An organic probe substrate structure includes a daughter card; an organic laminate attached to the daughter card; and multiple probes built onto a top surface of the organic laminate.

An organic probe substrate structure includes a daughter card; an organic laminate attached to the daughter card; and multiple probes built onto a top surface of the organic laminate.

It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.

It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.

Embodiments are directed to the formation micro-scale or millimeter scale structures or method of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

A sensor system with performance compensation testing capability includes a sensor device, a resistance bridge, a signal conditioning circuit, a first test connector, and a second test connector. The resistance bridge circuit is disposed on the sensor device and includes an excitation terminal, a circuit common terminal, and two output terminals, and is configured, upon being energized, to supply a bridge output voltage across the two output terminals. The signal conditioning circuit is electrically coupled to the excitation terminal, the circuit common terminal, and the two output terminals, and is configured to supply a sensor output signal representative of bridge output voltage. The first test connector is electrically coupled to one of the two output terminals and is configured to be coupled to an impedance test device. The second test connector is electrically coupled to the circuit common terminal and is configured to be coupled to the impedance test device.

A sensor system with performance compensation testing capability includes a sensor device, a resistance bridge, a signal conditioning circuit, a first test connector, and a second test connector. The resistance bridge circuit is disposed on the sensor device and includes an excitation terminal, a circuit common terminal, and two output terminals, and is configured, upon being energized, to supply a bridge output voltage across the two output terminals. The signal conditioning circuit is electrically coupled to the excitation terminal, the circuit common terminal, and the two output terminals, and is configured to supply a sensor output signal representative of bridge output voltage. The first test connector is electrically coupled to one of the two output terminals and is configured to be coupled to an impedance test device. The second test connector is electrically coupled to the circuit common terminal and is configured to be coupled to the impedance test device.

A probe head includes a first substrate, a second substrate, a spacer, at least one probe, and an insulating material. The first substrate has at least one first through hole. The second substrate has at least one second through hole. The spacer is disposed between the first substrate and the second substrate. The spacer, the first substrate, and the second substrate together form a cavity. The probe is disposed in the cavity and protrudes from the first through hole and the second through hole. The insulating material is on the probe and at least partially disposed in the first through hole.

A probe head includes a first substrate, a second substrate, a spacer, at least one probe, and an insulating material. The first substrate has at least one first through hole. The second substrate has at least one second through hole. The spacer is disposed between the first substrate and the second substrate. The spacer, the first substrate, and the second substrate together form a cavity. The probe is disposed in the cavity and protrudes from the first through hole and the second through hole. The insulating material is on the probe and at least partially disposed in the first through hole.

Wire probes are described that resist rotation during assembly into a probe head of a die tester. One example includes probe wires with a protrusion at a pre-determined position along the length of the wire. A probe substrate with pads on one side each to attach to and electrically connect with a probe wire and a pads on the opposite side to connect to test equipment and a probe holder above the substrate with holes. Each hole holds a respective one of the probe wires against the probe substrate. Each hole also has a key to mate with a protrusion of a respective probe wire so that the protrusions engage the keys to prevent rotation of the respective wire.