An inspection device includes a first stage that supports a substrate to be in contact with one or more contact probes, a second stage that is disposed in a vicinity of the first stage, and supports a polishing member capable of polishing the one or more contact probes, a substrate storage that stores one or more substrates including the substrate, a polishing member storage that stores one or more polishing members including the polishing member, and a transfer device including a transfer arm that transfers the substrate between the first stage and the substrate storage, and transfers the polishing member between the second stage and the polishing member storage. The transfer arm includes a first holder capable of holding the substrate, and a second holder capable of holding the polishing member at a different position from the first holder.

An inspection device includes a first stage that supports a substrate to be in contact with one or more contact probes, a second stage that is disposed in a vicinity of the first stage, and supports a polishing member capable of polishing the one or more contact probes, a substrate storage that stores one or more substrates including the substrate, a polishing member storage that stores one or more polishing members including the polishing member, and a transfer device including a transfer arm that transfers the substrate between the first stage and the substrate storage, and transfers the polishing member between the second stage and the polishing member storage. The transfer arm includes a first holder capable of holding the substrate, and a second holder capable of holding the polishing member at a different position from the first holder.

A retained and removable signal probe collar is disclosed. A contactor is disclosed. The contactor includes a metal substrate having a probe hole and a removable signal probe collar located in the probe hole. The removable signal probe collar has a removable signal probe collar hole. A signal probe is located in the removable probe collar hole. A method for retrofitting a contactor with a removable signal probe collar is disclosed.

A retained and removable signal probe collar is disclosed. A contactor is disclosed. The contactor includes a metal substrate having a probe hole and a removable signal probe collar located in the probe hole. The removable signal probe collar has a removable signal probe collar hole. A signal probe is located in the removable probe collar hole. A method for retrofitting a contactor with a removable signal probe collar is disclosed.

Embodiments of the present disclosure relate to a probe for measuring a signal and a reference signal. The probe comprises a metal body that encompasses a reference socket. The reference socket is in electrical connection with the metal body for measuring the reference signal. The probe comprises a pin that is arranged electrically isolated from the metal body. The pin has an abutting surface capable of contacting a device under test. Further, embodiments of the present disclosure relate to a method of manufacturing a probe for measuring a signal and a reference signal.

Embodiments of the present disclosure relate to a probe for measuring a signal and a reference signal. The probe comprises a metal body that encompasses a reference socket. The reference socket is in electrical connection with the metal body for measuring the reference signal. The probe comprises a pin that is arranged electrically isolated from the metal body. The pin has an abutting surface capable of contacting a device under test. Further, embodiments of the present disclosure relate to a method of manufacturing a probe for measuring a signal and a reference signal.

To provide a semiconductor test apparatus capable of improving the conductivity between a probe pin and an external terminal of a semiconductor device while suppressing the breakage of the probe pin. The semiconductor test apparatus comprises a socket base, a probe guide, and the probe pin. The socket base has a first surface and a second surface opposite the first surface in a first direction. A first opening penetrating the socket base along the first direction is provided. The probe guide is movably disposed within the first opening along the first direction. The probe guide has a first end that protrudes from the first surface when moved from the second surface to the first surface along the first direction, and a second end opposite the first end. A second opening penetrating the probe guide along the first direction is provided.

To provide a semiconductor test apparatus capable of improving the conductivity between a probe pin and an external terminal of a semiconductor device while suppressing the breakage of the probe pin. The semiconductor test apparatus comprises a socket base, a probe guide, and the probe pin. The socket base has a first surface and a second surface opposite the first surface in a first direction. A first opening penetrating the socket base along the first direction is provided. The probe guide is movably disposed within the first opening along the first direction. The probe guide has a first end that protrudes from the first surface when moved from the second surface to the first surface along the first direction, and a second end opposite the first end. A second opening penetrating the probe guide along the first direction is provided.

Disclosed is a probe-head capable of simultaneously inspecting a plurality of devices under test. The probe head includes an elastic body formed by laminating a plurality of elastic layers, with an electrode portion embedded therein. This structure efficiently absorbs shock or load that occurs during contact with the devices under test, preventing damage to both the devices and the probe head. Furthermore, the present invention allows for the simultaneous inspection of multiple electrical devices, significantly reducing inspection time. Additionally, independent elasticity between the probe pins improves inspection stability and reliability.

Disclosed is a probe-head capable of simultaneously inspecting a plurality of devices under test. The probe head includes an elastic body formed by laminating a plurality of elastic layers, with an electrode portion embedded therein. This structure efficiently absorbs shock or load that occurs during contact with the devices under test, preventing damage to both the devices and the probe head. Furthermore, the present invention allows for the simultaneous inspection of multiple electrical devices, significantly reducing inspection time. Additionally, independent elasticity between the probe pins improves inspection stability and reliability.