One variation of a method for fabricating a dermal heatsink includes: fabricating a substrate defining an interior surface, an exterior surface opposite the interior surface, and an open network of pores extending between the interior surface and the exterior surface; activating surfaces of the substrate and walls of the open network of pores; applying a coating over the substrate to form a heatsink, the coating comprising a porous, hydrophilic material and defining a void network; removing an excess of the coating from the substrate to clear blockages within the open network of pores by the coating; hydrating the heatsink during a curing period; heating the heatsink during the curing period to increase porosity of the coating applied over surfaces of the substrate; and rinsing the heatsink with an acid to decarbonate the coating along walls of the open network of pores in the substrate.

A heat sink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having a fractal variation therebetween, wherein the heat transfer fluid is induced to flow with respect to the plurality of fractally varying heat exchange elements such that flow-induced vortices are generated at non-corresponding locations of the plurality of fractally varying heat exchange elements, resulting in a reduced resonance as compared to a corresponding heat exchange device having a plurality of heat exchange elements that produce flow-induced vortices at corresponding locations on the plurality of heat exchange elements.

A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.

The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The titanium thermal ground plane may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages.

A heat-dissipation substrate structure with high adhesive strength is provided. The heat-dissipation substrate structure includes a heat-dissipation base layer, a functional layer, and a matching layer. The functional layer is formed by sputtering, and has a single layer structure or a multi-layer structure. A thickness of each layer of the functional layer is less than 3 μm. The matching layer has a single layer structure or a multi-layer structure, and a thickness of each layer of the multi-layer structure of the matching layer is less than 1 μm. The matching layer is formed by sputtering of one or any two of titanium, titanium alloy, nickel, and nickel alloy. The functional layer and the heat-dissipation base layer are two heterogeneous metal layers, and the matching layer is located between the functional layer and the heat-dissipation base layer.

A method for creating a sandwich panel heat pipe is disclosed. A three-dimensional ordered micro-truss core comprising a plurality of periodically disposed unit cells comprising an open-cellular microstructure and a free space defined by the open-cellular microstructure wherein the core comprises a vapor region and a liquid region separated by a mesh structure. A first face sheet and a second face sheet are stacked with the three-dimensional ordered micro-truss core to form a heat pipe assembly with the mesh structure in the three-dimensional ordered micro-truss core being planar and substantially parallel to the first face sheet and the second face sheet. The first and second face sheets are bonded to enclose the three-dimensional ordered micro-truss core wherein the free space of the three-dimensional ordered micro-truss core between the first and second face sheets is filled with a working fluid through an inlet and the inlet is sealed.

The present invention provides a heat storage member which is excellent in a heat storage property and of which a chronological change in a tint is suppressed. A heat storage member according to an embodiment of the present invention includes a heat storage sheet containing a microcapsule encompassing a heat storage material, and a colored layer.

In one embodiment, a thermal management device includes a heat sink base and heat sink fins comprising a single element formed from a plurality of graphene layers with carbon nanotubes interposed between the graphene layers. A method is also disclosed herein.

An air thermal conditioning system for at least one of heating air and cooling air. The air thermal conditioning system comprises one or more heat exchanger units that include at least one fluid chamber defined by first and second multilayer sheets. The first and second multilayer sheets each comprise an inner layer defining the at least one fluid chamber; a middle layer; and an outer layer that defines external opposing faces of the heat exchanger unit, the middle layer disposed between the inner layer and outer layer.

A microchannel heat exchanger (MCHX) includes an air-passage layer including a plurality of air-passage microchannels, a working fluid layer including a plurality of working fluid microchannels, and a sealing layer coupled to the working fluid layer to provide a working/sealing layer set. The working/sealing layer set includes an arrangement of raised pedestals. The raised pedestals may extend from the working fluid layer to the sealing layer and contact the sealing layer.