A method (19) of cooling a heat generating device (2) where the cooling rate (17, 18) of the heat generating device (2) is determined using the rate of change of the temperature (16) of the heat generating device (2).

An air-liquid heat exchanger assembly for an environmental control system of an aircraft includes a heat exchanger, a controller, and a bypass valve. The heat exchanger includes a first chamber and a second chamber. The first chamber has a first inlet that is provided a liquid and a first end that is provided air. The second chamber is arranged adjacent the first chamber. The bypass valve is operably coupled to the controller. The bypass valve having an inlet coupled to a first outlet of the first chamber, a first outlet coupled to a second inlet of the second chamber, and a second outlet coupled to a bypass conduit. The controller adjusts a position of the bypass valve to control the flow of liquid through the second chamber and the bypass conduit.

There is provided a control system of a chemical heat accumulator which enables to facilitate small-sizing of the chemical heat accumulator by carrying out heat release and heat accumulation according to a degree of priority by appropriately selecting a location of carrying out the heat release and heat accumulation on priority basis. A chemical heat accumulator includes a valve mechanism which makes a plurality of reactors communicate separately with a reservoir, and cuts off the plurality of reactors from the reservoir. When both reactors are in a state in which an exothermic reaction between a reaction material and a reaction medium is possible, or in a state in which an endothermic reaction in which the reaction medium is desorbed is possible, a controller which controls an opening of a valve mechanism controls the opening of the valve mechanism such that a flow rate of the reaction medium circulated between the first reactor and the reservoir for which a degree of priority of heat release or heat accumulation is high becomes higher than a flow rate of the reaction medium circulated between the second reactor and the reservoir for which the degree of priority of heat release or heat accumulation is low.

A cooling assembly for cooling a processor includes a heat sink base defining a first area and a second area, a plurality of heat sink fins extending from the first area, a thermoelectric cooling module having a cold side and hot side, wherein the cold side is in contact with the second area, and a heat sink module in contact with the hot side. In use, a method includes monitoring a processor parameter selected from processor power consumption and processor temperature, and causing airflow across the plurality of heat sink fins and the heat sink module. The method further includes powering on the thermoelectric cooling module in response to the processor parameter having a value greater than a first threshold value, and powering off the thermoelectric cooling module in response to the processor parameter having a value less than a second threshold value.

A cooling assembly for cooling a processor includes a heat sink base defining a first area and a second area, a plurality of heat sink fins extending from the first area, a thermoelectric cooling module having a cold side and hot side, wherein the cold side is in contact with the second area, and a heat sink module in contact with the hot side. In use, a method includes monitoring a processor parameter selected from processor power consumption and processor temperature, and causing airflow across the plurality of heat sink fins and the heat sink module. The method further includes powering on the thermoelectric cooling module in response to the processor parameter having a value greater than a first threshold value, and powering off the thermoelectric cooling module in response to the processor parameter having a value less than a second threshold value.

This document provides devices and methods for monitoring and maintenance of the temperature of medical reservoirs and boxes in a secure fashion that enables for documentation of a chain of custody and history of temperature while in storage or transit. For example, this document provides devices and methods for monitoring the temperature of blood in phlebotomy tubes or boxes of biological products. In some embodiments of the devices and methods, the temperature of the contents of the medical reservoirs are regulated, modulated, and/or maintained by the devices provided herein.

A plate heat exchanger includes a heat exchanger plate having a heat transfer area and an edge area, extending around the heat transfer area. The heat exchanger plate is a double wall plate formed by two adjoining plates compressed to be in contact with each other. A sensor configured to sense at least one parameter and to produce a signal depending on the parameter includes a sensor probe that is provided between the adjoining plates.

A plate heat exchanger includes a heat exchanger plate having a heat transfer area and an edge area, extending around the heat transfer area. The heat exchanger plate is a double wall plate formed by two adjoining plates compressed to be in contact with each other. A sensor configured to sense at least one parameter and to produce a signal depending on the parameter includes a sensor probe that is provided between the adjoining plates.

A method is provided for forming a biphilic surface on a substrate comprising copper, such as a heat exchanger surface, wherein the method involves forming one or more hydrophilic areas on the surface by reacting those areas with at least one of hydrogen peroxide and ammonium hydroxide to form copper oxide and forming hydrophobic areas on the surface by reacting those areas with ammonium hydroxide solution to form copper hydroxide or by chemical etching with a combination of hydrochloric acid, hydrogen peroxide, and iron chloride. The functional surface can exhibit temporal biphilicity in response to one or more stimuli in high performance heat transfer applications.

An airflow sensor for a heat sink has a first portion having a first electrical point of contact, a second portion have a second electrical point of contact, and a deformable portion made of an electroactive material electrically coupled to the first and second portions. The deformable portion has first electrical properties measured between the first and second electrical points of contact when there is no airflow and the deformable portion is in a first position, and has second electrical properties different than the first electrical properties when a source of airflow blows air against the deformable portion, thereby causing the deformable portion to extend to a second position farther away from the source of airflow than the first position. The airflow sensor can be incorporated into a heat sink for an electronic component.