The present description includes a flexible sensor including a flexible substrate, a thermoelectric substrate formed on the flexible substrate, a first metal electrode that is formed on the flexible substrate and is connected to one end of the thermoelectric body, and a second metal electrode that is formed on the flexible substrate and is connected to another end of the thermoelectric body but spaced apart from the first metal electrode. The flexible sensor simply measures the temperature and the flow velocity with high accuracy. The change in temperature and flow velocity may be measured in real time. In addition, the flexible sensor may measure the temperature and the flow velocity of a fluid even when attached to a curved surface, and self-development is possible by the measurement.

The present description includes a flexible sensor including a flexible substrate, a thermoelectric substrate formed on the flexible substrate, a first metal electrode that is formed on the flexible substrate and is connected to one end of the thermoelectric body, and a second metal electrode that is formed on the flexible substrate and is connected to another end of the thermoelectric body but spaced apart from the first metal electrode. The flexible sensor simply measures the temperature and the flow velocity with high accuracy. The change in temperature and flow velocity may be measured in real time. In addition, the flexible sensor may measure the temperature and the flow velocity of a fluid even when attached to a curved surface, and self-development is possible by the measurement.

A temperature sensing unit is provided, which includes a temperature sensor for measuring a temperature of an object and a mounting member. The mounting member is elastic and is attached to the temperature sensor for securing the temperature sensor around the object, and the temperature sensor in one form defines a first thermocouple ribbon and a second thermocouple ribbon with a very low profile and high temperature capability.

A sheathed thermocouple includes thermocouple wires; a metal sheath accommodating the thermocouple wires; inorganic insulating material powder filled in an internal space of the metal sheath; a glass seal part tightly sealing an opening of the metal sheath while allowing the thermocouple wires to pass; compensation lead wires connected to the thermocouple wires; a metal sleeve having a cylindrical shape having a leading end part defining a connecting section connected with an outer peripheral surface of the metal sheath, and allowing a portion of the metal sheath closer to a proximal end than the connecting section, the thermocouple wires and the compensation lead wires to be in an internal space, the thermocouple wires and the compensation lead wires lying without contact between themselves; and a glass filler part made of a glass having a lower softening temperature than the glass seal part, and filling an internal space of the metal sleeve.

Thermocouple assemblies for high temperature applications are provided. The thermocouple assembly includes a protection tube; and a thermocouple probe within the protection tube. The thermocouple probe includes a cable connector at a first end and extending along a longitudinal axis to a free second end. A protective housing assembly, which extends around the thermocouple probe, extends from the cable connector to a tapered end of the protective housing assembly. The protective housing assembly includes an installation unit having a fixed transition joint. An oversheath extends between the installation unit and the tapered end. The free second end of the thermocouple probe extends along the longitudinal axis beyond the tapered end of the oversheath.

In some examples, a temperature distribution sensor may include a laser source to emit a laser beam that is tunable to a first wavelength and a second wavelength for injection into a device under test (DUT). A first wavelength optical receiver may convert a return signal corresponding to the first wavelength with respect to Rayleigh backscatter or Raman backscatter Anti-Stokes. A second wavelength optical receiver may convert the return signal corresponding to the second wavelength with respect to Rayleigh backscatter or Raman backscatter Stokes. Bending loss associated with the DUT may be determined by utilizing the Rayleigh backscatter signal corresponding to the first wavelength and the Rayleigh backscatter signal corresponding to the second wavelength. Further, temperature distribution associated with the DUT may be determined by utilizing the Raman backscatter Anti-Stokes signal corresponding to the first wavelength and the Raman backscatter Stokes signal corresponding to the second wavelength.

In some examples, a temperature distribution sensor may include a laser source to emit a laser beam that is tunable to a first wavelength and a second wavelength for injection into a device under test (DUT). A first wavelength optical receiver may convert a return signal corresponding to the first wavelength with respect to Rayleigh backscatter or Raman backscatter Anti-Stokes. A second wavelength optical receiver may convert the return signal corresponding to the second wavelength with respect to Rayleigh backscatter or Raman backscatter Stokes. Bending loss associated with the DUT may be determined by utilizing the Rayleigh backscatter signal corresponding to the first wavelength and the Rayleigh backscatter signal corresponding to the second wavelength. Further, temperature distribution associated with the DUT may be determined by utilizing the Raman backscatter Anti-Stokes signal corresponding to the first wavelength and the Raman backscatter Stokes signal corresponding to the second wavelength.

A method of measuring a temperature of a part during an assembly process comprises reading the temperature via a reference block that is independently exposed to a same heat source as the part to be monitored.

Temperature locale sensors include an enclosure defining a sealed volume with a phase-change material therein at a known pressure. The phase-change material is formulated to exhibit a gas-to-solid phase change, without condensing to a liquid phase, at the known pressure and a targeted temperature, i.e., the material's “deposition temperature.” The phase-change material—while at least partially in gaseous form, either initially or after sublimation—is exposed to an environment with temperatures varying by location, including a maximum temperature above the phase-change material's deposition temperature and other temperatures at or below the deposition temperature. The gaseous phase-change material, in a location at the deposition temperature, solidifies from its gaseous phase to form solid grain deposits on a surface within the enclosure of the sensor. The solid deposits precisely identify the location of the specific, targeted deposition temperature.

A portable information handling system has dynamic foot disposed at a bottom surface of a housing that extends and retracts to adjust cooling airflow impedance at vents disposed at the bottom surface. The dynamic foot includes an actuator in an internal cavity having opposing ramp structures interfaced by a nickel titanium wire that changes phase when heated to move the ramp structures. In the example embodiment, a push-push lock engages and disengages the ramp structures at each activation of the nickel titanium wire so that an embedded controller controls foot extension and retraction by applying current to the nickel titanium wire that heats the wire based upon detection of predetermined thermal conditions in the housing.