A probe insertion auxiliary and a method of probe insertion are provided. A light source illuminates holes on a lower die to make the position of the holes clear for an operator. The probe insertion auxiliary includes a bottom and a clamp pair disposed on the bottom. The clamp pair has two clamp parts. The two clamp parts define a slit for disposing a probe chassis. Furthermore, the two clamp parts and the bottom form a space. A light source is disposed inside the space for illuminating the holes.

System and methods for use and fabrication of a printed circuit board (PCB). The PCB may include a node and a plurality of rows of vias that may be configured to establish a plurality of current pathways away from the node. The node may be a sensitive node and the plurality of current pathways may reduce leakage current at the node responsive to a signal applied to the node. Each row of the plurality of rows of vias may be offset with respect to adjacent rows of vias in a horizontal plane of the PCB. The PCB may have multiple layers and the node may be on an exterior surface layer or an interior layer. The vias may be mirco-vias, buried-vias, or through-vias.

System and methods for use and fabrication of a printed circuit board (PCB). The PCB may include a node and a plurality of rows of vias that may be configured to establish a plurality of current pathways away from the node. The node may be a sensitive node and the plurality of current pathways may reduce leakage current at the node responsive to a signal applied to the node. Each row of the plurality of rows of vias may be offset with respect to adjacent rows of vias in a horizontal plane of the PCB. The PCB may have multiple layers and the node may be on an exterior surface layer or an interior layer. The vias may be mirco-vias, buried-vias, or through-vias.

A diagnostic circuit for inspecting a light-emitting device having light-emitting elements. The diagnostic circuit includes a power source module, a buffer module, and an abnormality detection module. The buffer module includes a plurality of buffers. Each buffer has a buffer input terminal and a buffer output terminal. The buffer input terminal receives a first power source signal from the power source module, and the buffer output terminal outputs a second power source signal to one of the light-emitting elements. The abnormality detection module includes a plurality of comparators. Each comparator has a pair of detection input terminals and a detection output terminal. The detection input terminals is configured to receive the first and second power source signals. The detection output terminal outputs a comparison signal to generate a diagnostic result.

An assembly method of direct-docking probing device is provided. First, a space transforming plate made by back-end-of-line semiconductor manufacturing process is provided, so the thickness of the space transforming plate is predetermined by the client of probe card manufacturer. Then a reinforcing plate in which a plurality of circuits disposed is provided, which has larger mechanical strength than the space transforming plate. After that the reinforcing plate and the space transforming plate are joined and electrically connected by a plurality of solders so as to form a space transformer. Then, a conductive elastic member and a probe interface board are provided. Thereafter, the space transformer and the conductive elastic member are mounted on the probe interface board. After that, at least one vertical probe assembly having a plurality of vertical probes is mounted on the space transforming plate, and the vertical probes is electrically connected with the space transforming plate.

An assembly method of direct-docking probing device is provided. First, a space transforming plate made by back-end-of-line semiconductor manufacturing process is provided, so the thickness of the space transforming plate is predetermined by the client of probe card manufacturer. Then a reinforcing plate in which a plurality of circuits disposed is provided, which has larger mechanical strength than the space transforming plate. After that the reinforcing plate and the space transforming plate are joined and electrically connected by a plurality of solders so as to form a space transformer. Then, a conductive elastic member and a probe interface board are provided. Thereafter, the space transformer and the conductive elastic member are mounted on the probe interface board. After that, at least one vertical probe assembly having a plurality of vertical probes is mounted on the space transforming plate, and the vertical probes is electrically connected with the space transforming plate.

A method and device for testing sensors to be applied on a patient's skin for detection of liquid or moisture are described, in particular for monitoring vascular access in an extracorporeal blood treatment, in which a patient's blood is carried away from the patient via an arterial line and is fed to the patient via a venous line. A method for producing sensors to be applied on a patient's skin for detection of liquid or moisture is also described. The method and device according to the present invention are based on the testing of one or more moisture sensors which are taken from current production. The method includes providing a large number of twists of the moisture sensor applied onto a torsion body, the mechanical stresses thus recreating the stresses that can occur in practice when the moisture sensor is applied or stuck onto the patient's skin or forearm.

A method and device for testing sensors to be applied on a patient's skin for detection of liquid or moisture are described, in particular for monitoring vascular access in an extracorporeal blood treatment, in which a patient's blood is carried away from the patient via an arterial line and is fed to the patient via a venous line. A method for producing sensors to be applied on a patient's skin for detection of liquid or moisture is also described. The method and device according to the present invention are based on the testing of one or more moisture sensors which are taken from current production. The method includes providing a large number of twists of the moisture sensor applied onto a torsion body, the mechanical stresses thus recreating the stresses that can occur in practice when the moisture sensor is applied or stuck onto the patient's skin or forearm.

An adjustment method of a magnetic resonance imaging apparatus includes: a cooling and excitation step in which work of transporting a superconducting magnet to a facility different from a facility where the superconducting magnet is to be installed, cooling a superconducting coil of the superconducting magnet with a refrigerant, and supplying a current from an external power supply for excitation is repeated until a predetermined rated current flows; a demagnetization and transportation step of demagnetizing the superconducting coil and transporting the superconducting magnet to the facility where the superconducting magnet is to be installed in a state where the superconducting coil is cooled by the refrigerant; and an installation step of installing the superconducting magnet in the facility where the superconducting magnet is to be installed and supplying a predetermined rated current from an external power supply to the superconducting coil in order to excite the superconducting coil.

An adjustment method of a magnetic resonance imaging apparatus includes: a cooling and excitation step in which work of transporting a superconducting magnet to a facility different from a facility where the superconducting magnet is to be installed, cooling a superconducting coil of the superconducting magnet with a refrigerant, and supplying a current from an external power supply for excitation is repeated until a predetermined rated current flows; a demagnetization and transportation step of demagnetizing the superconducting coil and transporting the superconducting magnet to the facility where the superconducting magnet is to be installed in a state where the superconducting coil is cooled by the refrigerant; and an installation step of installing the superconducting magnet in the facility where the superconducting magnet is to be installed and supplying a predetermined rated current from an external power supply to the superconducting coil in order to excite the superconducting coil.