Devices that incorporate phase change materials in containment vessels promote conduction of thermal energy between the phase change materials within the containment vessels and the surrounding air. In some embodiments, the containment vessels are transparent to enable visual awareness of the operation and functionality of the PCMs. In some embodiments, the containment vessels are design to passively promote air flow across the surfaces of the containment vessels. In some embodiments, the containment vessels include embedded structures to promote the conduction of thermal energy to and from the interior of the containment vessel. In some of these embodiments, the intent is to target the location of crystal ‘seeds’ and control crystal growth, thus gaining greater control over thermal transfer.

A component coupling system for controllable heat transfer from or to a component which is heated by an external and/or internal heat source and is disposed adjacent to a cooler. The component coupling system includes a carrier plate, on which least one first means for spacing is disposed such that a component disposed on the means for spacing and the carrier plate, together with the means for spacing, form a first cavity. If needed, this cavity can be evacuated, filled with a fluid medium, or have a fluid medium flow through it, whereby the heat transfer or the heat dissipation from the component can be controlled in a simple manner.

A thermal stand-off includes a rigid thermal stand-off section within a spatial region that extends along a distance between a first location and second, opposed location. The rigid thermal stand-off section includes a tortuous solid-wall thermal conduction path that extends from the first location to the second location. The tortuous solid-wall thermal conduction path is longer than the distance of the spatial region. The tortuous solid-wall thermal conduction path can include a tensile spring constant that is greater than a maximum tensile spring constant of a coil spring that fits in the same spatial region and is formed of the same material composition. The tortuous solid-wall thermal conduction path can include an antegrade section and, relative the antegrade section, a retrograde section.

A thermal stand-off includes a rigid thermal stand-off section within a spatial region that extends along a distance between a first location and second, opposed location. The rigid thermal stand-off section includes a tortuous solid-wall thermal conduction path that extends from the first location to the second location. The tortuous solid-wall thermal conduction path is longer than the distance of the spatial region. The tortuous solid-wall thermal conduction path can include a tensile spring constant that is greater than a maximum tensile spring constant of a coil spring that fits in the same spatial region and is formed of the same material composition. The tortuous solid-wall thermal conduction path can include an antegrade section and, relative the antegrade section, a retrograde section.

The panel unit includes a first panel, a second panel facing the first panel with a space provided therebetween the first panel and the second panel, a partition separating the space from a surrounding space, and a switching mechanism. The switching mechanism is located in the space for allowing a change in thermal conductivity between the first panel and the second panel. The switching mechanism includes at least one connector which is thermally conductive, and is switchable between a first state in which the at least one connector is out of contact with the first panel or the second panel and a second state in which the at least one connector is in contact with both the first panel and the second panel.

A system and method of cooling and ventilating for an electronics cabinet is disclosed. In a particular embodiment, the system includes a cooling unit and a distribution unit in communication with the cooling unit to blow supply air through at least one main supply line. The system further includes at least one supply branch line connected to the at least one main supply line, at least one cabinet supply line connected to the at least one supply branch line, and at least one cabinet having an inlet port and an exit port, wherein the at least one cabinet supply line is connected to the inlet port. In addition, the system includes at least one cabinet return line connected to the exit port and a main return line to receive air exiting from the at least one cabinet, wherein the main return line is in communication with the cooling unit.

A heat exchanger includes a cooling air conduit having multiple baffles, a hot air conduit having multiple passes through the cooling air conduit and forming multiple intersections with the baffles, and multiple perforations extending through the baffles. A cooling air flow passes through the baffles, rather than strictly between the baffles, and improves heat-transfer characteristics of the heat exchanger.

A passive heat switch device is disclosed that includes a casing defining a closed channel, as well as a passive thermal actuator and liquid slug positioned inside the closed channel. The closed channel includes a heat conducting region made of a heat conducting material and an insulating region made of an insulating material. The passive thermal actuator is thermally coupled to the heat conducting material of the heat conducting region and extends into the insulating region of the closed channel. The passive thermal actuator deforms when an actuator temperature falls within a switching temperature range. The liquid slug is positioned within the closed channel and contacts at least a portion of the passive thermal actuator and the closed channel and is configured to move along the closed channel between the insulating region and the thermally conductive region in response to deformation of the passive thermal actuator.

A passive heat switch device is disclosed that includes a casing defining a closed channel, as well as a passive thermal actuator and liquid slug positioned inside the closed channel. The closed channel includes a heat conducting region made of a heat conducting material and an insulating region made of an insulating material. The passive thermal actuator is thermally coupled to the heat conducting material of the heat conducting region and extends into the insulating region of the closed channel. The passive thermal actuator deforms when an actuator temperature falls within a switching temperature range. The liquid slug is positioned within the closed channel and contacts at least a portion of the passive thermal actuator and the closed channel and is configured to move along the closed channel between the insulating region and the thermally conductive region in response to deformation of the passive thermal actuator.

A heat exchanger is provided. The heat exchanger (40) provides a first plurality of tubes (50) and a second plurality of flow passages (52) which furcate near one of the first (42) and second (44) manifolds into two or more furcated flow passages and subsequently converge to exit the heat exchanger. The plurality of furcated flow passages are intertwined, reducing the distance between flow passages (50,52) containing each fluid therebetween to improve thermal transfer. Further, the furcations create changes of direction of the fluid to re-establish new thermal boundary layers within the flow passages to further reduce resistance to thermal transfer.