A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 3 μm, (D-2) spherical aluminum nitride having a mean size of from 50 to 150 μm, (D-3) boron nitride having a mean size of from 20 to 200 μm.

A thermal management system includes a slurry generator, an injector pump coupled to the slurry generator, a heat exchanger reactor coupled to the injector pump, wherein the heat exchanger reactor is adapted to subject a thermally expendable heat absorption material to a temperature above 60° C. and a pressure below 3 kPa, and wherein the expendable heat absorption material endothermically decomposes into a gaseous by-product. A vapor cycle system is coupled to the heat exchanger reactor and is operatively connected to a thermal load. A thermal energy storage system may be coupled to the vapor cycle system and the thermal load. The thermal energy storage system may isolate the heat exchanger reactor from thermal load transients of the thermal load.

Implementations described herein generally relate to substrate processing equipment and more particularly to methods and compositions for temperature control of substrate processing equipment. In one implementation, a method of cooling a processing chamber component is provided. The method comprises introducing an inert purge gas into a supply reservoir containing a coolant and flowing the treated coolant to a processing chamber component to cool the processing chamber component. The coolant initially comprises deionized water and a water-soluble base.

Implementations described herein generally relate to substrate processing equipment and more particularly to methods and compositions for temperature control of substrate processing equipment. In one implementation, a method of cooling a processing chamber component is provided. The method comprises introducing an inert purge gas into a supply reservoir containing a coolant and flowing the treated coolant to a processing chamber component to cool the processing chamber component. The coolant initially comprises deionized water and a water-soluble base.

A method of heat transfer wherein a flat metal product having a broad face and a temperature upper to 400° C. is put in contact with a fluidized bed of solid particles, the solid particles having a direction of circulation (D), wherein the flat metal product is put in contact with the solid particles so that its broad face is parallel to the direction (D) of circulation of the solid particles and wherein a gas is injected so that the solid particles be in a bubbling regime, the solid particles capturing the heat released by the metal product and transferring the captured heat to a transfer medium. An associated device is also provided.

A method of heat transfer wherein a flat metal product having a broad face and a temperature upper to 400° C. is put in contact with a fluidized bed of solid particles, the solid particles having a direction of circulation (D), wherein the flat metal product is put in contact with the solid particles so that its broad face is parallel to the direction (D) of circulation of the solid particles and wherein a gas is injected so that the solid particles be in a bubbling regime, the solid particles capturing the heat released by the metal product and transferring the captured heat to a transfer medium. An associated device is also provided.

A heat transport fluid includes a base fluid; and solid particles which are dispersed in the base fluid, have an average particle diameter of 200 to 400 nm, and have a potential difference of 35 mV or more from the base fluid, and a heat transport device uses the heat transport fluid.

A heat transport fluid includes a base fluid; and solid particles which are dispersed in the base fluid, have an average particle diameter of 200 to 400 nm, and have a potential difference of 35 mV or more from the base fluid, and a heat transport device uses the heat transport fluid.

Described herein is a perfluorinated aminoolefin compound of general formula (I): CFY═CXN(R.sub.f)CF.sub.2R.sub.f′ where: (a) R.sub.f and R.sub.f′ are (i) independently selected from a linear or branched perfluoroalkyl group having 1-8 carbon atoms, optionally comprising at least one catenated O or N atom, or (ii) bonded together to form a perfluorinated ring structure having 4-8 ring carbon atoms, optionally comprising at least one catenated O atom; and (b) X and Y are (i) independently selected from a perfluoroalkyl group having 1-4 carbon atoms, or (ii) bonded together to form a perfluorinated ring structure having 5-6 ring carbon atoms. Such compounds may be used in heat transfer, foam blowing or immersion cooling applications, or as a working fluid in a Rankine cycle, a coating or lubricant, or as a dielectric fluid. Also disclosed herein is a method for making such compounds.

Described herein is a perfluorinated aminoolefin compound of general formula (I): CFY═CXN(R.sub.f)CF.sub.2R.sub.f′ where: (a) R.sub.f and R.sub.f′ are (i) independently selected from a linear or branched perfluoroalkyl group having 1-8 carbon atoms, optionally comprising at least one catenated O or N atom, or (ii) bonded together to form a perfluorinated ring structure having 4-8 ring carbon atoms, optionally comprising at least one catenated O atom; and (b) X and Y are (i) independently selected from a perfluoroalkyl group having 1-4 carbon atoms, or (ii) bonded together to form a perfluorinated ring structure having 5-6 ring carbon atoms. Such compounds may be used in heat transfer, foam blowing or immersion cooling applications, or as a working fluid in a Rankine cycle, a coating or lubricant, or as a dielectric fluid. Also disclosed herein is a method for making such compounds.