Provided is a method of making a coated object, which may include stereolithographically producing a green intermediate object from a dual cure polymerizable resin, the intermediate object containing uncured polymerizable material therein; then, optionally cleaning the green object; then, in any order: coating at least one surface portion of the object with a particulate material; and heating the object sufficiently to further cure the object; the coating and/or heating steps carried out under conditions in which uncured polymerizable material sweats (or exudes) to the surface of said object, and wherein the uncured polymerizable material contacts the particulate material, polymerizes, and bonds the particulate material to the surface of the object during the coating and/or heating steps. Also provided is a coated object produced by the method.

Methods of drying a semiconductor substrate may include applying a drying agent to a semiconductor substrate, where the drying agent wets the semiconductor substrate. The methods may include heating a chamber housing the semiconductor substrate to a temperature above an atmospheric pressure boiling point of the drying agent until a vapor-liquid equilibrium of the drying agent within the chamber has been reached. The methods may further include venting the chamber, where the venting vaporizes the liquid phase of the drying agent from the semiconductor substrate.

The disclosure discloses a solid material drying system, including a drying tower and a closed annular conveyor belt at the bottom of the drying tower. A solid material enters the drying tower through the conveyor belt, and a first airflow moves towards the top of the drying tower from the bottom of the drying tower through the conveyor belt. Side walls of the drying tower are provided with several openings, and a second airflow moves towards the outside of the drying tower from the inside of the drying tower. Blocking plates that can block the openings are disposed at positions close to and above the openings inside the drying tower, and the blocking plates are hinged with the side walls of the drying tower. The disclosure is suitable for drying solid materials, and can be efficiently and universally applied to the drying of various types of solid materials.

The disclosure discloses a solid material drying system, including a drying tower and a closed annular conveyor belt at the bottom of the drying tower. A solid material enters the drying tower through the conveyor belt, and a first airflow moves towards the top of the drying tower from the bottom of the drying tower through the conveyor belt. Side walls of the drying tower are provided with several openings, and a second airflow moves towards the outside of the drying tower from the inside of the drying tower. Blocking plates that can block the openings are disposed at positions close to and above the openings inside the drying tower, and the blocking plates are hinged with the side walls of the drying tower. The disclosure is suitable for drying solid materials, and can be efficiently and universally applied to the drying of various types of solid materials.

Methods and systems for treating tailings at an elevated pH using lime are disclosed herein. In some embodiments, the method comprises (i) providing a tailings stream comprising bicarbonates and a pH less than 9.0, (ii) adding a coagulant comprising calcium hydroxide to the tailings stream to form a mixture having a pH of at least 11.5 and a soluble calcium level no more than 800 mg/L, and (iii) dewatering the mixture to produce a product having a solids content of at least 40% by weight. In some embodiments, the pH and soluble calcium level of the mixture cause chemical modification of clay materials of the mixture via pozzolanic reactions. In some embodiments, the undrained shear strength of the product increases over a period of time of at least two days.

Methods and systems for treating tailings at an elevated pH using lime are disclosed herein. In some embodiments, the method comprises (i) providing a tailings stream comprising bicarbonates and a pH less than 9.0, (ii) adding a coagulant comprising calcium hydroxide to the tailings stream to form a mixture having a pH of at least 11.5 and a soluble calcium level no more than 800 mg/L, and (iii) dewatering the mixture to produce a product having a solids content of at least 40% by weight. In some embodiments, the pH and soluble calcium level of the mixture cause chemical modification of clay materials of the mixture via pozzolanic reactions. In some embodiments, the undrained shear strength of the product increases over a period of time of at least two days.

A plurality of modular units are connected together on a slightly sloped drainage field with a perforated header pipe at the lower side conveying water away from the drainage system. An impermeable flexible liner cushioned on both sides is located below the modular units. The modular units are each made up of rigid boxes that have connecting cross slots at the bottom thereof and vertical perforations there through. The rigid boxes are lined with a drainage fabric that is site specific and have an expanded geosynthetic material therein, which is held in place when filled with porous granular material. High flexural strength mats are connected together over the tops of the modular units. An air inlet pipe connects air to the cross slots, down the sloped drainage field, to the header pipe to drain water from the bulk granular material resting on the high flexural strength mats. The entire system may be quickly disassembled, moved to a different location, and reassembled with the number of modular units being changed according to the circumstances.

A plurality of modular units are connected together on a slightly sloped drainage field with a perforated header pipe at the lower side conveying water away from the drainage system. An impermeable flexible liner cushioned on both sides is located below the modular units. The modular units are each made up of rigid boxes that have connecting cross slots at the bottom thereof and vertical perforations there through. The rigid boxes are lined with a drainage fabric that is site specific and have an expanded geosynthetic material therein, which is held in place when filled with porous granular material. High flexural strength mats are connected together over the tops of the modular units. An air inlet pipe connects air to the cross slots, down the sloped drainage field, to the header pipe to drain water from the bulk granular material resting on the high flexural strength mats. The entire system may be quickly disassembled, moved to a different location, and reassembled with the number of modular units being changed according to the circumstances.

A substrate processing apparatus includes a body having a processing space configured to pressurize a drying process fluid at a supercritical pressure therein, a fluid supply unit configured to supply the drying process fluid to the processing space, and a discharge unit configured to discharge the drying process fluid from inside the processing space, wherein the discharge unit includes a discharge line coupled to the body, and a sampling unit including a sampling line branched from a rear end area of the discharge line and configured to extract a sampling fluid, and a detector arranged in the sampling line and configured to analyze the sampling fluid.

Improved processing systems and methods are provided for wet and dry processing of a semiconductor wafer. Provided is an enclosed chamber for processing a semiconductor wafer within a processing space and a drainage system for directing processing fluids out of the processing space. The enclosed chamber includes a top plate and a bottom plate, which physically confine the processing fluids within a relatively small, enclosed processing space. This forces the processing fluids to flow radially across the wafer surface(s) without the need to rotate the wafer. The drainage system contains a conduit that is downstream from the processing space and configured to retain a portion of a processing fluid dispensed within the processing space. The portion retained within the conduit provides a pressure resistance against the processing fluid(s) dispensed within the processing space to improve wet and dry processing of the wafer surfaces.