A thin-type two-phase fluid device includes a first plate body, a second plate body and a polymer layer. The first plate body has a first face, a second face and multiple bosses. The bosses are disposed on the first face and raised therefrom. The second plate body has a nanometer capillary layer on one face. The nanometer capillary layer is formed from a mixture of multiple kinds of powders with different sizes. The nanometer capillary layer is attached to a surface of the second plate body opposite to the first face of the first plate body. The polymer layer is selectively connected with the first plate body or the second plate body. The total thickness of the thin-type two-phase fluid device is equal to or smaller than 0.25 mm, whereby the object of thinning the heat dissipation device is achieved.

A vapor chamber accommodating working fluid and including first plate, second plate, first capillary structure and second capillary structure. First plate has thermal contact surface. Second and first plate are attached to each other so as to allow hermetically sealed space to be formed. Hermetically sealed space accommodates working fluid. Thermal contact surface faces away from hermetically sealed space. First capillary structure is located in hermetically sealed space. First capillary structure includes base portion, first protrusions and second protrusions. Base portion is stacked on first plate. First protrusions and second protrusions protrude from a side of base portion. Second protrusions surround first protrusions. Second capillary structure is located in hermetically sealed space. Second capillary structure is stacked on first protrusions. Distance between first protrusions is smaller than distance between second protrusions. Evaporation space and condensation space are respectively formed on two opposite sides of second capillary structure.

A vapor chamber structure includes an upper plate, a lower plate, a middle layer and a polymer layer. The polymer layer is selectively connected with any of the upper and lower plates. The lower plate and the upper plate are mated with each other to together define a chamber. A working fluid is filled in the chamber. The middle layer is disposed in the chamber. The middle layer has a first face, a second face, multiple perforations and multiple channels. The multiple perforations pass through the first and second faces. The multiple channels are disposed on one of the first and second faces. By means of the above arrangement, the total thickness of the vapor chamber structure is equal to or smaller than 0.25 mm, whereby the vapor chamber can be extremely thinned.

A vapor chamber accommodating working fluid and including first plate, second plate, first capillary structure and second capillary structure. First plate has thermal contact surface. Second and first plate are attached to each other so as to allow hermetically sealed space to be formed. Hermetically sealed space accommodates working fluid. Thermal contact surface faces away from hermetically sealed space. First capillary structure is located in hermetically sealed space. First capillary structure includes base portion, first protrusions and second protrusions. Base portion is stacked on first plate. First protrusions and second protrusions protrude from a side of base portion. Second protrusions surround first protrusions. Second capillary structure is located in hermetically sealed space. Second capillary structure is stacked on first protrusions. Distance between first protrusions is smaller than distance between second protrusions. Evaporation space and condensation space are respectively formed on two opposite sides of second capillary structure.

A water block reinforcement structure includes a substrate and a cover body mated with the substrate to define a heat exchange chamber therebetween. At least one radiating fin assembly and at least one reinforcement section are disposed in the heat exchange chamber. The reinforcement section has an upper end connected with the inner face of the cover body by a connection means.

A liquid-cooling heat dissipation structure includes a substrate and a cover body mated with the substrate to define a heat exchange chamber therebetween. A radiating fin unit and a stop section are disposed in the heat exchange chamber. The stop section serves to first divide a cooling liquid entering the heat exchange chamber, whereby the cooling liquid first flows through the periphery of the radiating fin unit and then flow into the middle of the radiating fin unit so that the cooling liquid is prevented from straightly passing through the radiating fin unit. Multiple cooperative flow-stopping protrusions are disposed in the periphery of the radiating fin unit to help the cooling liquid to uniformly flow through the radiating fin unit. By means of the structural design of the liquid-cooling heat dissipation structure, the heat exchange efficiency is greatly enhanced.

In one embodiment, a system includes a chip package and a cooling apparatus coupled to the chip package. The chip package includes one or more processors, and the cooling apparatus includes a first cavity defined at least partially by a first metal wall and a second metal wall and a second cavity defined at least partially by a flat third metal wall and the second metal wall. An internal pressure of the first cavity is lower than an ambient pressure outside the sealed first cavity. The second cavity includes a liquid disposed therein and wick material coupled to an interior surface of the third wall, and the chip package is positioned such that it coupled to the flat third metal wall of the cooling apparatus.

There is provided a flat heat pipe that is not easily deformed in spite of a reduction in thickness and can maintain high heat transport capacity. A flat heat pipe 100 includes a container 130 in which a cavity 130S is formed by plates 110 (110a, 110b) made of metal and disposed substantially in parallel with each other, working fluid that is enclosed in the cavity 130S, and a wick structure 150 that is inserted into the container. The wick structure 150 includes a first sheet-like member 140, and hollow protruding portions 170 protruding in a height direction of the container 130 are formed on the first sheet-like member 140.

The heat exchanger (2) comprises a stack of plates (4) comprising a lower plate (20) onto which the other plates (22) are stacked. The heat exchanger (2) also comprises a fixation plate (6) and a reinforcement plate (8) between the fixation plate (6) and the lower plate (20). The reinforcement plate (8) has reinforcing elements (24) obtained from a cut and fold of the reinforcement plate (8) material.

A plate heat exchanger includes a pack of superimposed heat exchanger plates, and has two cover plates mounted on the side portions of the first heat exchanger plate. The surface area of each of the two cover plates is smaller than half of the surface area of said first heat exchanger plate.