Space transformer including a substrate and a perforated plate disposed on the substrate. The substrate includes conductive traces and an array of conductive probe pins extend outwardly from anchor points on the substrate. The pins are electrically coupled to at least one of the conductive traces on the substrate as an interface between an E-testing apparatus and a DUT. The perforated plate may be affixed to a surface of the substrate and includes an array of perforations through which the conductive pins may pass. The perforated plate may provide one or more of lateral pin support and protection to the underlying substrate and/or traces. The perforated plate may include a metal sheet. A polymeric material may be disposed on at least a sidewall of the perforations to electrically isolate the metal sheet from the conductive probe pins.

The present disclosure relates to a method for manufacturing a conductivity sensor, including a conductive conductivity sensor, including method steps of producing a thermoplastic sensor body of a plastic, which is doped at least partially with a laser activatable, metal compound as an additive, radiating the sensor body at doped locations by means of a laser, so that conductive metal nuclei form from the metal compound, immersing the sensor body in a metal bath, until at least one conductive trace forms on the region having the metal nuclei, where the at least one conductive trace serves as an electrode of the conductivity sensor.

The present disclosure relates to a method for manufacturing a conductivity sensor, including a conductive conductivity sensor, including method steps of producing a thermoplastic sensor body of a plastic, which is doped at least partially with a laser activatable, metal compound as an additive, radiating the sensor body at doped locations by means of a laser, so that conductive metal nuclei form from the metal compound, immersing the sensor body in a metal bath, until at least one conductive trace forms on the region having the metal nuclei, where the at least one conductive trace serves as an electrode of the conductivity sensor.

An interface structure enables a high reliable electrical connection between a socket and a circuit board. An adaptor for the socket includes a plate 210 and a base 220. A plurality of through holes 212 are formed in the plate 210 and a plurality of through holes 222 that align with the plurality of through hole 212 are formed in the base 220. A metal plating is applied to the inner wall of the through hole 222 and a coil spring 230 is received in the through hole 222. One end of the coil spring 230 is connected to a terminal of a socket 100 inserted from the through hole 212 and the other end as a movable contact portion 236 is connected to an electrode of the circuit board 300.

A probe core includes a frame, a wire guide connected to the frame, a probe tile, and a plurality of probe wires supported by the wire guide and probe tile. Each probe wire includes an end configured to probe a device, such as a semiconductor wafer. Each probe wire includes a signal transmitting portion and a guard portion. The probe core further includes a lock mechanism supported by the frame. The lock mechanism is configured to allow the probe core to be connected and disconnected to another test equipment or component, such as a circuit board. As one example, the probe core is configured to connect and disconnect from the test equipment or component in a rotatable lock and unlock operation or twist lock/unlock operation, where the frame is rotated relative to remainder of the core to lock/unlock the probe core.

A probe core includes a frame, a wire guide connected to the frame, a probe tile, and a plurality of probe wires supported by the wire guide and probe tile. Each probe wire includes an end configured to probe a device, such as a semiconductor wafer. Each probe wire includes a signal transmitting portion and a guard portion. The probe core further includes a lock mechanism supported by the frame. The lock mechanism is configured to allow the probe core to be connected and disconnected to another test equipment or component, such as a circuit board. As one example, the probe core is configured to connect and disconnect from the test equipment or component in a rotatable lock and unlock operation or twist lock/unlock operation, where the frame is rotated relative to remainder of the core to lock/unlock the probe core.

Embodiments related to the generation of magnetic bias fields for magnetic sensing are described and depicted. In one embodiment, a sensor includes at least one magnetosensitive element, and a magnetic body with an opening, the magnetic body comprising magnetic material magnetized mainly in a vertical direction, the magnetic body having inclined surface sections shaped by the opening, wherein the sensor is arranged atop the opening.

Embodiments related to the generation of magnetic bias fields for magnetic sensing are described and depicted. In one embodiment, a sensor includes at least one magnetosensitive element, and a magnetic body with an opening, the magnetic body comprising magnetic material magnetized mainly in a vertical direction, the magnetic body having inclined surface sections shaped by the opening, wherein the sensor is arranged atop the opening.

The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted.

The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted.