Patent classifications
F27D11/00
Method of preheating a set of shell molds for lost-wax casting
A method including preheating a set of N shell molds for lost-wax casting, where the method can comprise: individually charging shell molds into n unit electric furnaces, each of which has previously been preheated to an initial loading temperature; starting a predefined preheating cycle for each shell mold charged in the unit electric furnaces, with a preheating cycle comprising raising the temperature of the furnace in compliance with a predefined ramp up to a predetermined setpoint temperature, and holding the furnace at the setpoint temperature for a predetermined duration; and at the end of each preheating cycle, unloading the shell mold in question and repeating the two preceding operations for another non-preheated shell mold.
Method of preheating a set of shell molds for lost-wax casting
A method including preheating a set of N shell molds for lost-wax casting, where the method can comprise: individually charging shell molds into n unit electric furnaces, each of which has previously been preheated to an initial loading temperature; starting a predefined preheating cycle for each shell mold charged in the unit electric furnaces, with a preheating cycle comprising raising the temperature of the furnace in compliance with a predefined ramp up to a predetermined setpoint temperature, and holding the furnace at the setpoint temperature for a predetermined duration; and at the end of each preheating cycle, unloading the shell mold in question and repeating the two preceding operations for another non-preheated shell mold.
Heater elements with enhanced cooling
A heater assembly with enhanced cooling pursuant to various embodiments described herein makes use of fluidic flow in the insulation or in the space used for insulation. By creating a natural convection or forced convection flow, the heater cools down faster, it can operate at lower temperatures and/or higher temperature precision, and it can improve temperature controllability by generating higher heat loss rates.
Heater elements with enhanced cooling
A heater assembly with enhanced cooling pursuant to various embodiments described herein makes use of fluidic flow in the insulation or in the space used for insulation. By creating a natural convection or forced convection flow, the heater cools down faster, it can operate at lower temperatures and/or higher temperature precision, and it can improve temperature controllability by generating higher heat loss rates.
High temperature furnace having reconfigurable heater circuits
The core of a high temperature furnace has an elongated central test cavity for testing/calibration of a temperature-sensitive component, such as the probe of a thermocouple. At least three electrical heating elements as positioned adjacent to the test cavity, including two elements adjacent to the opposite end portions of the test cavity, respectively, and a center element between the end elements. A uniform temperature profile is maintained in the cavity by control circuitry that manages the supply of electrical power to the heating elements, by periodically configuring interconnections of the elements during multiple phases of a duty cycle. The duty cycle includes a first phase in which current is passed through the center element, a second phase in which current is passed through the end elements in series, and a third phase in which current is passed through one of the end elements and also through the center element without passing current through the other end element.
High temperature furnace having reconfigurable heater circuits
The core of a high temperature furnace has an elongated central test cavity for testing/calibration of a temperature-sensitive component, such as the probe of a thermocouple. At least three electrical heating elements as positioned adjacent to the test cavity, including two elements adjacent to the opposite end portions of the test cavity, respectively, and a center element between the end elements. A uniform temperature profile is maintained in the cavity by control circuitry that manages the supply of electrical power to the heating elements, by periodically configuring interconnections of the elements during multiple phases of a duty cycle. The duty cycle includes a first phase in which current is passed through the center element, a second phase in which current is passed through the end elements in series, and a third phase in which current is passed through one of the end elements and also through the center element without passing current through the other end element.
Apparatus and process for rapidly cooking food
An apparatus for rapidly cooking food includes a housing having a reservoir, a heating element, a binary distributor, and a container. In a method of using the apparatus for rapidly cooking food, food is placed into the container and water is poured into the reservoir. The heating element heats the water in the reservoir, and the resulting steam travels into the binary distributor. Pressurized steam then exits the binary distributor to uniformally cook the top of the food. Condensed steam gathers at the bottom of the container and is kept at a temperature capable of cooking the food. In such a way, food in the container is rapidly cooked. In one embodiment, the food to be cooked is a single serving of ramen brick style noodles.
Semiconductor device manufacturing apparatus
Provided is a heat treatment container having a small size and capable of efficiently performing a heat treatment on a SiC substrate. A heat treatment container is a container for a heat treatment on a SiC substrate 40 under Si vapor pressure. The SiC substrate 40 is made of, at least in a surface thereof, single crystal SiC. The heat treatment container includes a container part 30 and a substrate holder 50. The container part 30 includes an internal space 33 in which Si vapor pressure is caused. The internal space 33 is partially open. The substrate holder 50 is able to support the SiC substrate 40. When the substrate holder 50 supports the SiC substrate 40, an open portion of the container part 30 is covered so that the internal space 33 is hermetically sealed.
Semiconductor device manufacturing apparatus
Provided is a heat treatment container having a small size and capable of efficiently performing a heat treatment on a SiC substrate. A heat treatment container is a container for a heat treatment on a SiC substrate 40 under Si vapor pressure. The SiC substrate 40 is made of, at least in a surface thereof, single crystal SiC. The heat treatment container includes a container part 30 and a substrate holder 50. The container part 30 includes an internal space 33 in which Si vapor pressure is caused. The internal space 33 is partially open. The substrate holder 50 is able to support the SiC substrate 40. When the substrate holder 50 supports the SiC substrate 40, an open portion of the container part 30 is covered so that the internal space 33 is hermetically sealed.
CONTINUOUS GREASE FIRE SUPPRESSION SYSTEM
A continuous fire suppression system includes a fire suppressing vapor cooking medium circulating within a cooking chamber of a spiral oven; a temperature analyzer arranged to monitor a temperature of the fire suppressing vapor cooking medium; finned heating elements in communication with the temperature analyzer and arranged to heat the fire suppressing vapor cooking medium; a humidity analyzer arranged to monitor a relative humidity of the fire suppressing vapor cooking vapor medium; and a fire suppressing vapor cooking medium injector in communication with the humidity analyzers. the at least one fire suppressing vapor cooking medium injector arranged to inject the fire suppressing vapor cooking medium into the cooking chamber as needed to maintain a relative humidity equal to or greater than a relative humidity of no more than 10% vol. dry air with the remaining volume being the fire suppressing vapor cooking medium.