Patent classifications
F28F23/00
SPECTRAL AND ANGULAR EMISSION CONTROL BASED TEMPERATURE SENSITIVE RADIATIVE COOLING DEVICE
The present disclosure relates to a radiative cooling device which is sensitive to the ambient temperature and in which the emissivity changes depending on the infrared wavelength range and emission angle, and a method of cooling an object using the radiative cooling device.
WATER REPLENISHMENT DEVICE
A water replenishment device includes a water generator and a container. The water generator includes a seat body, a heat exchanger, and a thermoelectric cooler. The seat body has a fluid channel and a catchment hole. The catchment hole is in fluid communication with the fluid channel, and the fluid channel is configured for an environment airflow to pass therethrough. The heat exchanger is partially located in the fluid channel. The thermoelectric cooler has a cold surface and a hot surface. The cold surface of the thermoelectric cooler is thermally coupled to the heat exchanger. The container has a storage space. The storage space is in fluid communication with the fluid channel via the catchment hole. The thermoelectric cooler is configured to condense the environment airflow to a liquid, and the liquid is configured to be stored in the storage space via the catchment hole.
WATER REPLENISHMENT DEVICE
A water replenishment device includes a water generator and a container. The water generator includes a seat body, a heat exchanger, and a thermoelectric cooler. The seat body has a fluid channel and a catchment hole. The catchment hole is in fluid communication with the fluid channel, and the fluid channel is configured for an environment airflow to pass therethrough. The heat exchanger is partially located in the fluid channel. The thermoelectric cooler has a cold surface and a hot surface. The cold surface of the thermoelectric cooler is thermally coupled to the heat exchanger. The container has a storage space. The storage space is in fluid communication with the fluid channel via the catchment hole. The thermoelectric cooler is configured to condense the environment airflow to a liquid, and the liquid is configured to be stored in the storage space via the catchment hole.
Phase change heat-storing mechanisms for substrates of electronic assemblies
Embodiments of the disclosure relate to an electronic assembly including a substrate having a first surface and a second surface opposite to the first surface and one or more electronic devices bonded to the first surface of the substrate. A first heat-storing region is embedded within the substrate and proximate to the second surface. The first heat-storing region comprises a phase change material encapsulated by an encapsulating layer. A melting temperature of the encapsulating layer is higher than a melting temperature of the phase change material and a maximum operating temperature of the one or more electronic devices. A heat transfer layer is embedded within the substrate and thermally connects the first heat-storing region to the one or more electronic devices.
Phase change heat-storing mechanisms for substrates of electronic assemblies
Embodiments of the disclosure relate to an electronic assembly including a substrate having a first surface and a second surface opposite to the first surface and one or more electronic devices bonded to the first surface of the substrate. A first heat-storing region is embedded within the substrate and proximate to the second surface. The first heat-storing region comprises a phase change material encapsulated by an encapsulating layer. A melting temperature of the encapsulating layer is higher than a melting temperature of the phase change material and a maximum operating temperature of the one or more electronic devices. A heat transfer layer is embedded within the substrate and thermally connects the first heat-storing region to the one or more electronic devices.
Thermal management system
A gas turbine engine includes a turbomachine and a thermal management system. The thermal management system includes a heat source heat exchanger configured to collect heat from the turbomachine during operation; a heat sink heat exchanger; and a thermal transport bus having a heat exchange fluid configured to flow therethrough at a pressure within an operational pressure range. The thermal management system defines an operational temperature range for the heat exchange fluid, the operational temperature range having a lower temperature limit less than about zero degrees Fahrenheit at a pressure within the operational pressure range and an upper temperature limit of at least about 1000 degrees Fahrenheit at a pressure within the operational pressure range.
Thermal management system
A gas turbine engine includes a turbomachine and a thermal management system. The thermal management system includes a heat source heat exchanger configured to collect heat from the turbomachine during operation; a heat sink heat exchanger; and a thermal transport bus having a heat exchange fluid configured to flow therethrough at a pressure within an operational pressure range. The thermal management system defines an operational temperature range for the heat exchange fluid, the operational temperature range having a lower temperature limit less than about zero degrees Fahrenheit at a pressure within the operational pressure range and an upper temperature limit of at least about 1000 degrees Fahrenheit at a pressure within the operational pressure range.
UTILIZATION OF INTERCONNECTIONS IN ELECTRONIC CIRCUITS AS MAGNETOHYDRODYNAMIC PUMPS FOR LIQUID METAL BASED COOLING
An Interconnection integrated MHD pump is used in a liquid metal cooling system to provide a pump to the liquid metal by induced magnetic field and may be connected to main electrical systems of the cooling system for providing the magnetic field. The liquid metal cooling system includes an MHD pump, cooling pad, a radiator, and a fluidic channel. The MHD pump comprises a magnet on at least one side of one of the fluidic channel.
PROCESS AND SYSTEM FOR HEAT EXCHANGE PROCESS
A heat exchange process includes exchanging heat using a working fluid, where the working fluid comprises a mixture of two or more supercritical fluids, and the mixture is adapted to meet requirements of a heat dissipation temperature from extremely low to very high temperatures. The two or more supercritical fluids can be in a supercritical gaseous state.
PROCESS AND SYSTEM FOR HEAT EXCHANGE PROCESS
A heat exchange process includes exchanging heat using a working fluid, where the working fluid comprises a mixture of two or more supercritical fluids, and the mixture is adapted to meet requirements of a heat dissipation temperature from extremely low to very high temperatures. The two or more supercritical fluids can be in a supercritical gaseous state.