A heat exchanger with a monocoque structure transfers heat between a first fluid and a second fluid. The heat exchanger has a plurality of tubes through which the first fluid may flow in a direction, each of the plurality of tubes has a first mouth end, an opposing second mouth end and a waist region between the first mouth end and the second mouth end. The heat exchanger also has one or more intercomlected fluid challllels through which the second fluid may flow. the one or more fluid chamlels lay generally in a plane, the plurality of tubes and the one or more fluid channels interleave such that heat may be transferred between the plurality of tubes and the one or more fluid challllels, and the direction of flow of the first fluid is generally perpendicular to the plane of the one or more fluid chamlels.

The invention provides in one embodiment a heat exchanger module (1) comprising a) a flexible support (100); b) at least one tubular member (200) having its main axis substantially parallel with the plane of the flexible support (100); c) a conductive flexible matrix (300) embedding the at least one tubular member (200); and d) a flexible case (400) enwrapping the flexible support (100), the at least one tubular member (200) and the conductive flexible matrix (300). A coating for a built environment comprising a plurality of heat exchanger modules (1) can be implemented, as well as a system further including pumping means (600). The invention also foresees a method for providing heat exchange processes between the heat exchanger module (1), the coating or the system of the invention and a built environment.

A heat dissipation structure includes a heat dissipation portion and a heat storage portion. The heat dissipation portion has the heat receiving surface including the contact surface in contact with the semiconductor generating the heat, and dissipates the heat of the semiconductor in contact with the contact surface. The heat storage portion is arranged to sandwich the semiconductor. The heat storage portion has, for example, the heat storage opening portion in which the semiconductor is positioned, and surrounds the semiconductor. The heat storage portion is provided to he in contact with the heat receiving surface, and stores the heat of the semiconductor conducted through the heat dissipation portion.

A heat dissipation structure includes a heat dissipation portion and a heat storage portion. The heat dissipation portion has the heat receiving surface including the contact surface in contact with the semiconductor generating the heat, and dissipates the heat of the semiconductor in contact with the contact surface. The heat storage portion is arranged to sandwich the semiconductor. The heat storage portion has, for example, the heat storage opening portion in which the semiconductor is positioned, and surrounds the semiconductor. The heat storage portion is provided to he in contact with the heat receiving surface, and stores the heat of the semiconductor conducted through the heat dissipation portion.

A cooling system for an information handling system in a portable chassis comprises a vapor chamber for transferring heat away from components, a porous heat exchanger for receiving heat from the vapor chamber, an air pump of receiving airflow at a first air pressure and generating a second airflow at a second air pressure greater than the first airflow. The porous heat exchanger may comprise one of a plurality of sides of an internal air chamber configured to allow the air pump to generate the second air pressure two to three orders of magnitude greater than the first air pressure. An air pump such as a piezoelectric air pump can generate airflow at a pressure that is two to three orders of magnitude greater than possible using a traditional blower.

A regulating method for a heating and/or cooling system uses at least one load circuit (6), through which a fluid as a heat transfer medium flows and switches the at least one load circuit (6) on and off in dependence on a room temperature in a room to be thermally regulated by the at least one load circuit (6). A feed temperature (T.sub.mix) of the fluid fed to the at least one load circuit (6) is set in dependence on the relative switch-on duration (D) of the at least one load circuit (6). A manifold device is also provided for a heating and/or cooling system with a control device for carrying out such a regulating method.

At least some aspects of the present disclosure feature a tubular convective device, comprising: a blown film forming a tube when inflated, the blown film having a first portion and a second portion, wherein the first portion and the second portion are separated longitudinally, and a plurality of apertures disposed on the first portion of the blown film. At least some aspects of the present disclosure feature a tubular convective system including a plurality of tubular convective devices, where adjacent tubular convective devices are connected.

A cooling apparatus includes first and second wedges, a solid thermal interface material (TIM) and a flexible force-exerting element. The first wedge has a first flat surface and a first diagonal surface. The first flat surface is configured to dissipate heat from an electronic device. The second wedge has a second flat surface and a second diagonal surface. The second diagonal surface faces the first diagonal surface, and the second flat surface is coupled to a heat sink and configured to dissipate heat thereto. The TIM is disposed between the first and second diagonal surfaces, and is configured to transfer heat between the first and second wedges. The force-exerting element is configured to move the first wedge or the second wedge, so as to slide the first diagonal surface or the second diagonal surface on the TIM and push the second flat surface against the heat sink.

A cooling apparatus includes first and second wedges, a solid thermal interface material (TIM) and a flexible force-exerting element. The first wedge has a first flat surface and a first diagonal surface. The first flat surface is configured to dissipate heat from an electronic device. The second wedge has a second flat surface and a second diagonal surface. The second diagonal surface faces the first diagonal surface, and the second flat surface is coupled to a heat sink and configured to dissipate heat thereto. The TIM is disposed between the first and second diagonal surfaces, and is configured to transfer heat between the first and second wedges. The force-exerting element is configured to move the first wedge or the second wedge, so as to slide the first diagonal surface or the second diagonal surface on the TIM and push the second flat surface against the heat sink.

A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.