At least some embodiments of disclosure provide a method and device for optical fiber monitoring and an optical fiber adapter. The method includes: a device for monitoring the optical fiber for performing optical fiber monitoring is installed in an optical fiber adapter and the optical fiber monitoring is performed by using the optical fiber adapter with the device for monitoring the optical fiber. The problem that the device for monitoring the optical fiber has complex wiring and a deployment position is limited is solved. And effects that the wiring complexity of the device for monitoring the optical fiber is reduced, and the deployment position is flexible and convenient are achieved.

Provided are an optical spectrum analyzer and a pulse-modulated light measurement method capable of measuring pulse-modulated light even when a pulse-on time and a pulse period of the pulse-modulated light are unknown. Pulse-modulated light (DUT) is incident on a diffraction grating 3. A first light receiving unit 8 receives the 0th-order light of diffracted light diffracted by the diffraction grating 3. A second light receiving unit 7 receives diffracted light of an order other than the 0th-order light. A measurement timing signal generation unit 9 generates a sampling signal based on the 0th-order light received by the first light receiving unit. The spectrum of the diffracted light received by the second light receiving unit is measured based on the sampling signal generated by the measurement timing signal generation unit.

Electrical test of optical components via metal-insulator-semiconductor capacitor structures is provided via a plurality of optical devices including a first material embedded in a second material, wherein each optical device is associated with a different thickness range of a plurality of thickness ranges for the first material; a first capacitance measurement point including the first material embedded in the second material; and a second capacitance measurement point including a region from which the first material has been replaced with the second material.

Disclosed herein is a circuit for determining failure of a movable MEMS mirror. The circuit includes an integrator receiving an opening angle signal representing an opening angle of the movable MEMS mirror, and a differentiator receiving the opening angle signal. A summing circuit is configured to sum the integrator output and the differentiator output. A comparison circuit is configured to determine whether the sum of the integrator output and differentiator output is not within a threshold window. An indicator circuit is configured to generate an indicator signal indicating that the movable MEMS mirror has failed based on the comparison circuit indicating that the sum of the integrator output and differentiator output is not within the threshold window.

Methods, devices, systems, and computer program products for estimating object reflectivity in a light detection and ranging (LIDAR) system are disclosed. The method, for example, includes receiving LIDAR data for a plurality of LIDAR scan cycles. The method also includes generating a dataset from the LIDAR data by accumulating the recorded return signals over the plurality of scan cycles. A data feature associated with an object is identified in the dataset, and one or more parameters of the data feature are identified. An estimated reflectivity of the object may then be determined based on the one or more parameters.

A system includes: a camera unit; a control unit; and a test setup for testing the control unit. The test setup comprises a processor and an image output unit. The processor is configured to manipulate image data to simulate an error of the camera unit and to output, on the image output unit, the manipulated image data in the form of an image detectable via camera optics. The camera unit is configured to detect, via the camera optics, the outputted image data simulating the error of the camera unit. The control unit is configured to receive, from the camera unit, camera image data simulating the error of the camera unit.

A method of mapping pixel locations of a detector array includes measuring a location on the detector array, initiating a frame readout of the detector array, measuring a location of one or more metrology targets on the detector array, analyzing the frame readout to identify a pixel at the location on the detector array, and defining a location of the identified pixel with respect to the location of the one or more metrology targets. Subsequent measurement of the metrology targets alone by another metrology system allows one to infer the six degree of freedom alignment of the detector array in space.

It is provided an apparatus, comprising a box configured to conduct an optical fiber from an exterior to an interior of the box; at least one of a mounting means adapted to mount a connecting means to which the optical fiber may be connected and a guiding means adapted to guide the optical fiber, wherein the at least one of the mounting means and the guiding means is arranged in the interior of the box; a detecting means arranged in the interior of the box adapted to detect a first signal from the interior of the box, wherein the first signal is at least one of a light and a smoke; wherein the interior of the box is substantially shielded from a second signal from an exterior of the box, and the detecting means is suitable to detect the second signal in a same manner as the first signal.

An apparatus, system, and method for an eye-tracking optical verification tester are described herein. In some aspects, a heating element such as a Peltier or Thermoelectric Cooler “TEC” includes a see-through void and may be used to control a temperature of an eye-tracking optical element. An environmental enclosure that is configured to assist in simulation of an environmental condition may hold the eye-tracking optical element. The eye-tracking optical element is to receive reflected light from an eye-tracking target and direct the reflected light to an eye-tracking camera.

An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data from the electrical signals is simultaneously generated at each step of a sweep in wavelength of the optical test signal and output in response to a step change. In another process, the electrical signals are sequentially selected and the sweep in wavelength of the optical test signal is performed for each selected electrical signal to generate the test data.