A method for heat treating a powder part preform including a titanium alloy, includes heat treating the preform in a furnace at a predefined temperature, wherein the preform is on a holder during the heat treatment. The holder includes a titanium alloy having a mass titanium content no lower than 45%, or a zirconium alloy having a mass zirconium content no lower than 95%, wherein the material making up the holder has a melting temperature higher than the predefined heat treatment temperature, and an antidiffusion barrier is arranged between the preform and the holder to prevent the preform from becoming welded to the holder.

A method for heat treating a powder part preform including a titanium alloy, includes heat treating the preform in a furnace at a predefined temperature, wherein the preform is on a holder during the heat treatment. The holder includes a titanium alloy having a mass titanium content no lower than 45%, or a zirconium alloy having a mass zirconium content no lower than 95%, wherein the material making up the holder has a melting temperature higher than the predefined heat treatment temperature, and an antidiffusion barrier is arranged between the preform and the holder to prevent the preform from becoming welded to the holder.

A heating chamber (1) for a heating furnace is proposed, with which electrothermal vaporization of impurities from samples can be effected in order to be able to then analyze them spectrometrically. The heating chamber has a wall (3), a sample reception area (5), a nozzle area (7) and two electrical connection areas (9, 11). The heating chamber (1) is specially configured such that an electric current flows through the wall (3) in such a way that a heating capacity caused by it is higher in the nozzle area (7) than in the sample reception area (5). For example, the electrical connection areas (9, 11) may be arranged in a radial direction remoter from the longitudinal axis (8) than a part of the wall (3) surrounding the nozzle area (7), and the heating chamber (1) may be configured, for example by means of a locally constricted area (13), in such a way that the current between the two electrical connection areas (9, 11) is predominantly conducted radially inwards towards the part of the wall (3) surrounding the nozzle area (7). Advantageous heat distribution in the heating chamber (1) achievable thereby may have a positive effect on the analysis of sample impurities.

A setter for firing in a plate which is used for firing a honeycomb formed body and interposed between the honeycomb formed body and a shelf plate, wherein the setter for firing has a setter lower surface section facing the shelf plate, the setter lower surface section including: a central region part formed by a region including a lower surface center of the setter lower surface section; and a peripheral region part formed by a peripheral region of the central region part, and the peripheral region part has at least four or more setter groove parts each having a recessed cross sectional shape and extending radially from the lower surface center respectively in a direction from a boundary with the central region part toward a setter outer circumferential section.

The present invention relates to a firing cartridge, and more particularly, to a firing cartridge in which multiple slit grooves are formed in lateral portions positioned between an upper end portion and a lower end portion, and solid fuel cell electrodes are inserted into the slit grooves, such that the number of cells, which may be fired at the same time, is increased, and thus productivity of a solid fuel cell may be improved.

A substrate processing apparatus includes: a heat processing unit configured to perform a heat process on a substrate having a film formed on the substrate; and a control unit configured to control the heat processing unit, wherein the heat processing unit comprises: a heater configured to support and heat the substrate; a chamber configured to cover the substrate supported on the heater; a gas ejector having a head in which ejection holes are formed, and configured to eject a gas from the ejection holes toward a surface of the substrate; an outer peripheral exhauster configured to evacuate a processing space inside the chamber from an outer peripheral region located further outward than a peripheral edge of the substrate supported on the heater; and a central exhauster configured to evacuate the processing space from a central region located further inward than the peripheral edge of the substrate supported on the heater.

An apparatus for treating a substrate includes a process chamber having a process space inside, a support unit that supports the substrate in the process space, a heating unit that is provided inside the support unit and that heats the substrate, an exhaust unit that evacuates the process space, and a gas supply unit that supplies a gas into the process space, and the gas supply unit supplies the gas at a temperature selected from a first temperature and a second temperature.

Embodiments of the inventive concept provides an apparatus for treating a substrate. An embodiment of the inventive concept comprises a housing having a process space therein; and a supporting unit supporting a substrate in the process space, and the supporting unit comprises a supporting plate supporting the substrate; a heater member provide in the supporting plate and heating the substrate; and a cooling unit provided below the heater member and cooling the supporting plate, the cooling unit comprises a cooling plate spaced apart from the heater member; and a nozzle provided in the cooling plate, and supplying a cooling gas to a bottom surface of the heater member; and a driver moving the cooling plate between a standby position spaced a first distance apart from the heater member and a cooling position spaced a second distance apart from the heater member, the second distance is shorter than the first distance.

A heating device and a heating chamber are provided, comprising a base plate (21), at least three supporting columns (22) and a heating assembly, where the at least three supporting columns are arranged vertically on the base plate and are distributed at intervals along a circumferential direction of the base plate Top ends of the at least three supporting columns form a bearing surface for supporting a to-be-heated member (23). The heating assembly includes a heating light tube (24) and a thermal radiation shielding assembly, where the heating light tube is disposed above the base plate and below the bearing surface. A projection of an effective heating area formed by uniform distribution of the heating light tube on the base plate covers a projection of the bearing surface on the base plate. The thermal radiation shielding assembly shields heat radiated by the heating light tube towards surroundings and bottom.

A heater includes an insulating base, a resistance heating element, and a hollow member. The base includes an upper surface and a lower surface. The resistance heating element extends inside the base along the upper surface and the lower surface. The hollow member includes a first plate-shaped part laid over the lower surface, a second plate-shaped part facing the first plate-shaped part through a space, and a side surface part surrounding the space from an outside in a planar direction of the first plate-shaped part and the second plate-shaped part.