F28F7/00

Cooling arrangement for a rack hosting electronic equipment and at least one fan
11765864 · 2023-09-19 · ·

A cooling arrangement for a rack hosting electronic equipment and at least one fan comprises first and second air-liquid heat exchangers. A first one is mounted to the rack so that heated air expelled from the rack by the fan flows therethrough. The second one is mounted to the first one so that air having flowed through the first heat exchanger flows through the second heat exchanger. Each heat exchanger comprises a frame, an inlet receiving liquid from a cold supply line, an outlet returning liquid to a hot return line, and a continuous internal conduit forming a plurality of interconnected parallel sections. The cooling arrangement is mounted to the rack so that the first and second frames are parallel and adjacent. One interconnected parallel section of the first heat exchanger nearest to its inlet is proximate one interconnected parallel section of the second heat exchanger nearest to its outlet.

Tube stay installation assembly

A tube stay mounting assembly includes a press assembly having a housing and a top block configured to flatten fins on a first surface of a finned tube. A press arm is operable to move the top block vertically with respect to the housing. A bottom block is configured to flatten fins on a second surface of the finned tube when the press arm is rotated and moves the top block downwardly. A tube stay clamping assembly includes a clamping housing configured to receive a tube stay having a top, bottom, rear, and front walls, the tube stay being configured to receive a flattened portion of the finned tube. A clamping arm is connected by linking arms to a clamping block, the clamping block configured to engage and force the front wall into snap-fit engagement with the top wall of the tube stay.

Heat exchanger for a motor vehicle and corresponding production method

A heat exchanger for a method vehicle and a method of producing a heat exchanger are disclosed. The heat exchanger includes a heat exchanger block closed by a side part. The heat exchanger block has a tube bottom including a deformable hook, and the side part includes a tab provided complementary to a corner region of the tube bottom. The tab has a section, that abuts on a front side of the tube bottom, that includes a through opening or depression. A material portion of the hook is displaced through the through opening or depression via a graining in an assembled state, such that the axes of the through opening and the graining are offset and parallel to one another.

Heat sink with dashed crosshatched fin pattern
11175103 · 2021-11-16 · ·

Various implementations described herein relate to a heat sink having a base and a plurality of fins extending from the base. Each of the plurality of fins is spaced apart from other ones of the plurality of fins. The plurality of fins includes first fins and second fins. Each of the first fins is perpendicular to any of the second fins.

Heat exchanger closure bar with shield

A heat exchanger for managing thermal energy between a flow of a first fluid and a flow of a second fluid includes first and second parting sheets and a closure bar extending between the first and second parting sheets. The closure bar includes an elongate body, a shield positioned upstream from the body relative to a direction of the flow of the first fluid, and a support connecting the shield to the closure bar.

Heat exchanger closure bar with shield

A heat exchanger for managing thermal energy between a flow of a first fluid and a flow of a second fluid includes first and second parting sheets and a closure bar extending between the first and second parting sheets. The closure bar includes an elongate body, a shield positioned upstream from the body relative to a direction of the flow of the first fluid, and a support connecting the shield to the closure bar.

Additive manufacturing processes and additively manufactured products

A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.

Pierced thermal interface constructions

Pierced thermal interface constructions including a thermal interface material (TIM) structure comprising: a TIM sheet comprising a plurality of piercings, where each of the plurality of piercings comprises a cavity and displaced material, and where the displaced material from each of the plurality of piercings protrudes away from the TIM sheet.

Heat dissipation device

Disclosed is a heat dissipation device including a base, a plurality of heat pipes and a heat dissipation structure. The base includes a support plate, a plurality of through-pipe grooves are arranged in the support plate. Each heat pipe includes a heat absorption section and a heat transfer section connected to the heat absorption section, where the heat absorption section is arranged in the through-pipe grooves and at least one heat transfer section of the heat pipe is away from the support plate in the perpendicular direction to the support plate. The heat dissipation structure is arranged on the first surface of the support plate, and the heat transfer section of the plurality of heat pipes extends into the interior of the heat dissipation structure and thermally contacts the heat dissipation structure. The heat dissipation device of the present disclosure dissipates heat faster.

Multi-purpose heat sink, method of manufacturing the same, board card, and multi-purpose heat sink platform

The present disclosure provides a multi-purpose heat sink, a method of manufacturing the same, a board card, and a multi-purpose heat sink platform, where the multi-purpose heat sink is composed of a bracket (310) and heat dissipation components. The cost of the multi-purpose heat sink in the present disclosure is low.