F28F7/00

Integrated pipe heat exchanger

A heat exchanger system may have a base, a mounting apparatus for attaching the base to a device, a gasket shelf for placing a gasket, a dissipation member for dissipating heat, and heat generator attachment sites for absorbing heat. A mounting apparatus may have finger-like extensions which flex and draw the base into contact with an underlying electronic device from which the system conducts heat. A base may also have an integrated heat pipe clamp attachment forming an aperture in the base into which a heat pipe may extend and may be clamped in thermal communication. The dissipation device may be a series of fins and troughs and a fan may direct air over the dissipation device to cool the apparatus.

Sub-zero treatment device

The present invention provides a sub-zero treatment device capable of uniformly cooling a cooling target object and reducing the amount of liquid refrigerant used for cooling the cooling target object. The sub-zero treatment device has an exhaust member extending from a through-hole provided in a cooling tank constituting a cooling target object mounting chamber through to the interior of the cooling target object mounting chamber, and having an exhaust port, wherein the exhaust port is disposed in an exhaust port positioning space, which is the space located in the upper half of the cooling target object mounting chamber and having a width in the transverse direction that is equal to the maximum width in the transverse direction of the suction port.

Constant mass flow multi-level coolant path electrostatic chuck
09847240 · 2017-12-19 · ·

A workpiece support has a vessel having a top interior wall and a bottom interior wall. An interior cavity is defined between the top interior wall and bottom interior wall, wherein a support surface configured to support a workpiece. A plate is positioned within the interior cavity, dividing the interior cavity into a top cavity and a bottom cavity. The top and bottom cavities are fluidly coupled about a periphery of the plate. A first taper defined in one or more of the top interior wall and a top portion of the plate provides a substantially constant volume across a radial cross-section of the top cavity. A second taper defined in one or more of the bottom interior wall and a bottom portion of the plate provides a substantially constant volume across a radial cross-section of the bottom cavity. First and second ports fluidly couple the top and bottom cavities to respective first and second fluid channels.

Mechanical-thermal structure suitable for a space environment
09841241 · 2017-12-12 · ·

A monolithic mechanical-thermal structure which is suitable for a space environment is provided, in which the structure contains at least one hole. The walls of the hole are lined with filaments. The monolithic mechanical-thermal structure may be made of metal. And a process for manufacturing the structure is also provided.

Advanced heat exchanger with integrated coolant fluid flow deflector

A pin fin cooling system may include at least one first surface defining at least a base portion of the cooling system, and at least one pin fin array of a plurality of pin fins and at least one coolant fluid flow detector extending from the first surface. The coolant fluid flow deflector may be configured to split a coolant fluid flow from a primary flow into at least two secondary flows that follow a predetermined path over local heat sources, and may have a maximum wall thickness that is equal to a diameter of a cross-section of one of the pin fins. The cooling system may further include at least one boundary fin extending from the first surface that is in the shape of a spline, at least a portion of which may correspond and match at least a portion of a pattern of the pin fin array.

Heat dissipation device
11512910 · 2022-11-29 · ·

A heat dissipation device includes a base, fins and strip-shaped plates. The fins protrude side by side from the base, and the fins respectively include first end edges and second end edges opposite to each other. The first end edges are connected to the base. The strip-shaped plates are parallel to the base and connected to at least a part of the second end edges of the fins, and strip-shaped openings are formed between the strip-shaped plates. The base, the fins and the strip-shaped plates collectively surround chambers in a non-closed manner, and each of the strip-shaped openings is connected to the corresponding chamber. A distance between two adjacent fins of the fins is S, a width of any one of the strip-shaped openings is d, and d/S is between 0.01 and 0.4.

Systems for uniform heat transfer including adaptive portions

Provided are adaptive heat transfer methods and systems for uniform heat transfer to and from various types of workpieces, such as workpieces employed during fabrication of semiconductor devices, displays, light emitting diodes, and photovoltaic panels. This adaptive approach allows for reducing heat transfer variations caused by deformations of workpieces. Deformation may vary in workpieces depending on types of workpieces, processing conditions, and other variables. Such deformations are hard to anticipate and may be random. Provided systems may change their configurations to account for the conformation of each new workpiece processed. Further, adjustments may be performed continuously of discretely during heat transfer. This flexibility can be employed to improve heat transfer uniformity, achieve uniform temperature profile, reduce deformation, and for various other purposes.

HEAT TRANSFER UTILIZING VASCULAR COMPOSITES AND FIELD INDUCED FORCES

A system includes a matrix material to remove heat from an object. The matrix material includes a plurality of vascular structures. Each of the vascular structures are filled with a fluid. At least one transducer generates field-induced forces into the fluid within the vascular structures of the matrix material. At least one controller pulses the transducer to generate the field-induced forces into the fluid within the vascular structures. The field-induced forces generate fluid flow within the vascular structures to remove the heat from the object.

Systems and methods for radiative cooling and heating

Systems and methods for radiative cooling and heating are provided. For example, systems for radiative cooling can include a top layer including one or more polymers, where the top layer has high emissivity in at least a portion of the thermal spectrum and an electromagnetic extinction coefficient of approximately zero, absorptivity of approximately zero, and high transmittance in at least a portion of the solar spectrum, and further include a reflective layer including one or more metals, where the reflective layer has high reflectivity in at least a portion of the solar spectrum.

Tube stay installation assembly

A tube stay mounting assembly includes a press assembly having a housing and a top block configured to flatten fins on a first surface of a finned tube. A press arm is operable to move the top block vertically with respect to the housing. A bottom block is configured to flatten fins on a second surface of the finned tube when the press arm is rotated and moves the top block downwardly. A tube stay clamping assembly includes a clamping housing configured to receive a tube stay having a top, bottom, rear, and front walls, the tube stay being configured to receive a flattened portion of the finned tube. A clamping arm is connected by linking arms to a clamping block, the clamping block configured to engage and force the front wall into snap-fit engagement with the top wall of the tube stay.