Patent classifications
F28F13/00
Compressed gas storage unit
Embodiments of the present invention relate to compressed gas storage units, which in certain applications may be employed in conjunction with energy storage systems. Some embodiments may comprise one or more blow-molded polymer shells, formed for example from polyethylene terephthalate (PET) or ultra-high molecular weight polyethylene (UHMWPE). Embodiments of compressed gas storage units may be composite in nature, for example comprising carbon fiber filament(s) wound with a resin over a liner. A compressed gas storage unit may further include a heat exchanger element comprising a heat pipe or apparatus configured to introduce liquid directly into the storage unit for heat exchange with the compressed gas present therein.
APPARATUS FOR HEAT DISSIPATION AND USE OF SUCH APPARATUS
An apparatus for heat dissipation is provided comprising a heat source, a heat sink and a heat conducting element, wherein the heat conducting element conducts heat energy from the heat source to the heat sink along a heat conducting path, and wherein the heat conducting element is arranged in such a way on the heat source and the heat sink and is configured to physically change in such a way with increasing temperature of the heat conducting element that a) a first cross-sectional area between the heat source and the heat conducting element and/or a second cross-sectional area between the heat conducting element of the heat sink increases, and/or b) a length of the heat conducting path shortens. Further, a video endoscope having such an apparatus and a use of such an apparatus are disclosed.
APPARATUS FOR HEAT DISSIPATION AND USE OF SUCH APPARATUS
An apparatus for heat dissipation is provided comprising a heat source, a heat sink and a heat conducting element, wherein the heat conducting element conducts heat energy from the heat source to the heat sink along a heat conducting path, and wherein the heat conducting element is arranged in such a way on the heat source and the heat sink and is configured to physically change in such a way with increasing temperature of the heat conducting element that a) a first cross-sectional area between the heat source and the heat conducting element and/or a second cross-sectional area between the heat conducting element of the heat sink increases, and/or b) a length of the heat conducting path shortens. Further, a video endoscope having such an apparatus and a use of such an apparatus are disclosed.
AIR-COOLED RADIATOR
An radiator includes a radiator body. A first side of the radiator body defines an arc-shaped heat conducting surface. A second side of the radiator body defines a heat dissipating tooth area. The heat dissipating tooth area includes a middle heat dissipating tooth area and two trunk heat dissipating tooth areas symmetrically arranged on two sides of the middle heat dissipating tooth area. A plurality of first heat dissipating fins is arranged in the middle heat dissipating tooth area. Each of the trunk heat dissipating tooth areas includes a trunk and a plurality of second heat dissipating fins. Each trunk is obliquely arranged on the radiator body. The plurality of second heat dissipating fins is arranged on one side of a corresponding trunk away from the plurality of first heat dissipating fins.
Heat exchanger with dummy tubes
Heat exchanger comprising a pair of headers and a plurality of parallel and coplanar tubes interconnecting the headers, wherein each header comprises a header plate provided with a plurality of slots, in each of which an end of a respective tube is fitted, and wherein the heat exchanger is configured to prevent fluid from flowing into at least one tube, hereinafter dummy tube, arranged at a boundary between functionally different sections of the heat exchanger. The slot of the header plate which receives the end of the respective dummy tube is formed as a blind recess in the header plate.
HEAT PIPE HEAT FLUX RECTIFIER
Embodiments for a heat pipe heat flux rectifier are provided. One embodiment includes a first curved diode heat pipe that includes an adiabatic section that includes a curved portion, an evaporator section that is coupled to the adiabatic section, and a condenser section that is coupled to the adiabatic section. In some embodiments, the first curved diode heat pipe includes a non-condensable gas reservoir that is coupled to the condenser section for storing non-condensable gas, where the first curved diode heat pipe stores a fluid and a wicking material. In some embodiments, the first curved diode heat pipe operates as a thermal conductor when heat is applied to the evaporator section and as a thermal insulator when heat is applied to the condenser section.
System and method for cooling a leading edge of a high speed vehicle
A hypersonic aircraft includes one or more leading edge assemblies that are designed to cool the leading edge of certain portions of the hypersonic aircraft that are exposed to high thermal loads, such as extremely high temperatures and/or thermal gradients. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. A coolant supply provides a flow of cooling fluid to a porous tip that is joined to the forward end of the outer wall and defines variable porosity and/or internal barriers to direct a flow of cooling fluid to the regions of the leading edge experiencing the highest thermal loading.
HEAT TRANSFER ASSEMBLIES
A heat transfer assembly for transferring heat from a heat generating electrical element and having a porous element having a portion configured to contact the heat generating element and a moveable diaphragm having a portion adjacent the porous element and where the diaphragm is moveable between an extended position towards the porous element and a retracted position away from the porous element.
REFRIGERATION APPLIANCE WITH A HEAT EXCHANGING ELEMENT
A refrigeration appliance includes a refrigeration circuit having a condenser and a heat circulation system for heating an element of the refrigeration appliance. The heat circulation system includes a heat conducting region. A heat exchanging element includes the condenser and the heat conducting region. The condenser and the heat conducting region in the heat exchanger element are thermally coupled in order to output heat from the refrigeration circuit to the heat conducting region of the heat circulation system.
Devices for modulation of temperature and light based on phase change materials
Devices that incorporate phase change materials in containment vessels promote conduction of thermal energy between the phase change materials within the containment vessels and the surrounding air. In some embodiments, the containment vessels are transparent to enable visual awareness of the operation and functionality of the PCMs. In some embodiments, the containment vessels are design to passively promote air flow across the surfaces of the containment vessels. In some embodiments, the containment vessels include embedded structures to promote the conduction of thermal energy to and from the interior of the containment vessel. In some of these embodiments, the intent is to target the location of crystal ‘seeds’ and control crystal growth, thus gaining greater control over thermal transfer.