Patent classifications
F26B5/00
Grain storage bin with aeration system
A grain storage bin includes a cylindrical wall formed by a plurality of panels arranged in rows with a bottom edge of a first row bolted to a top edge of a second lower row. At each joint the bottom edge of the first upper row is overlapped with and outside of the outer surface of top edge of the second lower row and the bottom edge is fastened to the top edge by bolts carrying spacers as to define a first channel along the joint for passage of air. A cover strip overlies the channel and extends from an upper edge of the strip at the inner surface of the first panel above the channel to a lower edge of the strip which is fastened to the top edge so as to define a second channel so that air can pass between the interior and the exterior through the first and second channels while the particulate material is prevented from escaping through the first channel by the cover strip.
Substrate processing apparatus
An upper flow passage 181 is connected to a buffer space 182. The upper flow passage 181 has a constant cross-sectional shape and a processing fluid flows as a laminar flow in the upper flow passage 181. On the other hand, the buffer space 182 has a larger flow passage cross-sectional area than the upper flow passage 181. Thus, the processing fluid flowing in the upper flow passage 181 is released at once into the wide buffer space 182, whereby the pressure of the processing fluid decreases. A backflow of the processing fluid from the buffer space 182 to the upper flow passage 181 is prevented due to this pressure difference and the magnitude of a flow passage resistance of the upper flow passage 181 viewed from the buffer space 182.
Alternative additives to enhance slurry dewatering
The invention provides methods and compositions for improving dewatering of mineral slurry. The method comprises adding an R-Succinic Compound (such as octadecenyl succinic acid, hexadecenyl succinic acid, and/or dodecenyl succinic acid) to the slurry. The R-Succinic Compound removes water that would otherwise be trapped within the filtered slurry cake.
DRYING SYSTEM AND DRYING METHOD FOR CLEANING SOLUTION ON MASK
A drying system and a drying method for a cleaning solution on a mask are disclosed. The drying system includes: a drying chamber having a first side wall and a second side wall arranged opposite to the first side wall; a plurality of first air knives on the first side wall and the second side wall for air-drying a cleaned mask; and a separation device for allowing a mask strip and a supporting and shielding strip to move away from each other at a spatial intersection region to increase a spacing between the mask strip and the supporting and shielding strip at the spatial intersection region, when the plurality of first air knives are air-drying the cleaned mask.
DRYING SYSTEM AND DRYING METHOD FOR CLEANING SOLUTION ON MASK
A drying system and a drying method for a cleaning solution on a mask are disclosed. The drying system includes: a drying chamber having a first side wall and a second side wall arranged opposite to the first side wall; a plurality of first air knives on the first side wall and the second side wall for air-drying a cleaned mask; and a separation device for allowing a mask strip and a supporting and shielding strip to move away from each other at a spatial intersection region to increase a spacing between the mask strip and the supporting and shielding strip at the spatial intersection region, when the plurality of first air knives are air-drying the cleaned mask.
Ventilation fan and drying system and method of using the same
An air circulation and ventilation system for an enclosure. The system includes a fan assembly subsystem with a housing defining a manifold. The housing has a first intake aperture configured to receive air from within the enclosure, a first outlet aperture configured to emit air from the manifold to outside the enclosure, and a fan configured to draw air in through the first intake aperture. The system includes a pressure equalization subsystem having a port configured to allow additional air into the enclosure. The port includes a damper for selectively opening and closing the port. The system also includes a switching subsystem with a switch operably coupled to the fan and the damper. The switch selects between a first mode where the damper is closed and the fan is off and a second mode where the port damper is open and the fan is on.
Ventilation fan and drying system and method of using the same
An air circulation and ventilation system for an enclosure. The system includes a fan assembly subsystem with a housing defining a manifold. The housing has a first intake aperture configured to receive air from within the enclosure, a first outlet aperture configured to emit air from the manifold to outside the enclosure, and a fan configured to draw air in through the first intake aperture. The system includes a pressure equalization subsystem having a port configured to allow additional air into the enclosure. The port includes a damper for selectively opening and closing the port. The system also includes a switching subsystem with a switch operably coupled to the fan and the damper. The switch selects between a first mode where the damper is closed and the fan is off and a second mode where the port damper is open and the fan is on.
DRYING APPARATUS
A drying apparatus includes an oven body, a magnetic field generating device, a chamber pressure controlling device and a baking device. The oven body is provided with a chamber which is air-hermetic for receiving a semiconductor package element. The chamber pressure controlling device reduces a chamber pressure of the chamber. The magnetic field generating device polarizes liquid on the semiconductor package element in the chamber. The baking device evaporates the liquid on the semiconductor package in the chamber.
DRYING APPARATUS
A drying apparatus includes an oven body, a magnetic field generating device, a chamber pressure controlling device and a baking device. The oven body is provided with a chamber which is air-hermetic for receiving a semiconductor package element. The chamber pressure controlling device reduces a chamber pressure of the chamber. The magnetic field generating device polarizes liquid on the semiconductor package element in the chamber. The baking device evaporates the liquid on the semiconductor package in the chamber.
SUBSTRATE TREATING APPARATUS
A substrate treating apparatus of the present disclosure comprises: a chamber member having an accommodation space configured to accommodate a vessel part where a substrate treatment region constituting a supercritical treatment space are formed, and an opening configured to move the substrate inside or outside; a shutter configured to open or close the chamber member; and a first exhaust part configured to discharge an internal air from the accommodation space to the outside, wherein the temperature of the substrate treatment region is increased.