A heat exchanger for managing thermal energy between a flow of a first fluid and a flow of a second fluid includes first and second parting sheets and a closure bar extending between the first and second parting sheets. The closure bar includes an elongate body, a shield positioned upstream from the body relative to a direction of the flow of the first fluid, and a support connecting the shield to the closure bar.

A thermoelectric cloak including an inner region and an external medium. The inner region has a cloaking effect and is simultaneously invisible from both heat and electric charge fluxes; and heat, electric currents, and gradients in the external medium are unaltered by the cloaking effect of the inner region.

A thermoelectric cloak including an inner region and an external medium. The inner region has a cloaking effect and is simultaneously invisible from both heat and electric charge fluxes; and heat, electric currents, and gradients in the external medium are unaltered by the cloaking effect of the inner region.

Examples described herein include an assembly. The assembly may be a heatsink assembly or some other cooling assembly (for example, a liquid cooling assembly). The heatsink or cooling assembly may include a heatsink or some other cooling means, such as a liquid cooling device. The heatsink or cooling assembly may include a base. The heatsink itself may connect to a base or the bottom of the heatsink may form the base. The base may interface or connect to a bolster plate. The base may interface or connect to a bolster plate via apertures in the base and fasteners included on the base and the bolster plate. The heatsink or cooling assembly may include one or more apertures to accept one or more guide pins and/or retention pins on the bolster plate. The base may include retention mechanisms positioned over the apertures to attach to retention pins on the bolster plate. The retention pins may be the guide pins with retention features.

Systems according to the present disclosure provide one or more surfaces that function as heat or power radiating surfaces for which at least a portion of the radiating surface includes or is composed of fractal cells placed sufficiently closed close together to one another so that a surface (plasmonic) wave causes near replication of current present in one fractal cell in an adjacent fractal cell. A fractal of such a fractal cell can be of any suitable fractal shape and may have two or more iterations. The fractal cells may lie on a flat or curved sheet or layer and be composed in layers for wide bandwidth or multibandwidth transmission. The area of a surface and its number of fractals determines the gain relative to a single fractal cell. The boundary edges of the surface may be terminated resistively so as to not degrade the cell performance at the edges.

Systems according to the present disclosure provide one or more surfaces that function as heat or power radiating surfaces for which at least a portion of the radiating surface includes or is composed of fractal cells placed sufficiently closed close together to one another so that a surface (plasmonic) wave causes near replication of current present in one fractal cell in an adjacent fractal cell. A fractal of such a fractal cell can be of any suitable fractal shape and may have two or more iterations. The fractal cells may lie on a flat or curved sheet or layer and be composed in layers for wide bandwidth or multibandwidth transmission. The area of a surface and its number of fractals determines the gain relative to a single fractal cell. The boundary edges of the surface may be terminated resistively so as to not degrade the cell performance at the edges.

Systems according to the present disclosure provide one or more surfaces that function as power radiating surfaces for which at least a portion of the radiating surface includes or is composed of fractal cells placed sufficiently closed close together to one another so that a surface wave causes near replication of current present in one fractal cell in an adjacent fractal cell. The fractal cells may lie on a flat or curved sheet or layer and be composed in layers for wide bandwidth or multibandwidth transmission. The area of a surface and its number of fractals determines the gain relative to a single fractal cell. The boundary edges of the surface may be terminated resistively so as to not degrade the cell performance at the edges. The fractal plasmonic surfaces can be utilized to facilitate electrical conduction with lower ohmic resistance than would otherwise be possible in the absence of the fractal plasmonic surface(s) at the same temperature.

Systems according to the present disclosure provide one or more surfaces that function as power radiating surfaces for which at least a portion of the radiating surface includes or is composed of fractal cells placed sufficiently closed close together to one another so that a surface wave causes near replication of current present in one fractal cell in an adjacent fractal cell. The fractal cells may lie on a flat or curved sheet or layer and be composed in layers for wide bandwidth or multibandwidth transmission. The area of a surface and its number of fractals determines the gain relative to a single fractal cell. The boundary edges of the surface may be terminated resistively so as to not degrade the cell performance at the edges. The fractal plasmonic surfaces can be utilized to facilitate electrical conduction with lower ohmic resistance than would otherwise be possible in the absence of the fractal plasmonic surface(s) at the same temperature.

A method for fabricating an integrated heat pipe is disclosed. The integrated heat pipe includes a porous wick structure, a solid conducting structure, and an integrated part. In a CAD model, the porous wick structure is represented as a simple solid having a finite amount of mechanical interference; the solid conducting structure and the integrated part are represented as simple solids. After incorporating the CAD model into a 3D-printer build file, 3D-printer parameters representing the porous wick structure of the integrated heat pipe are assigned to a porous region component model within the 3D-printer build file, and standard 3D-printer parameters representing the solid conducting structure and the integrated part are assigned to a solid region component model within the 3D-printer build file. The 3D-printer build file is utilized to print the integrated heat pipe on a 3D printer.

A method for fabricating an integrated heat pipe is disclosed. The integrated heat pipe includes a porous wick structure, a solid conducting structure, and an integrated part. In a CAD model, the porous wick structure is represented as a simple solid having a finite amount of mechanical interference; the solid conducting structure and the integrated part are represented as simple solids. After incorporating the CAD model into a 3D-printer build file, 3D-printer parameters representing the porous wick structure of the integrated heat pipe are assigned to a porous region component model within the 3D-printer build file, and standard 3D-printer parameters representing the solid conducting structure and the integrated part are assigned to a solid region component model within the 3D-printer build file. The 3D-printer build file is utilized to print the integrated heat pipe on a 3D printer.