F28D15/00

HEAT EXCHANGER

The present invention relates to a heat exchanger (1) comprising: a heat exchange core bundle (3) in which a first heat-transfer fluid circulates, at least one inlet tank (5a) or outlet tank (5b) for a second heat-transfer fluid, at least one collector (7) arranged on the periphery of the heat exchange core bundle (3) and comprising a lateral wall (75) of which at least two portions (77) are folded over so as to fix the tank (5a, 5b) by crimping against the heat exchange core bundle (3),
the lateral wall (75) following the contour of at least one corner of the heat exchange core bundle (7), said lateral wall (75) comprising, on each side of the corner, a folded-over portion (77) and comprising in the region of said corner a non-folded-over portion (79), the folded-over portions (77) being connected continuously to the non-folded over portion (79).

COMPLIANT PIN FIN HEAT SINK WITH BASE INTEGRAL PINS
20170287809 · 2017-10-05 ·

A compliant pin fin heat sink includes a flexible base plate having a thickness of from about 0.2 mm to about 0.5 mm. A plurality of pins extends from the flexible base plate and is formed integral with the flexible base plate by forging. A flexible top plate is connected to and spaced from the flexible base plate. The plurality of pins is disposed between the flexible base plate and the flexible top plate.

Heat sink for a linear motor
09777972 · 2017-10-03 · ·

A heat sink for the primary part of a linear motor includes a coil system having at least one coil that is to be energized when the motor is in operation, the heat sink being provided for accommodating the coil system of the primary part and forming at least one duct, through which a coolant is flowing during the operation of the heat sink, and at least one intake as well as at least one outlet for the coolant. The heat sink is arranged as an integrally formed component, which has an interface for connecting an object to be moved with the aid of the primary part, the interface having a contact surface via which the object to be moved is able to be brought into contact with the heat sink, and which is arranged and provided for cooling both the coil system of the primary part and the contact surface, such that coolant supplied to the heat sink through an intake is used for cooling the coil system and the contact surface.

Heat sink for a linear motor
09777972 · 2017-10-03 · ·

A heat sink for the primary part of a linear motor includes a coil system having at least one coil that is to be energized when the motor is in operation, the heat sink being provided for accommodating the coil system of the primary part and forming at least one duct, through which a coolant is flowing during the operation of the heat sink, and at least one intake as well as at least one outlet for the coolant. The heat sink is arranged as an integrally formed component, which has an interface for connecting an object to be moved with the aid of the primary part, the interface having a contact surface via which the object to be moved is able to be brought into contact with the heat sink, and which is arranged and provided for cooling both the coil system of the primary part and the contact surface, such that coolant supplied to the heat sink through an intake is used for cooling the coil system and the contact surface.

Temperature glide thermosyphon and heat pipe
09777967 · 2017-10-03 · ·

Fluid to fluid heat exchange processes involve the hot fluid reducing in temperature and the cold fluid increasing in temperature. To transfer heat between the two fluids, a third, separated heat transfer fluid is often used. The present invention allows for passive heat transfer between the two fluids, using a separate heat transfer fluid, while enabling heat absorption and rejection through a continuously variable temperature.

COOLING DEVICE AND PROJECTION DISPLAY DEVICE
20170277027 · 2017-09-28 ·

A cooling device includes a duct with one opened end and another opened end; a fan disposed inside the duct, the fan being configured to send air present inside the duct in an air-sending direction; a heat sink disposed outside the duct, the heat sink including a base part having an opposed surface opposed to a mouth of the another end of the duct, and heat-sink fins including a plurality of thin plates extending from the opposed surface along the air-sending direction; a heat source in contact with the base part; a heat pipe connected to the heat source or the heat sink; and heat-pipe fins disposed between the fan and the one end of the duct inside the duct, the heat-pipe fins including a plurality of thin plates extending from the heat pipe along the air-sending direction.

GEOTHERMAL HEATING AND COOLING SYSTEM

A geothermal heating and cooling system that uses a water source to provide a heat transfer medium is provided. Elements of the system may include a water source, one or more circulation loops coupled to the water source, a heat exchanger and/or heat pump, and/or a monitoring component configured to monitor for conditions within the system, including leak integrity and water quality.

GEOTHERMAL HEATING AND COOLING SYSTEM

A geothermal heating and cooling system that uses a water source to provide a heat transfer medium is provided. Elements of the system may include a water source, one or more circulation loops coupled to the water source, a heat exchanger and/or heat pump, and/or a monitoring component configured to monitor for conditions within the system, including leak integrity and water quality.

Method and Apparatus for Cooling Integrated Circuits

An apparatus having first, second, and third chambers and a plurality of receiving channels is disclosed. The first chamber includes a device surface to be cooled. The second chamber has a first surface positioned opposite to the device surface to be cooled, the first surface including a plurality of jet openings adapted to spray a coolant on the device surface when the second chamber is pressured with the coolant. The third chamber is adapted to receive coolant that left the first chamber. Each of the receiving channels has a first end in the first chamber and a second end in the third chamber. Each of the receiving channels is adjacent to a corresponding one of the jet openings and is positioned to remove coolant dispersed into the first chamber by that jet opening.

Mechanism for mitigating high heat-flux conditions in a thermosiphon evaporator or condenser

The present disclosure relates to systems, devices, and methods that augment a thermosiphon system with a thermally conductive matrix material to increase the surface area to volume ratio for heat conduction at a predetermined region(s) of the thermosiphon system while minimizing capillary forces that are isolated to those region(s). The thermosiphon system has tubing including a condenser region, an evaporator region, and an adiabatic region (e.g., a region between the condenser and evaporator regions). The tubing can contain a heat transport medium and can provide passive two-phase transport of the heat transport medium between the condenser and evaporator regions according to thermosiphon principles. The system also includes a thermally conductive matrix material contained in the condenser region and/or the evaporator region but not in the adiabatic region, such that the thermally conductive matrix material increases a surface area for heat transfer in the condenser region and/or the evaporator region.