An electric heating device for a motor vehicle has a first housing part which surrounds a first circulation chamber and a second housing part which surrounds a second circulation chamber. The first and second circulation chambers abut against each other. A PTC heating device is interposed between the first and second housing parts. The PTC heating device comprises a first cover element covering the first circulation chamber of the first housing part and a second cover element covering the second circulation chamber of the second housing part. At least one PTC element is provided between the first and the second cover elements. An electrode field is provided on the interior side of each of the respective cover elements and is electrically conductively contacted on the PTC element.

A heat exchanger includes: a heat exchange core portion; and a tank portion connected to the heat exchange core portion. The heat exchange core portion has a connection plate that surrounds a part of the tank portion from an outer peripheral side. The connection plate has slit-shaped openings arranged along an edge of the connection plate in a first direction. A part of the connection plate between each of the openings and the edge is deformable into a concave shape toward the tank portion. A part of the openings has a widened portion at both ends in the first direction. A width dimension of the widened portion in a second direction from the opening to the edge is larger than that of the other portion of the opening.

A heat exchanger assembly including an elongated tubular heat exchanger enclosure defining an interior chamber. A tube sheet is positioned within the interior chamber of the heat exchanger enclosure separating the interior chamber into a shell side and a channel side. The interior portion is configured to removably receive a tube bundle positioned within the shell side of the interior chamber. An annular sleeve member is positioned within the channel side of the interior chamber of the heat exchanger enclosure. An annular elastic torsion member is positioned within the channel side of the interior chamber of the heat exchanger such that the sleeve member is positioned between the tube sheet and the elastic torsion member. The elastic torsion member has an inner circumference deflectable relative to its outer circumference for torsioning the elastic torsion member.

A compact heat exchanger assembly for a refrigeration system includes a heat rejection heat exchanger assembly and a heat absorption heat exchanger assembly. The heat rejection heat exchanger assembly includes a primary heat exchanger and a secondary heat exchanger. The primary heat exchanger has a tube bank extending between a first manifold and a second manifold. The tube bank being provided with at least one bend such that the primary heat exchanger has a generally curvilinear shape. The secondary heat exchanger is disposed between the first manifold and the second manifold.

A double pipe forms an inner flow path, through which a low-pressure side refrigerant flows, inside an inner pipe, and forms an inner-outer flow path, through which a high-pressure side refrigerant flows, between the outer pipe and the inner pipe. It comprises an expansion valve side connector and a counter-expansion valve side connector which are interposed between distal ends of the outer pipe and the inner pipe and members to be connected. An outer diameter of the outer pipe is 30 millimeters or less. A ratio of a difference between an inner diameter of the outer pipe and an outer diameter of the inner pipe with respect to the inner diameter of the outer pipe is 25% or less. A sealing member is provided to prevent a refrigerant leakage. The plurality of members are mechanically fixed.

An HVAC assembly including a base portion that includes a rib outwardly extending therefrom. The base portion and the rib formed of a first material having a first elongation to yield. The blower housing including a collapsible portion that is formed of a second material and fixed to the rib by a bond between the first and second materials. The second material having an elongation to yield that is greater than the first elongation to yield of the first material and is configured to collapse when a force is applied to the collapsible portion.

A heat exchange device may include a first pipe including a first inlet, a first outlet, and a first sidewall extending therebetween; a second pipe including a second inlet, a second outlet, and a second sidewall extending therebetween; and a plurality of dimples extending between the first sidewall and the second sidewall. The second sidewall may surround and extend about the first sidewall, the first sidewall may define a first fluid passage configured to permit flow of a first fluid, and the second sidewall and the first sidewall may define a second fluid passage configured to permit flow of a second fluid.

A gasket for a plate heat exchanger, the gasket comprising a body in the form of a loop for fitting to a plate of the plate heat exchanger, the body including one or more peripheral connection areas spaced along at least one side of the loop, and a plurality of tabs for securing the gasket in position on the plate, each tab being discrete from the body, and each tab including connection means which is receivable by or engageable with one of the connection areas to connect the tabs and body together.

A power module apparatus includes a power module having a package configured to seal a perimeter of a semiconductor device, and a heat radiator bonded to one surface of the package; a cooling device having a coolant passage through which coolant water flows, in which the heat radiator is attached to an opening provided on a way of the coolant passage, wherein the heat radiator of the power module is attached to the opening of the cooling device so that a height (ha) and a height (hb) are substantially identical to each other. The power module in which the heat radiator is attached to the opening formed at the upper surface portion of the cooling device can also be efficiently cooled, and thereby it becomes possible to reduce degradation due to overheating.

A power module apparatus includes a power module having a package configured to seal a perimeter of a semiconductor device, and a heat radiator bonded to one surface of the package; a cooling device comprising a coolant passage through which coolant water flows, in which the heat radiator is attached to an opening provided on a way of the coolant passage, wherein the heat radiator of the power module is attached to the opening of the cooling device so that a height (ha) and a height (hb) are substantially identical to each other. The power module in which the heat radiator is attached to the opening formed at the upper surface portion of the cooling device can also be efficiently cooled, and thereby it becomes possible to reduce degradation due to overheating.