Disclosed embodiments are related to techniques for powering compute platforms in low temperature environments. Embodiments include a preheating stage that is added to a power up sequence. The preheating stage may include a force-on stage and a force-offstage. During the force-on stage, all power rails of target components are forced to an ON state so that the target components consume current. When a target operating temperature is reached, the power rails of the target components are turned off, which causes the target components to revert back to their initial (pre-boot) state allowing the normal boot process to take place. Since the target components are now heated up, the boot process can execute faster than when the target components were cold. Other embodiments may be described and/or claimed.

A radio frequency (RF) sensing device in an assembly is adapted to wirelessly communicate with a remote transceiver. The sensing device includes a substrate; an antenna disposed on the substrate; an electronic circuit disposed on the substrate and electrically coupled to the antenna; a heating element electrically coupled to the electronic circuit for heating a target area; and a sensing element thermally coupled to the heating element for sensing a temperature of the heating element. The RF sensing device is configured to wirelessly receive a power and provides the power to the heating element

A radio frequency (RF) sensing device in an assembly is adapted to wirelessly communicate with a remote transceiver. The sensing device includes a substrate; an antenna disposed on the substrate; an electronic circuit disposed on the substrate and electrically coupled to the antenna; a heating element electrically coupled to the electronic circuit for heating a target area; and a sensing element thermally coupled to the heating element for sensing a temperature of the heating element. The RF sensing device is configured to wirelessly receive a power and provides the power to the heating element

Embodiments disclosed herein generally relate to a temperature sensor disposed in an apparatus. In many semiconductor, liquid crystal display, solar panel or organic light emitting display fabrication processes, RF power is utilized to either ignite a plasma within the processing chamber or to provide supplemental energy to the process. Temperature control during many processes may be beneficial in order to produce a consistent product. Temperature sensors or thermocouples are sometimes utilized to measure the temperature of a substrate within a processing chamber. The RF power may have a negative impact on the temperature sensor. By coating the temperature sensor with a nanoparticle based metal coating, such as a silver coating, the negative impacts of the RF power on the temperature sensor may be reduced without contaminating the process, and an accurate temperature measurement may be obtained.

The present invention includes a body case having a biological sample sensor mounting portion on one end side, a temperature sensor (A) provided on the one end side inside the body case, a measurement portion connected to the biological sample sensor mounting portion, and a control portion connected to the measurement portion. A temperature sensor (B) is provided on one other end side inside the body case, and when measurement is performed by the measurement portion, temperature change amounts in the two end portions are compared using the temperature sensors (A) and (B). Furthermore, a measurement value obtained by the measurement portion is corrected using temperature information from either one of the temperature sensors (A) or (B) that is provided in the end portion on the side where the temperature change is smaller.

A power control device is contained within a housing and has an electric current sensor configured to measure current passing through an electric outlet during a time period, a proximity sensor configured to detect a distance of an object relative to the electric outlet during the time period, a relay switch that can open or close to stop or conduct current through a circuit in the electric outlet in response to a command, and a wireless network interface in communication with the electric current sensor and the proximity sensor, the wireless network interface configured to transmit and receive data from the current sensor and the proximity sensor, to transmit commands to the relay switch, transmit the data to a computing device, and receive commands from the computing device.

A thermal insulation property measuring device, including a tank, a thermal insulator, a cuboidal frame, a support bracket, and a data collector. The tank includes an upper body, a first lower body, and a second lower body. The thermal insulator includes a first thermal insulation layer, a second thermal insulation layer, a first membrane, a second membrane, and a third membrane. The support bracket includes a trapezoidal support and a transition support. The tank is disposed on the support bracket. The support bracket is disposed in the cuboidal frame. The upper body, the first lower body, and the second lower body are spherical and communicate with each other. A filling tube, a pressure relief tube and a piezometer tube are disposed on the upper body. The first membrane is disposed on the tank. The first thermal insulation layer is coated on the first membrane.

First and second circuits, a photocoupler and a substrate temperature monitor circuit are formed on a substrate. A photocoupler includes a primary-side light emitting diode that converts an electric signal received from the first circuit into an optical signal, and a light receiving device that converts the optical signal into an electric signal and outputs the electric signal to the second circuit. The substrate temperature monitor circuit reads a Vf voltage value of the primary-side light emitting diode of the photocoupler to monitor temperature of the substrate.

First and second circuits, a photocoupler and a substrate temperature monitor circuit are formed on a substrate. A photocoupler includes a primary-side light emitting diode that converts an electric signal received from the first circuit into an optical signal, and a light receiving device that converts the optical signal into an electric signal and outputs the electric signal to the second circuit. The substrate temperature monitor circuit reads a Vf voltage value of the primary-side light emitting diode of the photocoupler to monitor temperature of the substrate.

A thermometer has temperature sensing tip, a processor taking temperature readings and determining a sensed temperature reading of the living being from the temperature sensing tip. The thermometer also includes a display and a backlight for lighting the display. The backlight is activated upon a command from the processor and the processor determines whether to activate the backlight based upon the temperature readings. The method embodiment can includes the steps of using the processor to monitor a temperature change indicated by a temperature sensing element. The processor then detects a temperature decrease and activates a first color light emitting element to backlight a display if the temperature decrease exceeds or equals a predetermined threshold. The thermometer is operable in one of a plurality of selectable operating modes, and the predetermined threshold is dependent upon the selected operating mode. For example, operating modes may depend on patient age range or measurement location. Age range may include infant, toddler and adult.