Methods of characterizing ion-exchanged chemically strengthened Li-containing glasses include: a) measuring a mode spectrum of the glass sample; b) using the mode spectrum, estimating a first contribution to the center tension associated with a spike region and estimating a second contribution to the center tension due to a deep region only, wherein the deep region is assumed to follow a power-law stress profile; and c) determining a total center tension by adding of the first and second contributions to the center tension. The methods can be used for quality control during manufacturing of glass samples by comparing the total center tension to a center tension specification that provides optimum strength and durability.

An integrated polymer-derived ceramic (PDC) thin-film sensor produced by laser pyrolysis and additive manufacturing and a fabrication method thereof are provided. Using a metal component or an insulating material as a substrate, a PDC-doped composite insulating film layer with high density, high insulation, and high temperature resistance is formed by a layer-by-layer laser pyrolysis and additive manufacturing on the surface of the metal component, and a strain sensitive layer with excellent electrical conductivity is obtained by Weissenberg direct writing process PDC-doped filler sensitive grid on the composite insulating film layer and laser pyrolysis enhancing graphitization of PDC. In this way, the in situ integrated laser fabrication of highly insulating film layer, sensitive grid with excellent electrical conductivity, and metal substrate based on PDC materials is developed, which achieves the laser processing of “liquid-solid-function” transformation of PDC composites and allows the successful use thereof in strain sensing of metallic materials.

A device for detemining whether or not positive and negative electrode tabs constituting an electrode assembly are bent includes: a stably nesting portion in which the electrode assembly is stably nested; an electrode tab contact portion arranged on a side surface of the stably nesting portion and configured to move downward so as to come into contact with one end portion of an electrode tab, bending the electrode tab, and to elastically restore the electrode tab to an original state thereof; a weight measurement unit arranged above the stably nesting portion and configured to measure, on a per-area basis, a weight of the electrode tab that is elastically restored to an original state thereof; and a determination unit configured to determine whether or not the electrode tab is bent, depending on an area where the weight is measured.

A non-transitory computer-readable medium includes instructions that when executed by a processor cause the processor to perform a method for identifying products from on-shelf sensors and image data. The method may include receiving data captured using a plurality of sensors positioned between at least part of a retail shelf and one or more products placed on the at least part of the retail shelf. The method may also include receiving an image of the at least part of the retail shelf and at least one of the one or more products. The method may also include analyzing the captured data and the image to determine a product type of the one or more products.

A surface mounted monitoring system is disclosed that is useful for detecting the presence of both ordinary and excessive loads on a surface, and for providing real-time or near real-time trending data. The system includes an array of force transducers disposed on the exterior surface of a structural member such as a roof. In an exemplary embodiment, transducers may be placed on an interior surface, such as embedded within insulation. The force transducers detect the magnitude of a load force acting on the surface. A data analysis module (DAM) may record force readings in a circular memory buffer, so that recent data can be recovered in the event of a catastrophic collapse. The DAM may also communicate with a monitoring device that can display real-time loading data to a user and perform other analysis.

A force measurement system that includes at least one force plate module is disclosed herein. The at least one force plate module has a plurality of force plate assemblies supported on a base component, each of the force plate assemblies includes a plate component having a top surface, the top surface of the plate component forming a force measurement surface for receiving at least one portion of a body of a subject; and at least one force transducer, the at least one force transducer configured to sense one or more measured quantities and output one or more signals that are representative of the one or more measured quantities, the plate component being supported on the at least one force transducer. The at least one force plate module is configured to be connected to one or more additional force plate modules so as to form a modular array of force plates.

A force measurement system that includes at least one force plate module is disclosed herein. The at least one force plate module has a plurality of force plate assemblies supported on a base component, each of the force plate assemblies includes a plate component having a top surface, the top surface of the plate component forming a force measurement surface for receiving at least one portion of a body of a subject; and at least one force transducer, the at least one force transducer configured to sense one or more measured quantities and output one or more signals that are representative of the one or more measured quantities, the plate component being supported on the at least one force transducer. The at least one force plate module is configured to be connected to one or more additional force plate modules so as to form a modular array of force plates.

A stress compensated oscillator circuitry comprises a sensor arrangement for providing a sensor output signal S.sub.Sensor, wherein the sensor output signal S.sub.Sensor is based on an instantaneous stress or strain component a in the semiconductor substrate, a processing arrangement for processing the sensor output signal S.sub.Sensor and providing a control signal S.sub.Control depending on the instantaneous stress or strain component σ in the semiconductor substrate, and an oscillator arrangement for providing an oscillator output signal S.sub.osc having an oscillator frequency f.sub.osc based on the control signal S.sub.Control, wherein the control signal S.sub.Control controls the oscillator output signal S.sub.osc, and wherein the control signal S.sub.Control reduces the influence of the instantaneous stress or strain component σ in the semiconductor substrate onto the oscillator output signal S.sub.osc, so that the oscillator circuitry provides a stress compensated oscillator output signal.

A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.

A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.