Heat transfer devices, electronic devices, and methods for heat transfer with an external body. Heat transfer devices include a first disc, a second disc positioned adjacent to the first disc, and at least one spacer positioned between the first disc and the second disc. The first disc defines an aperture and comprises a pin cooling structure extending from around the aperture. The pin cooling structure comprises a distal end configured to facilitate heat exchange between the pin cooling structure and an external/adjacent/separate body and one or more side walls. At least one of the one or more side walls, the distal end, and the aperture at least partially define a pin volume. The second disc defines an inlet that is configured to (i) receive a fluid, and (ii) allow the fluid to flow from the inlet and into the pin volume.

Heat transfer devices, electronic devices, and methods for heat transfer with an external body. Heat transfer devices include a first disc, a second disc positioned adjacent to the first disc, and at least one spacer positioned between the first disc and the second disc. The first disc defines an aperture and comprises a pin cooling structure extending from around the aperture. The pin cooling structure comprises a distal end configured to facilitate heat exchange between the pin cooling structure and an external/adjacent/separate body and one or more side walls. At least one of the one or more side walls, the distal end, and the aperture at least partially define a pin volume. The second disc defines an inlet that is configured to (i) receive a fluid, and (ii) allow the fluid to flow from the inlet and into the pin volume.

Embodiments disclosed herein relate to devices, systems, and methods for cooling and/or heating a medium as well as cooling and/or heating an environment containing the medium. More specifically, at least one embodiment includes a heat pump that may heat and/or cool a medium and, in some instances, may transfer heat from one location to another location.

An apparatus includes a structure configured to receive and transport thermal energy. The structure includes one or more materials configured to undergo a solid-solid phase transformation at a specified temperature or in a specified temperature range. The one or more materials form a heat input region configured to receive the thermal energy and a cold sink interface region configured to reject the thermal energy. The structure also includes one or more thermal energy transfer devices embedded in at least part of the one or more materials. The one or more thermal energy transfer devices are configured to transfer the thermal energy throughout the one or more materials and at least partially between the heat input region and the cold sink interface region. The one or more materials are also configured to absorb and store excess thermal energy in response to a temperature excursion associated with a thermal transient event and to release the stored thermal energy after the thermal transient event.

An example memory module cooler may include a first liquid manifold, a second liquid manifold, and a cooling tube connected to the first and second liquid manifolds such that. The cooling tube may be connected to the manifolds such that (1) liquid coolant can flow from the first liquid manifold through the cooling tube to the second liquid manifold, and (2) the cooling tube can be rotated relative to the first and second liquid manifolds around a longitudinal axis of the cooling tube. The cooling tube may have an oblong cross-sectional profile.

The various technologies presented herein relate to fabrication and operation of a heat exchanger that is configured to extract heat from an underlying substrate. Heat can be extracted by way of an air gap formed between an impeller and a baseplate. By utilizing a pump to create an initial air gap that is further maintained by rotation of the impeller relative to the baseplate, a spring can be utilized that can apply a force of greater magnitude to the impeller than is used in a conventional approach, thus enabling the weight of the impeller to be negligible with respect to a width of the air gap, thereby conferring the desirable feature of orientation independence with respect to gravity with no performance degradation.

The invention relates to improvements of a heat exchanger, particularly a scraping heat exchanger having an outer cylinder comprising a first wall having a smooth circle-cylindrical inner side, and an inner cylinder positioned concentrically within it. The improvements regard a simple detachable inner cylinder, a heat exchanger with lid including a fluid barrier, a heat exchanger with a tangential output, and a method and heat exchanger adapted for improved evacuation of a product chamber of a heat exchanger.

A heat pipe integrated thermal battery (HITB) is provided that may include a storage tank, a thermal storage medium within the storage tank, a guide tube extending within the storage tank and through at least one end of the storage tank, and a heat pipe configured to be movable within the guide tube. The heat pipe may be configured to discharge heat to and absorb heat from the thermal storage medium within the storage tank.

A heat pipe integrated thermal battery (HITB) is provided that may include a storage tank, a thermal storage medium within the storage tank, a guide tube extending within the storage tank and through at least one end of the storage tank, and a heat pipe configured to be movable within the guide tube. The heat pipe may be configured to discharge heat to and absorb heat from the thermal storage medium within the storage tank.

A system includes a flight vehicle and one or more deployable radiators. Each deployable radiator includes a structure configured to receive thermal energy and to reject the thermal energy into an external environment. The structure includes (i) multiple inline and interconnected thermomechanical regions and (ii) one or more thermal energy transfer devices embedded in at least some of the thermomechanical regions. The one or more thermal energy transfer devices are configured to transfer the thermal energy between different ones of the thermomechanical regions. At least one of the thermomechanical regions includes one or more shape-memory materials configured to cause a shape of the structure to change. The thermomechanical regions may include one or more heat input regions configured to receive the thermal energy, one or more heat rejection regions configured to reject the thermal energy into the external environment, and one or more morphable regions including the one or more shape-memory materials and configured to change shape.