A vapor chamber includes a first base plate (12), a second base plate (13), and a capillary structure (15). The first base plate (12) and the second base plate (13) are disposed in a stacked manner and fastened to each other, and together form a cavity (11). The capillary structure is disposed on an inner wall of the cavity (11) and a surface of at least one support pillar (120) between the first base plate (12) and the second base plate (13), and the capillary structure (15) is configured to provide capillary force for returning liquid to a working medium. A reinforcement table (127) located in the cavity (11) is disposed between the first base plate (12) and the second base plate (13).

A vapor chamber that includes a casing, a pillar in an internal space of the casing and that supports the casing from an inside thereof, a working fluid in the internal space of the casing, and recessed portions in at least a portion of a main external surface of the casing.

A protection element for vapor chamber includes a main body and a protection element. The main body is divided into a working zone and a sealing zone. The sealing zone is located around an outer periphery of the working zone and is provided with a notch area, to which a fluid-adding and air-evacuating pipe is connected. The protection element is correspondingly mounted to the notch area to contact with the sealing zone of the main body. With the arrangement of the protection element, the fluid-adding and air-evacuating pipe is protected against collision and impact and accordingly, the main body of the vapor chamber is protected against vacuum and working fluid leakage.

A heat exchanger may include a plurality of pipe bodies arranged between two side parts. At least one side part may have at least one predetermined breaking point and at least one heat expansion compensator. The at least one side part may include at least one aperture, which may lead from the at least one predetermined breaking point to the at least one heat expansion compensator.

A loop heat pipe includes a metal layer stack of outermost metal layers and intermediate metal layers. The metal layer stack includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a vapor pipe connecting the evaporator to the condenser, and a liquid pipe connecting the condenser to the evaporator. The vapor pipe includes two pipe walls defining a flow passage of the vapor pipe and joint beams arranged at different positions along the flow passage. Each of the joint beams joins the two pipe walls to each other. Each of the intermediate metal layers includes one of the joint beams. Each of the joint beams includes a side surface that is inclined.

A vapor chamber structure includes a thin-sheet housing with a hollow interior and a composite capillary layer installed in the thin-sheet housing. The composite capillary layer is a metal woven mesh formed by weaving plural metal filaments, and each metal filament of the composite capillary layer is a steel wire having a coating layer on the exterior of the steel wire. By pulling and drawing the steel into a linear shape, a smaller wire diameter is obtained, so that the composite capillary layer will not be broken easily and can be used for making a finer woven mesh which can be installed in a thinner vapor chamber.

In one embodiment, a system includes a chip package and a cooling apparatus coupled to the chip package. The chip package includes one or more processors, and the cooling apparatus includes a first cavity defined at least partially by a first metal wall and a second metal wall and a second cavity defined at least partially by a flat third metal wall and the second metal wall. An internal pressure of the first cavity is lower than an ambient pressure outside the sealed first cavity. The second cavity includes a liquid disposed therein and wick material coupled to an interior surface of the third wall, and the chip package is positioned such that it coupled to the flat third metal wall of the cooling apparatus.

A molding method is provided. The method includes steps of: providing a mold having a male mold forming a column and a female mold forming a cavity; multiple ribs extending along a longitudinal direction of the column are formed on the column; inserting the male mold into the female mold to close the mold to make the column inserted in and separated from an inner surface of the cavity; filling a molten plastic material mixed with metal particles into the cavity so as to make the material fill a space between the column and the cavity; forming a molded heat transfer component covering the column by the solidified plastic material; taking out the molded heat transfer component with the column along the longitudinal direction of the column from the cavity; and separating the molded heat transfer component from the column along the longitudinal direction of the column.

A vapor chamber having a housing that includes a first metal sheet and a second metal sheet which face each other and respective outer edges thereof are joined to each other to form a welded portion; a bead portion in a region of at least one of the first metal sheet and the second metal sheet surrounded by the welded portion in a plan view of the vapor chamber, the bead portion comprising melted and solidified metal from the at least one of the first metal sheet and the second metal sheet; a working fluid encapsulated in the housing; and a wick in or on an inner wall surface of the first metal sheet or the second metal sheet.

A flexible vapor chamber for an electronic device includes an upper cover, a lower cover, an accommodation space, a capillary structure, plural support structures and a working fluid. The upper cover is made of a first flexible material. The lower cover is made of a second flexible material. The accommodation space is arranged between the upper cover and the lower cover. The capillary structure is disposed on the lower cover and accommodated within the accommodation space. The plural support structures are disposed on the upper cover and accommodated within the accommodation space. The plural support structures are contacted with the capillary structure. The working fluid is accommodated within the accommodation space. The flexible vapor chamber is permitted to be subjected to a flexural action in a flexible range. Consequently, the installation of the flexible vapor chamber complies with a shape of the electronic device.