A method of making a sensor includes depositing a layer of hydrogel over a substrate, the hydrogel configured to change thickness or volume in response to a selected condition and including a plurality of magnetic particles disposed in the hydrogel so that a magnetic property of the hydrogel changes with changes of thickness or volume of the hydrogel. The hydrogel is sacrificed in selected region(s) of the layer so that the hydrogel outside the selected region(s) forms a plurality of spaced-apart islands of the hydrogel. The islands of the hydrogel are enclosed in an enclosure at least partly permeable to a selected fluid. A sensor for detecting a condition includes the substrate, islands, and a device coil arranged with respect to the hydrogel so that changes in the magnetic property modulate an electrical property of the sensor. A system includes the substrate, islands, and a magnetic-field detector.

A method of making a sensor includes depositing a layer of hydrogel over a substrate, the hydrogel configured to change thickness or volume in response to a selected condition and including a plurality of magnetic particles disposed in the hydrogel so that a magnetic property of the hydrogel changes with changes of thickness or volume of the hydrogel. The hydrogel is sacrificed in selected region(s) of the layer so that the hydrogel outside the selected region(s) forms a plurality of spaced-apart islands of the hydrogel. The islands of the hydrogel are enclosed in an enclosure at least partly permeable to a selected fluid. A sensor for detecting a condition includes the substrate, islands, and a device coil arranged with respect to the hydrogel so that changes in the magnetic property modulate an electrical property of the sensor. A system includes the substrate, islands, and a magnetic-field detector.

A semiconductor testing fixture is provided. The semiconductor testing fixture includes a substrate having a plurality of testing regions; and a plurality of testing probes with a predetermined distribution pattern formed on the substrate in each of the plurality of testing regions. Etch of the testing probes comprises a first testing tip; an insulation layer formed on a side surface of the first testing tip; and a second testing tip being coaxial with the first testing tip and surrounding the first testing tip formed on a side surface of the insulation layer.

A semiconductor testing fixture is provided. The semiconductor testing fixture includes a substrate having a plurality of testing regions; and a plurality of testing probes with a predetermined distribution pattern formed on the substrate in each of the plurality of testing regions. Etch of the testing probes comprises a first testing tip; an insulation layer formed on a side surface of the first testing tip; and a second testing tip being coaxial with the first testing tip and surrounding the first testing tip formed on a side surface of the insulation layer.

Electrical properties of a semiconductor device are reproducibly and stably measured in a testing step of the semiconductor device. A probe pin includes a first plunger, a second plunger, a cleaning shaft, a first coil spring, and a second coil spring. The cleaning shaft accommodated in the inside of the first plunger is allowed to enter and exit through a tip of a contact of the first plunger by the second coil spring, thereby solder shavings attached to the tip of the contact are removed. The first plunger is electrically coupled to the second plunger by the first coil spring wound on an outer side face of the first plunger and on an outer side face of the second plunger.

Electrical properties of a semiconductor device are reproducibly and stably measured in a testing step of the semiconductor device. A probe pin includes a first plunger, a second plunger, a cleaning shaft, a first coil spring, and a second coil spring. The cleaning shaft accommodated in the inside of the first plunger is allowed to enter and exit through a tip of a contact of the first plunger by the second coil spring, thereby solder shavings attached to the tip of the contact are removed. The first plunger is electrically coupled to the second plunger by the first coil spring wound on an outer side face of the first plunger and on an outer side face of the second plunger.

Apparatuses and methods of distinguishing between a finger and stylus proximate to a touch surface are described. One apparatus includes a first circuit to obtain capacitance measurements of sense elements when a conductive object is proximate to a touch surface. The apparatus also includes a second circuit coupled to the first circuit. The second circuit is operable to detect whether the conductive object activates the first sense element, second sense element, or both, in view of the capacitance measurements. To distinguish between a stylus and a finger as the conductive object, the second circuit determines the conductive object as being the stylus when the second sense element is activated and the first sense element is not activated and determines the conductive object as being the finger when the first sense element and the second sense element are activated.

Interconnection meter socket adapters are provided. An interconnection meter socket adapter comprises a housing enclosing a set of electrical connections. The interconnection meter socket adapter may be configured to be coupled to a standard distribution panel and a standard electrical meter, thereby establishing connections between a distribution panel and a user such that electrical power may be delivered to the user while an electrical meter measures the power consumption of the user. An interconnection meter socket adapter may be configured to be coupled to a DC-AC converter, which may be coupled to various energy sources. As such, the energy sources are coupled to an electrical power system. In addition, a connector such as a flexible cable or flexible conduit containing insulated wires can be provided for connecting various energy sources and/or sinks.

Interconnection meter socket adapters are provided. An interconnection meter socket adapter comprises a housing enclosing a set of electrical connections. The interconnection meter socket adapter may be configured to be coupled to a standard distribution panel and a standard electrical meter, thereby establishing connections between a distribution panel and a user such that electrical power may be delivered to the user while an electrical meter measures the power consumption of the user. An interconnection meter socket adapter may be configured to be coupled to a DC-AC converter, which may be coupled to various energy sources. As such, the energy sources are coupled to an electrical power system. In addition, a connector such as a flexible cable or flexible conduit containing insulated wires can be provided for connecting various energy sources and/or sinks.

An electrical meter and methods of use and operation are disclosed. The electrical meter includes a housing and an electrical interface including a plurality of electrical connections having a predetermined physical layout. The meter further includes a plurality of voltage measurement elements within the housing, each of the plurality of voltage measurement elements connected to at least one of the plurality of electrical connections, and an electrical metering circuit within the housing and configured to detect power consumption based at least in part on monitoring a voltage at each of the plurality of voltage measurement elements. The meter also includes a power supply electrically connected to the electrical metering circuit, the power supply supplying power to one or more circuits of the electrical meter. The meter further includes a low voltage electrical connection dedicated to the power supply and from an electrical service to which the electrical meter is connected.