A cleaning apparatus, method, and dry chamber are provided for cleaning a wafer carrier that holds wafers as part of a semiconductor fabrication process. The cleaning apparatus includes a wet chamber that receives the wafer carrier to be washed and a reservoir in fluid communication with the wet chamber. The reservoir stores a cleaning liquid that is introduced to the wafer carrier within the wet chamber during a washing operation, and a dry chamber is spaced apart from the wet chamber. The dry chamber receives the wafer carrier after the wafer carrier is washed in the wet chamber and holds the wafer carrier during a drying operation. A transport system transports the wafer carrier between the wet chamber and the dry chamber during a cleaning process.

A low profile design air tunnel system and method for providing uniform air flow in a refractance window dryer are disclosed. According to one embodiment, a system comprises a conditioned air supply manifold that provides air into a drying chamber. The system has a drying belt directed through the drying chamber. A feed application tray at a first end of the drying belt applies a liquid to the drying belt. The system has an exhaust manifold located at the first end of the drying belt.

A method for drying materials is disclosed. The method comprises introducing a material into a dryer chamber, creating steam from vaporizing moisture in the material by maintaining the chamber at a temperature, conditioning the material using the steam created from vaporing moisture in the material by conveying the material along a length of the chamber from an inlet end to an outlet end, exhausting steam near the inlet end of the chamber, exhausting steam near a dry-end exit end of the chamber, controlling a migration of moisture between the inlet and outlet ends by adjusting an exhaust flow rate near the inlet end of the chamber and/or an exhaust flow rate near the dry-end exit end of the chamber, and withdrawing the material from the chamber.

A lid for curing organic plants. The lid is configured to be secured onto a contain with an open top, wherein the lid includes a gasket located on the bottom side of the lid, wherein the lid further includes one or more valves configured to prevent air from entering the container when the lid is secured, wherein the valve is further configured to allow air to escape the container and enter the container when actuated, wherein the lid includes a plurality of numbers associated with a calendar date and a calendar month annularly arranged on a top surface of the lid, and wherein the lid further includes a plurality of tabs, wherein the plurality of tabs are configured to move bi-directionally and include an opening configured to align and display the plurality of numbers.

A cleaning apparatus, method, and dry chamber are provided for cleaning a wafer carrier that holds wafers as part of a semiconductor fabrication process. The cleaning apparatus includes a wet chamber that receives the wafer carrier to be washed and a reservoir in fluid communication with the wet chamber. The reservoir stores a cleaning liquid that is introduced to the wafer carrier within the wet chamber during a washing operation, and a dry chamber is spaced apart from the wet chamber. The dry chamber receives the wafer carrier after the wafer carrier is washed in the wet chamber and holds the wafer carrier during a drying operation. A transport system transports the wafer carrier between the wet chamber and the dry chamber during a cleaning process.

An electrostatic spray dryer for drying liquid into powder including an elongated cylindrical drying chamber having an electrostatic spray nozzle at an upper end and a powder collection vessel at a lower end. The powder collection vessel includes a removable and replaceable filter collections sock made of filter material for receiving and collecting dried powder from the drying chamber. For cleaning residual powder from an inside wall of the drying chamber, a scraper member is provided that is coupled by magnetic attraction to a manually removable driver on the external surface of the wall.

Provided are an air nozzle and a coater. The air nozzle includes an air outlet chamber, an air return chamber, and an infrared light assembly, where the air outlet chamber includes an air outlet panel, the air outlet panel facing a substrate to be treated; the air return chamber is provided with an air return panel on a side facing the substrate, the air return panel being provided with a plurality of punch holes for communication with the air return chamber; the air outlet panel is configured to convey a medium inside the air outlet chamber to outside the air nozzle, and the medium enters the air return chamber through the air return panel after passing through the substrate; and the infrared light assembly is provided on a path of the medium entering the air return chamber.

A drying device includes multiple partitioned spaces, and a jetting device configured to jet air to a component holder in each of the multiple spaces.

Provided is an electrode drying apparatus including a moisture supply unit capable of setting the internal temperature of a drying oven to a reference value, which is a level at which the drying of an electrode to be dried is stabilized, before an electrode drying process using hot air is started, thereby preventing the electrode from being fractured by over-drying at the early stage of drying the electrode in the drying oven, and an electrode drying method using the same.

The present solution provides a gargling cup, which includes: a cup body; a cup lid assembly configured to be covered on the cup body; a sterilization unit arranged on the cup lid assembly for sterilizing the cup body; a drying unit arranged on the cap lid assembly for drying the cup body. The gargling cup provided by this solution is configured for sterilizing and drying the cup body by the arrangement of the sterilization unit and the drying unit to prevent the cup body from breeding bacteria. The sterilization unit and the drying unit are both arranged on the cap lid assembly, so that the cup body is light and configured for holding enough water, and there is no need to worry that the water in the cup body will affect the service life of the sterilization unit and the drying unit.