A temperature-sensing circuit is provided, which includes: a search-control circuit, a voltage-reference circuit, a CTAT (complementary to absolute temperature) circuit, a digital-to-analog converter (DAC) circuit, a comparison circuit, and an SAR (successive approximation register) circuit. The search-control circuit generates a reference-voltage selection signal according to a plurality of control signals. The voltage-reference circuit selects a first reference voltage from a plurality of candidate reference voltages according to the reference-voltage selection signal, and provides a second reference voltage. The CTAT circuit converts the second reference voltage into a first comparison voltage. The DAC circuit converts the first reference voltage into a second comparison voltage. The comparison circuit compares the first comparison voltage and the second comparison voltage to generate a comparison-result signal. The SAR control circuit outputs each bit of a temperature-segment signal of an operating temperature according to the comparison-result signal. The control signals include the temperature-segment signal.

A method is provided for characterizing junction temperatures of power diodes devices, each of the diode devices being one-to-one connected in antiparallel to each power semiconductor switching devices of a voltage source inverter having processing and measuring capability, the method including: an initialization stage, wherein a heater is thermally coupled with a heatsink and/or with a direct bonded copper element of the voltage source inverter; a temperature setting stage, wherein the temperature of the direct bonded copper element and/or the heatsink is increased up to a maximum operative temperature; a commissioning stage, wherein at each current pulse of a current pulses train sampled data are collected in a sampling period wherein the corresponding power semiconductor switching device connected with at least one of the power semiconductor diode devices is turned-off; an output stage, wherein the processor generates, from the sampled data, processed data for at least one of the power semiconductor diode devices.

A method is provided for characterizing junction temperatures of power diodes devices, each of the diode devices being one-to-one connected in antiparallel to each power semiconductor switching devices of a voltage source inverter having processing and measuring capability, the method including: an initialization stage, wherein a heater is thermally coupled with a heatsink and/or with a direct bonded copper element of the voltage source inverter; a temperature setting stage, wherein the temperature of the direct bonded copper element and/or the heatsink is increased up to a maximum operative temperature; a commissioning stage, wherein at each current pulse of a current pulses train sampled data are collected in a sampling period wherein the corresponding power semiconductor switching device connected with at least one of the power semiconductor diode devices is turned-off; an output stage, wherein the processor generates, from the sampled data, processed data for at least one of the power semiconductor diode devices.

A device for measuring the temperature in a conductor includes at least one temperature sensor emitting a signal having a frequency changing due to a temperature change. The signals of the temperature sensor are transported through the conductor and the signals are inductively or capacitively coupled out of the conductor and into an evaluation unit for measuring the temperature through coupling elements.

The present disclosure relates to a food thermometer with a temperature sensor, with a rechargeable battery, with a coil through which the battery can be inductively charged. The food thermometer may comprise an elongated, liquid-tight container having an opening at an end face, wherein the opening is closed in a liquid-tight manner by a cap. The disclosure further relates to a charger for the food thermometer. The charger may be a food processor.

Embodiments of a temperature sensing apparatus are disclosed. The apparatus may include a voltage generator and circuitry. The voltage generator may generate a first voltage level and a second voltage level dependent on an operating temperature. In response to a given change in the operating temperature, the first and second voltage levels may change, with the second voltage level changing by a different amount than the first voltage level. The voltage generator may generate a third voltage level. The circuitry may measure the first voltage level, the second voltage level, and the third voltage level, and may calculate the operating temperature dependent on a ratio of a difference between the first voltage level and the second voltage level and the third voltage level.

Embodiments of a temperature sensing apparatus are disclosed. The apparatus may include a voltage generator and circuitry. The voltage generator may generate a first voltage level and a second voltage level dependent on an operating temperature. In response to a given change in the operating temperature, the first and second voltage levels may change, with the second voltage level changing by a different amount than the first voltage level. The voltage generator may generate a third voltage level. The circuitry may measure the first voltage level, the second voltage level, and the third voltage level, and may calculate the operating temperature dependent on a ratio of a difference between the first voltage level and the second voltage level and the third voltage level.

A circuit is disclosed that includes a first differential input pair and a second differential input pair. The first differential input pair is activated according to an output of the second differential input pair, and receives a first temperature-dependent voltage and an output signal. The second differential input pair is activated according to an output of the first differential input pair, and receives a second temperature-dependent voltage and the output signal. The switching circuit couples a capacitive element to a first voltage supply according to the output of the first differential input pair, and the capacitive element to a second voltage supply according to the output of the second differential input pair, to generate the output signal.

A circuit is disclosed that includes a first differential input pair and a second differential input pair. The first differential input pair is activated according to an output of the second differential input pair, and receives a first temperature-dependent voltage and an output signal. The second differential input pair is activated according to an output of the first differential input pair, and receives a second temperature-dependent voltage and the output signal. The switching circuit couples a capacitive element to a first voltage supply according to the output of the first differential input pair, and the capacitive element to a second voltage supply according to the output of the second differential input pair, to generate the output signal.

A flexible circuit package. The circuit package includes a termination point on a flexible base substrate. The termination point is connected with an interface by conductive material on the base substrate. The conductive material extends across the surface area of the base substrate in multiple individual connections, which are in communication with each other and separated by voids in the conductive material for mitigating communication failure between the termination point and the interface during or following flexion, stretching, compression or other deformation of the base substrate and the circuit package. The termination point may include an input module such as a sensor, switch or other input. The termination point may include an output module such as a light, vibrator or other output. The interface may include an output interface for receiving data or an input interface for sending a command or other signal.