechanical cooling mode.

A fluid phase change thermal management cooling method and apparatus for removing heat from a source of heat, the method comprising the steps of: filling a cooling chamber with volume V1 of a fluid phase change thermal management cooling apparatus with a fluid in its liquid phase; increasing the volume of the cooling chamber to volume V2 to va-pourise a portion of the fluid from its liquid phase to its vapour phase such that there is substantially only the fluid in its liquid phase and fluid in its vapour phase within the volume V2; allowing a dwell time that provides for at least some of the fluid in its liquid phase that has contact with a heated surface of the cooling chamber to be vaporised; and repeating the steps where timing of the steps and dwell time between steps is selected to control heat build-up within selected limits.

A flexible two-phase cooling apparatus for cooling microprocessors in servers can include a primary cooling loop, a first bypass, and a second bypass. The primary cooling loop can include a reservoir, a pump, an inlet manifold, an outlet manifold, and flexible cooling lines extending from the inlet manifold to the outlet manifold. The flexible cooling lines can be routable within server housings and can be fluidly connected to two or more series-connected heat sink modules that are mountable on microprocessors of the servers. The flexible cooling lines can be configured to transport low-pressure, two-phase dielectric coolant. The first bypass can include a first pressure regulator configured to regulate a first bypass flow of coolant through the first bypass. The second bypass can include a second pressure regulator configured to regulate a second bypass flow of coolant through the second bypass.

A method of absorbing heat from two or more devices can employ a two-phase cooling apparatus that pumps low-pressure coolant through two or more fluidly-connected and series-connected heat sink modules. A flow of subcooled single-phase liquid coolant can be provided to an inlet of a first heat sink module in thermal communication with a first device. Within the first heat sink module, the flow of subcooled single-phase liquid coolant can absorb a first amount of heat from the first device as sensible heat. The flow of subcooled single-phase liquid coolant can be transported from an outlet of the first heat sink module to an inlet of a second heat sink module. Within the second heat sink module, the flow of subcooled single-phase liquid coolant can absorb a second amount of heat from the second device partially as sensible heat and partially as latent heat and thereby transform to two-phase bubbly flow.

A microprocessor assembly adapted for fluid cooling can include a semiconductor die mounted on a substrate. The semiconductor die can include an integrated circuit with a two-dimensional and/or three-dimensional circuit architecture. The assembly can include a heat sink module in thermal communication with the semiconductor die. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. When pressurized coolant is delivered to the inlet chamber, the plurality of orifices can provide jet streams of coolant into the outlet chamber and against a surface to be cooled to provide fluid cooling suitable to control a semiconductor die temperature during operation.

A process is disclosed for cooling a material that includes semiconductor nanoparticles in matrix material by anti-Stokes up-conversion. The semiconductor nanoparticle matrix is irradiated by a laser with a photonic wavelength matched to the anti-Stokes photoluminescence of the semiconductor nanoparticle bandgap. The semiconductor nanoparticles absorb the laser photon and phonons (heat) from lattice vibrations to photoluminescence photons with higher energy than the photon that were absorbed. A net cooling effect is generated from the lower energy and lower temperature in the material after anti-Stoke up-conversion.

The invention is for an apparatus and method for a refrigerator and a heat pump based on the magnetocaloric effect (MCE) offering a simpler, lighter, robust, more compact, environmentally compatible, and energy efficient alternative to traditional vapor-compression devices. The subject magnetocaloric apparatus alternately exposes a suitable magnetocaloric material to strong and weak magnetic field while switching heat to and from the material by a mechanical commutator comprising heat pipe elements. The invention may be practiced with multiple magnetocaloric stages to attain large differences in temperature. Key applications include thermal management of electronics, as well as industrial and home refrigeration, heating, and air conditioning. The invention offers a simpler, lighter, compact, and robust apparatus compared to magnetocaloric devices of prior art. Furthermore, the invention may be run in reverse as a thermodynamic engine, receiving low-level heat and producing mechanical energy.