The disclosure provides a liquid cooling heat exchanger, comprising a first cover plate, a second cover plate and a fin, the first cover plate and the second cover plate stacked on each other so as to form a chamber therebetween, the fin disposed within the chamber, the first cover plate made of a composite material, wherein there is a bonding layer between the first cover plate and the second cover plate, and the bonding layer has a melting point lower than melting points of the first cover plate, the second cover plate and the fin. The disclosure also relates to a method for making the liquid cooling heat exchanger.

A manufacturing method of middle member structure includes steps of applying an external force to a plate body to shape the plate body and form multiple recessed/raised structures and perforating the plate body to form multiple perforations misaligned from the recessed/raised structures so as to achieve a plate body with recessed/raised structures. The middle member structure is applicable to a vapor chamber to enhance the vapor-liquid circulation effect and the support for the internal chamber.

Oleophobic and/or philic surface(s) are utilized for oil separation, direction, and/or collection in a refrigeration system. Surfaces of component(s) of a refrigeration system (compressor, oil separator, evaporator, etc.) are produced to be oleophobic or philic. The oleophobic and/or philic surfaces are utilized to direct a flow path of oil within the refrigeration system or to prevent oil connection in an area. Refrigerant phobic and/or lubricant phobic material(s) also may be utilized to help promote separation of refrigerant vapor from refrigerant liquid and/or from oil in refrigeration systems.

A heat sink for use in induction welding includes a number of tiles, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm2/sec. A joint flexibly joins the tiles together.

An aluminum alloy brazing sheet used for brazing in an inert gas atmosphere without using flux includes a core material of aluminum or aluminum alloy, and a brazing material of aluminum alloy including Si of 4.0 mass % to 13.0 mass % and cladding one side surface or both side surfaces of the core material. One or both of the core material and the brazing material includes any one or two or more types of X atoms (X is Mg, Li, Be, Ca, Ce, La, Y, and Zr). The aluminum alloy brazing sheet is a brazing sheet in which oxide particles including the X atoms and having a volume change ratio of 0.99 or lower with respect to an oxide film before brazing heating are formed on a surface thereof, by brazing heating.

A heat exchanger includes a structure that is advantageous in increasing the overall heat transfer coefficient which represents the efficiency of heat exchange. Three flow paths, a first flow path, a second flow path, and a third flow path, which turn spirally in the space formed between an inner cylinder and an outer cylinder are provided. These flow paths are defined by an inner heat transfer body and an outer heat transfer body, and heat exchange is performed through the heat transfer bodies. The heat transfer bodies turn spirally, have a screw shape in an axial cross-sectional view, and are assembled into a screw shape. The flow path area of the first flow path is varied by changing the shapes of a male thread and a female thread, and the second flow path and the third flow path are formed in a spiral shape, allowing for exchange of heat through the heat transfer bodies.

A method includes providing a first metal sheet and a second metal sheet, printing a channel pattern on the first metal sheet, bonding the first metal sheet and the second metal sheet to each other, forming a plurality of channels by introducing a fluid between the first metal sheet and the second metal sheet, introducing working fluid in the plurality of channels, sealing the first metal sheet and the second metal sheet, and forming a plurality of through holes in locations where the first metal sheet and the second metal sheet are bonded to each other. The plurality of through holes are arranged in a plurality of rows, each row including at least two through holes, and each location where the first metal sheet and the second metal sheet are bonded to each other includes a single through hole of the plurality of through holes.

A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.

A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.

Provided is a heat sink having a clad structure of Co—Mo composite materials and Cu materials, satisfying high heat-sink properties required of the heat sink for use in a semiconductor package with a frame on which a high-output and small-sized semiconductor is mounted, and preventing, when applied to the semiconductor package with a frame, crack of the frame due to local stress concentration. The heat sink has three or more Cu layers and two or more Cu—Mo composite layers alternately stacked in a thickness direction so that the Cu layers are outermost layers on both sides thereof, the Cu layers as the outermost layers each having a thickness t.sub.1 of 40 μm or more, the heat sink satisfying 0.06≤t.sub.1/T≤0.27 (where T: heat sink thickness) and t.sub.2/T≤0.36/[(total number of layers−1)/2] (where t.sub.2: Cu—Mo composite layer thickness, the total number of layers: sum of numbers of Cu layers and Cu—Mo composite layers).