G01K7/00

APPARATUS FOR AN AEROSOL GENERATING DEVICE
20230127267 · 2023-04-27 ·

An apparatus for an aerosol generating device includes a heating circuit including an inductive element for inductively heating a susceptor arrangement to heat an aerosol generating material to thereby generate an aerosol, a temperature determiner for determining a temperature of the susceptor arrangement based on one or more electrical properties of the heating circuit influenced by the temperature of the susceptor arrangement, and a control arrangement. Aerosol generating systems and methods of operating an aerosol generating system are also provided.

GLASS CONTAINER WITH A PROTECTIVE COATING OF ACRYLATE URETHANE POLYMER DEPOSITED ON AN EXTERIOR SURFACE OF THE GLASS CONTAINER; METHOD OF PRODUCING SUCH GLASS CONTAINER AND USE OF SUCH GLASS CONTAINER

A glass container comprising: an exterior surface and an interior surface opposite to the exterior surface; and a coating of acrylate urethane polymer deposited at least over a portion of the exterior surface, characterized in that said glass container has a lightweight index L, calculated as L=[weight of container (g)/(volume of container (ml)).sup.0.77]*0.44 of less than 1, preferably less than 0.90, more preferably less than 0.75 and most preferably less than 0.60.

Modular wireless sensing device
11473945 · 2022-10-18 · ·

The present disclosure provides a wireless sensing device. In an embodiment, the wireless sensing device includes (A) a button cell. The button cell has a positive electrode and a negative electrode. The device includes (B) a first printed circuit board (IPCB) located on a top surface of the button cell. The IPCB has a first contact and a second contact electrically connected to respective positive electrode and negative electrode of the button cell. The IPCB includes (i) a processor, and (ii) a wireless communication component (WCC). Each of the (i) processor, and (ii) WCC are electrically connected to the IPCB. The device includes (C) a sensor module. The sensor module includes a second PCB (2PCB) and one or more sensor chips electrically connected to the 2PCB. (D) The device has a length from 10 mm to 30 mm, a thickness from 3 mm to 10 mm and a width from 10 mm to 30 mm.

High sample throughput differential scanning calorimeter

Described is a differential scanning calorimeter (DSC) instrument capable of performing analyses of multiple samples at the same time. Some embodiments of DSC instruments described herein include a thermal substrate that provides a substantially uniform temperature across a surface of the substrate. A plurality of DSC units is in thermal communication with the substrate, for example, by mounting the units directly to the surface of the substrate. Each DSC unit includes a second thermal substrate for further thermal isolation, and a reference platform and sample platform to receive a reference cell and a sample cell, respectively. A thermoelectric device is disposed between each platform and the second thermal substrate. Optionally, the reference and sample cells may be disposable chips that can be discarded after measurement are performed, thereby reducing or eliminating the need to clean instrument components to prevent cross-contamination for subsequent instrument operation.

High sample throughput differential scanning calorimeter

Described is a differential scanning calorimeter (DSC) instrument capable of performing analyses of multiple samples at the same time. Some embodiments of DSC instruments described herein include a thermal substrate that provides a substantially uniform temperature across a surface of the substrate. A plurality of DSC units is in thermal communication with the substrate, for example, by mounting the units directly to the surface of the substrate. Each DSC unit includes a second thermal substrate for further thermal isolation, and a reference platform and sample platform to receive a reference cell and a sample cell, respectively. A thermoelectric device is disposed between each platform and the second thermal substrate. Optionally, the reference and sample cells may be disposable chips that can be discarded after measurement are performed, thereby reducing or eliminating the need to clean instrument components to prevent cross-contamination for subsequent instrument operation.

Miniature external temperature sensing device for estimating subsurface tissue temperatures

Embodiments described herein are directed to a temperature measurement device that includes a sensor body configured to be placed on a skin of a user. The temperature measurement device can include a first section defining a first lower surface and having a first thickness, a second section defining a second lower surface and having a second thickness, and a channel separating the first lower surface from the second lower surface. The temperature measurement device can also include a first set of temperature sensors positioned across the first thickness, a second set of temperature sensors positioned across the second thickness, and a processor configured to estimate a tissue temperature of the user based on comparing temperature signals from the first set of temperature sensors with temperature signals from the second set of temperature sensors.

Miniature external temperature sensing device for estimating subsurface tissue temperatures

Embodiments described herein are directed to a temperature measurement device that includes a sensor body configured to be placed on a skin of a user. The temperature measurement device can include a first section defining a first lower surface and having a first thickness, a second section defining a second lower surface and having a second thickness, and a channel separating the first lower surface from the second lower surface. The temperature measurement device can also include a first set of temperature sensors positioned across the first thickness, a second set of temperature sensors positioned across the second thickness, and a processor configured to estimate a tissue temperature of the user based on comparing temperature signals from the first set of temperature sensors with temperature signals from the second set of temperature sensors.

Tungsten-rhenium composite thin film thermocouple based on surface micropillar array with gas holes

Provided herein is a tungsten-rhenium composite thin film thermocouple based on a surface micropillar array with gas holes. A tungsten-rhenium thin film thermocouple is arranged on a surface of a flat alumina ceramic substrate. Two tails of the tungsten-rhenium thin film thermocouple are respectively connected to a lead wire. A surface of the tungsten-rhenium thin film thermocouple is arrayed with a plurality of micron alumina micropillars to form an alumina micropillar array. Air is filled between the micron alumina micropillars to form the gas holes. The flat alumina ceramic substrate, the tungsten-rhenium thin film thermocouple and the alumina micropillar array form a three-layered laminated structure.

GAIN COMPENSATION FOR POWER AMPLIFIERS USING A TEMPERATURE SENSOR CIRCUIT

According to at least one example, an amplifier circuit includes an amplifier and a temperature sensor circuit. The temperature sensor circuit includes a first transistor thermally isolated from the amplifier and being configured to sense an ambient temperature, and a second transistor thermally linked to the amplifier and being configured to sense a temperature at the amplifier, the temperature sensor circuit being a differential circuit having a first path and a second path with the first and second transistors being arranged on the first and second paths of the differential circuit respectively. The temperature sensor circuit is configured to generate an output voltage inversely proportional to a temperature difference between the ambient temperature and the temperature at the amplifier.

GAIN COMPENSATION FOR POWER AMPLIFIERS USING A TEMPERATURE SENSOR CIRCUIT

According to at least one example, an amplifier circuit includes an amplifier and a temperature sensor circuit. The temperature sensor circuit includes a first transistor thermally isolated from the amplifier and being configured to sense an ambient temperature, and a second transistor thermally linked to the amplifier and being configured to sense a temperature at the amplifier, the temperature sensor circuit being a differential circuit having a first path and a second path with the first and second transistors being arranged on the first and second paths of the differential circuit respectively. The temperature sensor circuit is configured to generate an output voltage inversely proportional to a temperature difference between the ambient temperature and the temperature at the amplifier.