Method for controlling heat transfer between a mainly solid base and the ambient medium

This invention belongs to the field of construction of shielding and heat-shielding structures. The technical result is changing the degree of useful effect from the regulation of heat transfer depending on the temperature of the plates of the heat control structure.

In the method for regulating heat transfer between a mainly solid base and ambient medium, one plate (2) or at least two plates (2, 5) stacked in layers and interconnected are installed on base (1) at rest temperature, while at least one (2) of the said plates, when its temperature changes relative to the rest temperature, is capable of deforming so that a cavity is formed between this plate and the base or the plate adjacent in the layer, filled with particles of the ambient medium, and fixation points (3) of plate (2) to base (1) or plate (5) adjacent in the layer are selected so that this plate (2) takes a convex shape during deformation.

12 dependent claims, 10 figures.

There is disclosed a heat exchanger apparatus, comprising flat heat exchange plates positioned parallel to each other, and adjustable spacers provided near each vertical edge of the flat heat exchange plates to form a material flow channel. In an embodiment, each adjustable spacer is configured to be adjustable via one or more angular adjustment mechanisms to form a material flow channel with one of a consistent volume channel, a reducing volume channel, and an increasing volume channel. The adjustable spacers are configured to receive spacer extensions to adjust the width of the spacers. The spacer extensions form extend the face of the spacers with a flat or profiled material contact face.

There is disclosed a heat exchanger apparatus, comprising flat heat exchange plates positioned parallel to each other, and adjustable spacers provided near each vertical edge of the flat heat exchange plates to form a material flow channel. In an embodiment, each adjustable spacer is configured to be adjustable via one or more angular adjustment mechanisms to form a material flow channel with one of a consistent volume channel, a reducing volume channel, and an increasing volume channel. The adjustable spacers are configured to receive spacer extensions to adjust the width of the spacers. The spacer extensions form extend the face of the spacers with a flat or profiled material contact face.

In order to provide a thermal transport structure excellent in bendability, heat dissipation property, and lightweight property and also a thermal transport structure having a high reliability against vibrations and an excellent heat transport performance, used is a thermal transport structure (5, 201) including stacked graphite sheets (1, 213). This thermal transport structure (5, 201) includes a fixing portion (10, 202, 301) in which the stacked graphite sheets (1, 213) are fixed to each other;

and a thermally conductive portion (11, 203) in which the stacked graphite sheets (1, 213) are not fixed to each other.

A fill pack includes a first sheet and a second sheet. The first sheet has a first end, a second end and a first plurality of flutes. A first microstructure includes first top flat strips, first bottom flat strips and first conduit sides connecting the first top flat strips to the first bottom flat strips. A plurality of first radii connect the first top flat strips to the first conduit sides and the first bottom flat strips to the first conduit sides. The second sheet has a second plurality of flutes. A second microstructure includes second top flat strips, second bottom flat strips and second conduit sides connecting the second top flat strips to the second bottom flat strips. A plurality of second radii connect the second top flat strips to the second conduit sides and second bottom flat strips to the second conduit sides.

Provided are adaptive heat transfer methods and systems for uniform heat transfer to and from various types of workpieces, such as workpieces employed during fabrication of semiconductor devices, displays, light emitting diodes, and photovoltaic panels. This adaptive approach allows for reducing heat transfer variations caused by deformations of workpieces. Deformation may vary in workpieces depending on types of workpieces, processing conditions, and other variables. Such deformations are hard to anticipate and may be random. Provided systems may change their configurations to account for the conformation of each new workpiece processed. Further, adjustments may be performed continuously of discretely during heat transfer. This flexibility can be employed to improve heat transfer uniformity, achieve uniform temperature profile, reduce deformation, and for various other purposes.

Provided are adaptive heat transfer methods and systems for uniform heat transfer to and from various types of workpieces, such as workpieces employed during fabrication of semiconductor devices, displays, light emitting diodes, and photovoltaic panels. This adaptive approach allows for reducing heat transfer variations caused by deformations of workpieces. Deformation may vary in workpieces depending on types of workpieces, processing conditions, and other variables. Such deformations are hard to anticipate and may be random. Provided systems may change their configurations to account for the conformation of each new workpiece processed. Further, adjustments may be performed continuously of discretely during heat transfer. This flexibility can be employed to improve heat transfer uniformity, achieve uniform temperature profile, reduce deformation, and for various other purposes.

The invention refers to a heat exchanger plate and a plate heat exchanger. The heat exchanger plates are arranged beside each other in the plate heat exchanger to define several first plate interspaces for a first medium and several second plate interspaces for a second medium. Each heat exchanger plate comprises a heat transfer area, an edge area, which extends around and outside the heat transfer area, and a functional device, which is configured to receive or produce a signal. The heat exchanger plate also comprises a communication module provided on the heat exchanger plate. The communication module comprises an electronic circuit connected to the functional device and a module antenna. The communication module is configured to permit wireless communication of the signal with a master unit via the module antenna.

The invention refers to a heat exchanger plate and a plate heat exchanger. The heat exchanger plates are arranged beside each other in the plate heat exchanger to define several first plate interspaces for a first medium and several second plate interspaces for a second medium. Each heat exchanger plate comprises a heat transfer area, an edge area, which extends around and outside the heat transfer area, and a functional device, which is configured to receive or produce a signal. The heat exchanger plate also comprises a communication module provided on the heat exchanger plate. The communication module comprises an electronic circuit connected to the functional device and a module antenna. The communication module is configured to permit wireless communication of the signal with a master unit via the module antenna.

The present invention is a heat management device for a hookah, wherein the device is provided to enclose a heat source such as burning charcoal. The heat source is provided on the top surface of a base which conducts heat to tobacco located at the bottom side of the base. The heat management device is further provided with a hollow riser which defines an air path from the top side of the base to the bottom side of the base while preventing particulate from the heat source from contaminating the tobacco.