Patent classifications
G01K1/00
Measurement set-up for controlling the function of rechargeable batteries
The invention describes a calorimetric measurement set-up having a sensor unit (1) for controlling the quality of the operation of a battery having a cathode and an anode, wherein the measurement set-up or the sensor unit (1) is connected to data processing electronics (11) via a communication link (12) and sensor measured values are therefore recorded and processed. This measurement set-up is intended to achieve reproducible and sufficiently accurate quality control of a battery. This is achieved by virtue of the fact that the sensor unit (1) comprises at least one heat flow sensor (2), the sensor side of which can be fastened in a non-detachable manner with a material bond such that it rests directly on a battery contact of the cathode and/or the anode in the transverse direction, wherein a heat sink is fastened in a thermally conductive manner to the heat flow sensor (2) opposite the sensor side in a non-detachable manner and heat flow sensor signals at the battery contact of the battery can be read and processed further by the data processing electronics (11).
Small size thermal probe system for measuring the thermal conductivity of the pellet type hydrogen storage alloy
The present invention relates to a small size thermal conductivity measuring apparatus of a pellet type hydrogen storage alloy, a measuring method, and an analysis system. More specifically, a small size thermal conductivity measuring device of a hydrogen storage alloy pellet, includes: a measurement sample unit which is a target to be measured and is configured by a hydrogen storage alloy pellet; a reference material unit in which one surface is configured to be in contact with one surface of the measurement sample unit and a mounting groove is formed one side of the contact surface; and a thermal probe which is mounted in the mounting groove to measure a thermal conductivity of the measurement sample unit based on a temperature change.
Sensors for measuring thermal conductivity and related methods
A sensor for measuring thermal conductivity includes an insulator, a test material over the insulator, a conductor over the test material, and a gas within an open volume adjacent the test material and the conductor. An electrical source is configured to provide an alternating current through the conductor to heat the test material. Leads are connected to the conductor and configured to connect to a voltmeter. A method of measuring thermal conductivity includes disposing the sensor in a reactor core in which a nuclear fuel undergoes irradiation and radioactive decay. An alternating current is provided from the electrical source through the conductor to heat the test material. A voltage is measured as a function of time at the leads connected to the conductor. A thermal conductivity of the test material is calculated based on the voltage measured as a function of time. Methods of forming a sensor are also disclosed.
Position-biasing thermocouple
A thermocouple assembly may feature a plurality of temperature sensors formed by thermocouple junctions. The sensors may be disposed upon a substrate, that has a curvature that biases each of the plurality of temperature sensors in a desired direction.
Apparatus and method for emulating temperature during a thermal cure cycle
An apparatus includes a enclosure assembly including an enclosure assembly-leading end and an opposed enclosure assembly-lagging end, and a temperature emulation assembly mounted within the enclosure assembly and including a temperature emulation assembly-leading end located proximate to the enclosure assembly-leading end and a temperature emulation assembly-lagging end spaced away from the enclosure assembly-lagging end. The enclosure assembly thermally isolates the temperature emulation assembly. The enclosure assembly permits conductive heat transfer to the temperature emulation assembly only through the enclosure assembly-leading end.
Thermocouple for measuring cookware temperature
A cooking appliance having a thermocouple for measuring the temperature of an electrically conducting cooking utensil is provided. The cooking appliance includes a first probe formed of a first electrically conducting material and a second probe formed of a dissimilar second electrically conducting material. The first probe and second probe are spaced from one another. When the cooking utensil is placed on a heating assembly and heat is applied thereto, the first probe and the second probe electrically contact the cooking utensil. The cooking utensil acts as an intermediate material and completes the thermocouple circuit thereby allowing current to flow between the probes. Consequently, a voltage differential is produced. The voltage differential is measured, and as the voltage differential is indicative of the temperature of the cooking utensil, the temperature of the cooking utensil may be determined.
SENSOR DEVICE AND A METHOD OF CURRENT MODULATION SWITCHING USING A TWO-WIRE CURRENT INTERFACE
A sensor device includes a two-pin current interface including an input pin configured to draw an input current and an output pin configured to output an output current, a sensor configured to generate a measurement signal, and a current modulator configured to generate a current pulse as the output current such that the output current toggles between at least two main current states based on the measurement signal. The current modulator is configured to modulate the output current such that the output current is increased, to a first current level greater than the at least two main current states, at an initial phase of the current pulse for a first duration, and to modulate the output current such that the output current is decreased, to a second level less than the at least two main current states, at a terminal phase of the current pulse for a second duration.
SENSOR DEVICE AND A METHOD OF CURRENT MODULATION SWITCHING USING A TWO-WIRE CURRENT INTERFACE
A sensor device includes a two-pin current interface including an input pin configured to draw an input current and an output pin configured to output an output current, a sensor configured to generate a measurement signal, and a current modulator configured to generate a current pulse as the output current such that the output current toggles between at least two main current states based on the measurement signal. The current modulator is configured to modulate the output current such that the output current is increased, to a first current level greater than the at least two main current states, at an initial phase of the current pulse for a first duration, and to modulate the output current such that the output current is decreased, to a second level less than the at least two main current states, at a terminal phase of the current pulse for a second duration.
Failure determination circuit, physical quantity measurement device, electronic apparatus, and vehicle
A failure determination circuit includes a switching circuit that receives a signal including an output voltage from a temperature sensor and a first reference voltage and outputs the signal in a time division manner, an A/D conversion circuit that A/D converts an output of the switching circuit, and a first determination circuit, and the first determination circuit determines a failure of the temperature sensor based on a signal based on a first digital signal obtained by A/D converting an output voltage from the temperature sensor by the A/D conversion circuit, a signal based on a second digital signal obtained by A/D converting the first reference voltage by the A/D conversion circuit, and temperature characteristics data based on a change in characteristics of the temperature sensor due to temperature and a change in characteristics of the first reference voltage due to temperature.
Spintronic temperature sensor
This disclosure describes various examples of spintronic temperature sensors. The example temperature sensors may be discrete or used to adaptively control operation of a component such as an integrated circuit (IC). In one example, an electronic device comprises a spintronic component configured such that the conductance of the spintronic component is based on sensed temperature. In one example, circuitry coupled to the spintronic component is configured to generate an electrical signal indicative of the sensed temperature based on the conductance of the spintronic component.