A customizable chamber spectral response is described which can be used at least to tailor chamber performance for wafer heating, wafer cooling, temperature measurement, and stray light. In one aspect, a system is described for processing a treatment object having a given emission spectrum at a treatment object temperature which causes the treatment object to produce a treatment object radiated energy. The chamber responds in a first way to the heating arrangement radiated energy and in a second way to the treatment object radiated energy that is incident thereon. The chamber may respond in the first way by reflecting the majority of the heat source radiated energy and in the second way by absorbing the majority of the treatment object radiated energy. Different portions of the chamber may be treated with selectively reflectivity based on design considerations to achieve objectives with respect to a particular chamber performance parameter.

An example oven for heating fibers includes a chamber having upper and lower portions and a supply structure between first and second ends of the chamber, wherein the supply structure is in communication with a first heating system and is configured to direct first heated gas from the first heating system into the upper portion of the chamber to heat fibers in the upper portion at a first temperature, and wherein the supply structure is in communication with a second heating system and is configured to direct second heated gas from the second heating system into the lower portion of the chamber to heat fibers in the lower portion at a second temperature different than the first temperature such that the upper and lower portions of the chamber maintain the different temperatures without a physical barrier between the upper and lower portion.

An example oven for heating fibers includes a chamber having upper and lower portions and a supply structure between first and second ends of the chamber, wherein the supply structure is in communication with a first heating system and is configured to direct first heated gas from the first heating system into the upper portion of the chamber to heat fibers in the upper portion at a first temperature, and wherein the supply structure is in communication with a second heating system and is configured to direct second heated gas from the second heating system into the lower portion of the chamber to heat fibers in the lower portion at a second temperature different than the first temperature such that the upper and lower portions of the chamber maintain the different temperatures without a physical barrier between the upper and lower portion.

A substrate in which a high-dielectric-constant gate insulator is formed on a silicon substrate with an interface layer film sandwiched in between is housed in a chamber. The method of the invention including: (a) housing the substrate in a chamber; (b) supplying ammonia to the chamber to foam an ammonia atmosphere; and (c) applying flash light to a surface of the substrate housed in the chamber to heat the high dielectric constant film, wherein the flash light applied in said step (c) has a spectral distribution that has a peak in a wavelength range of 200 to 300 nm.

One embodiment is directed to an oven for heating fibers. The oven comprises a plurality of walls forming a chamber and a supply structure disposed within the chamber between first and second ends of the chamber. The supply structure is in communication with a first heating system and is configured to direct heated gas from the first heating system into a first portion of the chamber. The supply structure is in communication with a second heating system and is configured to direct heated gas from the second heating system into a second portion of the chamber.

A system and method for sensing the melt level of an ingot and/or molten material within one or more of a melting hearth, a refining hearth, tundish, and/or a casting mold within a furnace system. One or more laser melt height systems is configured and oriented to measure the melt level of one or more furnace system vessels within a closed furnace chamber, and thereby provide control information for regulating an overall melting, refining, casting, and/or atomization process.

A system and method for sensing the melt level of an ingot and/or molten material within one or more of a melting hearth, a refining hearth, tundish, and/or a casting mold within a furnace system. One or more laser melt height systems is configured and oriented to measure the melt level of one or more furnace system vessels within a closed furnace chamber, and thereby provide control information for regulating an overall melting, refining, casting, and/or atomization process.

Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. In one or more embodiments, a process chamber comprises a first window, a second window, a substrate support disposed between the first window and the second window, and a motorized rotatable radiant spot heating source disposed over the first window and configured to provide radiant energy through the first window.

Ovens, discharge nozzle plates for distribution of gas through an oven, and methods to operate an oven are disclosed. Example ovens include a heating system to heat gas, a substrate heating volume, and a plenum comprising a side wall having a plurality of passages formed therein, the plenum configured to direct heated gas into the substrate heating volume from the plurality of passages, each of the plurality of passages formed in the plenum having a respective tapered cross-sectional shape.

A kettle comprising a base and a frame pivotally mounted relative to the base. The frame includes first electrical contacts connectable to a power source and a vessel is receivable in and removable from the frame. The vessel includes an internal element in connection with second electrical contacts and an opening from which liquid can be poured. When the vessel is received in the frame the first electrical contacts make connection with the second electrical contacts such that power is supplied to the internal element to heat water within the vessel. Pivoting of the vessel and frame relative to the base allows pouring of liquid, from the opening.