A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member configured to enclose a working fluid; a second planar substrate member configured to enclose the working fluid; a plurality of wicking structures disposed on the first planar substrate; and one or more planar spacers disposed on the second planar substrate. The first planar substrate and the second planar substrate are may be hermetically sealed.

A vapor chamber that includes a casing, a pillar in an internal space of the casing and that supports the casing from an inside thereof, a working fluid in the internal space of the casing, and recessed portions in at least a portion of a main external surface of the casing.

A method of manufacturing a heat exchanger comprising a body and a support embedded within the body. The support comprises a different material and/or a different material structure to the body and hence has at least one material property which is different to that of the body. The method comprises; forming at least a first portion of the support with a first material and a first material structure using a first additive manufacturing step; and forming at least a first portion of the body with a second material and a second material structure using a second additive manufacturing step. The first material is different to the second material and/or the first material structure is different to the second material structure.

Provided is a heat exchanger including a core portion configured to include an inlet header tank and an outlet header tank having a space, in which cooling water is stored and flows, formed therein and formed in a height direction, a plurality of tubes having both ends connected to the header tanks to form a cooling water channel, and fins interposed between the tubes, in which a core portion of the heater exchanger is formed to block only a part of a bypass area of a part where inlet/outlet header tanks are positioned to reduce a pressure loss of air which is a cooled fluid while minimizing a reduction in heat radiation performance of the heat exchanger and structural rigidity of the core portion is increased by a reinforcing structure formed at an outer side of the core portion to improve durability.

A heat dissipation device includes a first casing and a second casing coupled to the first casing. The second casing includes a body having an inner surface and an outer surface opposite the inner surface, and a first portion and a second portion, each of the first and second portions having a different cross-sectional area. The heat dissipation device further includes a plurality of columns on the inner surface, and a first wick structure disposed on the inner surface and in the first portion and the second portion.

In one embodiment, a metal-plated polymer object includes a polymer surface, a first metal layer that has been applied to the polymer surface to render it electrically conductive, and a second metal layer that has been deposited on the first metal layer.

A heat exchanger assembly comprising a frame (10) and a heat exchanger (20), wherein the heat exchanger (20) comprises a core of plates (21) stacked in a first direction, with edges (22) protruding along their outline, characterized in that the frame (10) comprises a retaining element (30) configured to engage plate edges (22) so that the retaining element (30) restricts movement of the heat exchanger (20) with respect to the frame (10) in the first direction, wherein the retaining element (30) comprises an elongated core (31) attached to the frame (10) and plurality of protrusions (32) protruding from this core (31), said protrusions (32) configured to protrude between plate edges (22).

A plate heat exchanger is described comprising a plurality of heat transfer plates 10 stacked on top of each other, wherein gaskets are positioned between adjacent heat transfer plates 10, wherein each gasket is arranged in a gasket groove 20 formed in a heat transfer plate 10 and a bottom part of the gasket groove 20 defines a base level 22, wherein the gasket groove 20 comprises a reinforcing pattern having a first recess 23 at a first recess level and extending in a lengthwise direction of the gasket groove 20. A plate heat exchanger should allow higher pressures without increasing the risk of leakages. To this end the reinforcing pattern comprises a second recess 25 at a second recess level extending in lengthwise direction of the gasket groove 20.

A heat exchanger plate, a plate heat exchanger for evaporation of a first fluid, and a method of making a plate heat exchanger are disclosed. The heat exchanger plate includes a heat exchanger area extending in parallel with an extension plane of the heat exchanger plate, an edge area extending around the heat exchanger area, a number of portholes extending through the heat exchanger area, and a peripheral rim surrounding a first porthole of the number of portholes and extending transversely to the extension plane from a root end to a top end with a rim height perpendicular to the extension plane. The heat exchanger plate includes at least one restriction hole extending through the peripheral rim and having a hole height perpendicular to the extension plane.

Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.