Patent classifications
G01B9/00
Method to requalify die after storage
A method of requalifying a die after storage under this disclosure could be said to include the steps of running production parts on a die, stopping production for a period of time, taking a pre-storage 3D scan of the die, storing the die for a period of time, taking a post storage 3D scan of the die, comparing the post storage 3D scan information to the pre-storage 3D scan information, and requalifying the die for use in production should the post storage 3D scan be found to be sufficiently close to the pre-storage 3D scan.
Method to requalify die after storage
A method of requalifying a die after storage under this disclosure could be said to include the steps of running production parts on a die, stopping production for a period of time, taking a pre-storage 3D scan of the die, storing the die for a period of time, taking a post storage 3D scan of the die, comparing the post storage 3D scan information to the pre-storage 3D scan information, and requalifying the die for use in production should the post storage 3D scan be found to be sufficiently close to the pre-storage 3D scan.
Substrate processing system and state monitoring method
A substrate processing system includes a substrate processing apparatus configured to process a substrate, a substrate transfer mechanism including a substrate holder configured to hold the substrate, an imaging device provided in the substrate transfer mechanism and configured to image a monitoring target member inside the substrate processing apparatus, and a controller. The controller is configured to cause the imaging device to image multiple portions of the monitoring target member, including a central portion facing a center of the substrate during processing and a peripheral edge portion facing a peripheral edge side of the substrate during the processing, by moving the substrate holder, and calculate, for each of the multiple portions of the monitoring target member, a physical amount indicating a state of the corresponding portion based on an imaging result.
Substrate processing system and state monitoring method
A substrate processing system includes a substrate processing apparatus configured to process a substrate, a substrate transfer mechanism including a substrate holder configured to hold the substrate, an imaging device provided in the substrate transfer mechanism and configured to image a monitoring target member inside the substrate processing apparatus, and a controller. The controller is configured to cause the imaging device to image multiple portions of the monitoring target member, including a central portion facing a center of the substrate during processing and a peripheral edge portion facing a peripheral edge side of the substrate during the processing, by moving the substrate holder, and calculate, for each of the multiple portions of the monitoring target member, a physical amount indicating a state of the corresponding portion based on an imaging result.