A flexible circuit package. The circuit package includes a termination point on a flexible base substrate. The termination point is connected with an interface by conductive material on the base substrate. The conductive material extends across the surface area of the base substrate in multiple individual connections, which are in communication with each other and separated by voids in the conductive material for mitigating communication failure between the termination point and the interface during or following flexion, stretching, compression or other deformation of the base substrate and the circuit package. The termination point may include an input module such as a sensor, switch or other input. The termination point may include an output module such as a light, vibrator or other output. The interface may include an output interface for receiving data or an input interface for sending a command or other signal.

An example resonating structure comprises a substrate, a resonator body, and an anchoring body for anchoring the resonator body to the substrate. The resonator body includes a layer of base material and, deposited on top of the layer of base material, a layer of mismatch material having a mismatch in temperature coefficient of elasticity (TCE) relative to the base material. The base material is doped with a dopant having a concentration chosen so as to minimize a second order temperature coefficient of frequency for the resonator body. The thickness of the layer of the mismatch material is chosen so as to minimize a first order temperature coefficient of frequency for the resonator body.

The invention relates to rod thermometer device for detecting a temperature, including a plurality of temperature-sensitive elements and a protective sheath having an axis X in which the sensitive elements are partially inserted. The sheath is made of a metal constituting one of the two metals of a thermocouple, and the sensitive elements of a plurality of wires made of a metal other than that of the sheath and constituting the other one of the two metals of a thermocouple, one of the ends of each one of the wires being welded inside the sheath forming a junction for measuring a given thermocouple, the welded ends of the wires being distributed along a plurality of axial and azimuth positions relative to the axis X inside the sheath, each one of the wires extending out of the sheath by at least one of the ends thereof.

The internal temperate of a transistor is determined by detecting a voltage though a terminal of an integrated circuit that is also used by an overcurrent detection circuit of the integrated circuit for detecting an overcurrent condition of the system. The overcurrent detection circuit is coupled to a current electrode of the transistor through the terminal of the integrated circuit. A determination of internal temperature is based on a voltage measurement taken from the terminal during an on phase of the transistor. The voltage measurement is converted to a digital value and is used to determine an internal temperature of the transistor.

The internal temperate of a transistor is determined by detecting a voltage though a terminal of an integrated circuit that is also used by an overcurrent detection circuit of the integrated circuit for detecting an overcurrent condition of the system. The overcurrent detection circuit is coupled to a current electrode of the transistor through the terminal of the integrated circuit. A determination of internal temperature is based on a voltage measurement taken from the terminal during an on phase of the transistor. The voltage measurement is converted to a digital value and is used to determine an internal temperature of the transistor.

A temperature difference measuring apparatus includes: a bottomed tubular package in which a top face side is opened; a MEMS device disposed on an inner bottom face of the package, the MEMS device comprising at least one thermopile that measures a temperature difference, which is generated in the MEMS device by inflow heat through a bottom of the package; and a heat quantity increasing unit configured to increase a heat quantity flowing out from the MEMS device onto the top face side of the bottomed tubular package.

The invention relates to temperature sensors, in particular high-temperature sensors, having an optionally coated substrate, at least one resistor structure, and at least two connection contacts. The connection contacts electrically contact the resistor structure, and the substrate is made of zirconium oxide or a zirconium oxide ceramic stabilized with oxides of a trivalent metal and a pentavalent metal. The substrate is coated with an insulation layer and the resistor structure and the free regions of the insulation layer, on which no resistor structure is disposed, are at least partially coated with a ceramic intermediate layer. A protective layer and/or a cover is disposed on the ceramic intermediate layer. At least one electrode may be disposed, at least at one connection contact, alongside the resistor structure on the substrate. The invention also relates an exhaust-gas system for controlling and/or regulating an engine, particularly a motor vehicle engine, containing these temperature sensors.

A temperature detection element of a temperature sensor is connected to a print wire and three print wires for an input and output of a print substrate, one end of a lead wire for a connection is connected and fixed with solder to an external circuit for connection electrodes of the print wire, and the other end is externally drawn out of a sealing member of a hardened resin. Within the housing, the entire bottom surface of the print substrate is supported by a lower fixed member, and an end, closer to an opening part of the housing, of the print substrate, is sandwiched and fixed by an upper fixed member and the lower fixed member. The housing is configured with the same material and size as the housing of the temperature control element, and the temperature detection element inside is placed at a position approximated to a placement of a thermal response element of the temperature control element. By using an adhesive having a different thermal conductivity, a thermal characteristic of the temperature sensor can be varied.

The present disclosure relates to an apparatus and method for estimating a temperature of a motor using a Hall sensor. The method includes detecting, at a digital Hall sensor, a position of a rotor included in a motor and outputting an on signal in an operating period and an off signal in a release period according to a relative position of the rotor, calculating, at a temperature determining module, a difference between duration of the operating period and duration of the release period according to an output waveform of the digital Hall sensor, and then determining, at the temperature determining module, a temperature of the motor with reference to a temperature corresponding to the duration difference. Accordingly, it is possible to estimate the internal temperature of a motor without installing a temperature sensor in the motor, to maintain a small size of the motor, and to reduce production costs.

An installation state determination method of the present disclosure includes measuring a temperature and a heat flux of a surface of a living body using a sensor installed at a predetermined site of the living body, calculating a thermal resistance value of the living body based on the measured temperature and heat flux of the surface of the living body, comparing the calculated thermal resistance value of the living body with a reference thermal resistance value of the predetermined site of the living body, and determining an installation state of the sensor at the predetermined site of the living body based on a result of the comparison.