A domestic appliance (for example, a microwave oven), comprising: a housing; a front door; a retention mechanism (for example including a latch), located within the housing and engageable with the door; wherein the retention mechanism is movable between a first configuration, in which the door is retained in a closed position, and a second configuration, in which the door is non-engaged; an electromechanical actuator (for example a relay), adapted to move the retention mechanism out of said first configuration; and a controller (for example a microprocessor coupled to the relay, the microprocessor being operable in responsive to one or more signals to activate the relay, and thereby release the door from the closed position. Under spring bias, the door thus opens to about 30-45 degrees. The microprocessor-controlled door opening may be operable in three or more modes, including: actuation of a touch switch, remote control, or a microwave end of cooking.

A system for simultaneously heating multiple elongated surgical viewing instruments comprises a heater with a slot and an insert received by the slot. The insert has multiple elongate cavities, each configured to receive the tip of a viewing instrument. A cover, configured to cover the heater with the insert in the slot thereof, provides a plurality of openings aligned with the cavities of the insert. In the preferred embodiment, the heater is reusable and the insert and cover are disposable. The insert and cover may be integrally joined into a single unit. The system may further include a stand upon which the heater is supported, one or more cavities to receive cleaning swabs to be heated, and/or a pad to heat a cleaning wipe or other article.

Lid configurations for thermal cyclers and uses thereof are provided. A nucleic acid amplification device may include a lid assembly that may be able to move between an open and closed configuration. The lid assembly may include a heater therein. The heater in the lid may have an adjustable configuration that may be able to accommodate different configurations of sample containers. Optionally, the heater may be retractable within a housing of the thermal cycler, when the lid is opened.

Lid configurations for thermal cyclers and uses thereof are provided. A nucleic acid amplification device may include a lid assembly that may be able to move between an open and closed configuration. The lid assembly may include a heater therein. The heater in the lid may have an adjustable configuration that may be able to accommodate different configurations of sample containers. Optionally, the heater may be retractable within a housing of the thermal cycler, when the lid is opened.

An electric cooking device (1) includes a plurality of electric cookers (11) which are capable of cooking ingredients therein independently, in which adjacent electric cookers (11) are detachably connected with each other.

Embodiments of the disclosure provide a system including: an enclosure having an interior sized to enclose and the workpiece and form a vacuum and pressurized atmosphere within the interior. A plurality of thermal applicators may be in thermal communication with first and second portions of the interior. First and second thermal applicators may independently heat and cool the first and second portions of the interior. The first thermal applicator may apply a first thermal treatment to a first portion of the workpiece in the first portion of the interior. A second thermal applicator may apply a second thermal treatment to a second portion of the workpiece in the second portion of the interior independently of the first thermal treatment.

A semiconductor manufacturing apparatus is capable of reducing power consumption. The semiconductor manufacturing apparatus 1 includes a processing chamber 2 that has a top surface 2a and forms a processing space S therein; a mounting table 3 provided in the processing space S; an upper electrode 20 provided above the mounting table 3 to face the mounting table 3; heaters 35 and 36 provided around the upper electrode 20 and below the top surface 2a of the processing chamber 2 and configured to heat the upper electrode 20; and a heat insulating unit 50, mounted on the top surface 2a of the processing chamber 2, having a plate-shaped member 51 and a heat insulating member 52 that is provided on one main surface 51a of the plate-shaped member 51.

A heat treatment apparatus according to one aspect of the present disclosure includes a vertically long process chamber, a heater configured to heat the process chamber, and a cooler configured to cool the process chamber. The cooler includes a plurality of discharge holes provided at intervals along a longitudinal direction of the process chamber to discharge cooling fluid toward the process chamber and a plurality of shutters provided corresponding to the plurality of discharge holes. At least one of the plurality of shutters is configured to move to an open position independently of other shutters.

A heat treatment apparatus according to one aspect of the present disclosure includes a vertically long process chamber, a heater configured to heat the process chamber, and a cooler configured to cool the process chamber. The cooler includes a plurality of discharge holes provided at intervals along a longitudinal direction of the process chamber to discharge cooling fluid toward the process chamber and a plurality of shutters provided corresponding to the plurality of discharge holes. At least one of the plurality of shutters is configured to move to an open position independently of other shutters.

A plurality of substrate support parts provided on a susceptor each have an outer circumferential surface such that a plane parallel to a holding surface of a holding plate is formed on a top portion of a spherical surface. Even if a semiconductor wafer irradiated with flash light abruptly warps such that its front surface becomes raised, a back surface of the semiconductor wafer can smoothly rub against the plurality of substrate support parts. This can prevent chipping and breakage of the substrate support parts, and can also prevent scratches on the back surface of the semiconductor wafer. The substrate support parts having the outer circumferential surface of the above-mentioned shape can be located in any directions on the holding plate, thereby facilitating manufacturing, inspection, and management of the susceptor relating to the substrate support parts.