Systems and techniques are described that provide for enhanced gain and radiation characteristics of antennas. The systems and techniques employ layers or cards of fractal plasmonic surfaces to provide gain to the antennas. The fractal plasmonic surfaces each include a close-packed arrangements of resonators having self-similar or fractal shapes, which may be referred to as “fractal cells.” The cards can be held by a frame adapted to fit an antenna. The FPS cards can provide benefits for gain, field emission, directivity, increased bandwidth, power delivery, and/or heat management. One or more dielectric layers or cards may be used to enhance gain and/or directivity characteristics.

Systems according to the present disclosure provide one or more surfaces that function as power radiating surfaces for which at least a portion of the radiating surface includes or is composed of “fractal cells” placed sufficiently closed close together to one another so that a surface wave causes near replication of current present in one fractal cell in an adjacent fractal cell. The fractal cells may lie on a flat or curved sheet or layer and be composed in layers for wide bandwidth or multibandwidth transmission. The area of a surface and its number of fractals determines the gain relative to a single fractal cell. The boundary edges of the surface may be terminated resistively so as to not degrade the cell performance at the edges. The fractal plasmonic surfaces can be utilized to facilitate electrical conduction with lower ohmic resistance than would otherwise be possible in the absence of the fractal plasmonic surface(s) at the same temperature.

Systems according to the present disclosure provide one or more surfaces that function as power radiating surfaces for which at least a portion of the radiating surface includes or is composed of “fractal cells” placed sufficiently closed close together to one another so that a surface wave causes near replication of current present in one fractal cell in an adjacent fractal cell. The fractal cells may lie on a flat or curved sheet or layer and be composed in layers for wide bandwidth or multibandwidth transmission. The area of a surface and its number of fractals determines the gain relative to a single fractal cell. The boundary edges of the surface may be terminated resistively so as to not degrade the cell performance at the edges. The fractal plasmonic surfaces can be utilized to facilitate electrical conduction with lower ohmic resistance than would otherwise be possible in the absence of the fractal plasmonic surface(s) at the same temperature.

A heat-radiating substrate with a high insulation-withstand voltage and an excellent heat-radiating property is provided. The heat-radiating substrate includes: a metal base material; a metal thin layer formed over the metal base material and having a hardness higher than a hardness of the metal base material; and a ceramic layer over the metal thin layer. Alternatively, the heat-radiating substrate includes, instead of the metal thin layer, a hardened layer serving as a surface layer of the metal base material and having a hardness higher than the hardness of the metal base material. The metal thin layer and the hardened layer are able to enhance compressive stress or prevent release of the compressive stress generated in the ceramic layer by a mechanical impact applied to the ceramic layer.

A pin-shaped first heat radiating fin low in fluid resistance is disposed in a region required to be high in cooling performance, and a second heat radiating fin high in fluid resistance of a shape in which a plurality of columns of grooves which each meander in zigzag at a narrow pitch are arranged side by side is disposed in a region only necessary to be low in cooling performance. Furthermore, the first and second heat radiating fins are installed in parallel to a direction of flow of refrigerant.

A heat dissipation device includes a main body and at least one heat conduction member. The main body has a top face. A periphery of the top face has a connection section. One end of the heat conduction member is correspondingly in contact and connection with the top face or the connection section. By means of the structure design of the present invention, the horizontal heat dissipation effect is greatly enhanced and the heat dissipation effect of the entire heat dissipation device is greatly enhanced.

In one embodiment, a fluid transfer film for transferring a fluid comprises an extruded polymer layer having a thickness less than 5 millimeters; an input side and an output side where the fluid flows in a flow direction through an active region from the input side to the output side; and more than 10 fluid channels defined by interior surfaces within the extruded polymer layer formed during in an extrusion process, each fluid channel of the more than 10 fluid channels is separated spatially in at least 1 row in a thickness direction of the fluid transfer film, the more than 10 fluid channels have a channel density across the active region greater than 5 fluid channels per centimeter, wherein the interior surfaces defining the more than 10 fluid channels are hydrophilic, and the fluid flows through the more than 10 fluid channels by at least capillary action.

A cooling system for an electronic circuit package is provided. The cooling system includes a heat transfer plate positioned in thermal contact with an electronic circuit package surface and forming the bottom surface of an evaporative region of the cooling system. The cooling system also includes a plurality of condensing tubes in fluid communication with, and extending away from, the evaporative region, such that the evaporative region and the condensing tubes together form a single, uninterrupted, sealed enclosure. The cooling system also includes a fluid within the sealed enclosure. The cooling system also includes a plurality of spacers filling gaps between the heat transfer plate and the condensing tubes, such that each spacer is configured as an independent component to allow the passage of fluid through the interior space of each spacer. The cooling system also includes a plurality of wicks, where each wick is positioned partially within a corresponding spacer to which it is fluidically coupled.

A cold plate includes: a base plate including a plurality of fins aligned in parallel; and a cover that covers the plurality of fins and that forms an internal space between the base plate and the cover. The plurality of fins includes: a first fin group in which a plurality of first fins having a first width are disposed on the base plate with a fixed gap in a parallel direction between each of the first fins and a second fin group in which a plurality of second fins having a width wider than the first width are disposed on the base plate with the fixed gap in the parallel direction between each of the second fins. The second fin group is disposed on both sides of the first fin group.

A support assembly for attaching a heat exchanger to a frame of a machine. The support assembly including a clip having one or more attachment features for attaching to the frame and a support member disposed between a first fin portion and a second fin portion of the heat exchanger. The support member disposed between the clip and the tube member to at least partially surrounds a perimeter of the tube member and form a seal therewith.