A test socket includes a socket block of an insulating material, provided with a probe hole to accommodate the probe, and a coating portion comprising an external film of a conductive material coated on an outer surface of the socket block, and an internal film of a conductive material coated on an inner surface of the probe hole, at least a portion of the internal film being electrically isolated from the external film.

A test socket includes a socket block of an insulating material, provided with a probe hole to accommodate the probe, and a coating portion comprising an external film of a conductive material coated on an outer surface of the socket block, and an internal film of a conductive material coated on an inner surface of the probe hole, at least a portion of the internal film being electrically isolated from the external film.

[Problem] To facilitate passing of a probe through two or more guide plates. [Solution] Provided is a probe passing method for a probe card 1 in which two guide plates 301, 302 are spaced apart from each other, and a probe 50 is passed through two guide holes 311, 312 respectively formed in the two guide plates 301, 302, the method comprising: a step for passing a towing rod 60 through the two guide holes 311, 312; a step for separably linking the tip-end of the towing rod 60, having passed through the two guide holes 311, 312, to a linking portion 510 provided at the tip-end of the probe 50; a step for pulling the towing rod 60 out of the receiving two guide holes 311, 312, and passing the probe 50 through the two guide holes 311, 312; and a step for separating the towing rod 60, having been pulled out of the two guide holes 311, 312, from the probe 50.

[Problem] To facilitate passing of a probe through two or more guide plates. [Solution] Provided is a probe passing method for a probe card 1 in which two guide plates 301, 302 are spaced apart from each other, and a probe 50 is passed through two guide holes 311, 312 respectively formed in the two guide plates 301, 302, the method comprising: a step for passing a towing rod 60 through the two guide holes 311, 312; a step for separably linking the tip-end of the towing rod 60, having passed through the two guide holes 311, 312, to a linking portion 510 provided at the tip-end of the probe 50; a step for pulling the towing rod 60 out of the receiving two guide holes 311, 312, and passing the probe 50 through the two guide holes 311, 312; and a step for separating the towing rod 60, having been pulled out of the two guide holes 311, 312, from the probe 50.

This probe includes: a first metal portion and a plate-shaped second metal portion. On one end side in a longitudinal direction X of the first metal portion, the second metal portion is buried along the longitudinal direction in a predetermined range, and protrudes in the longitudinal direction from the first metal portion so as to have a contact portion to contact with an electrode of a semiconductor device. A cross-section of the contact portion perpendicular to the longitudinal direction has a circular shape, and a cross-section perpendicular to the longitudinal direction at an end of the second metal portion on a side opposite to the contact portion in the longitudinal direction has a rectangular shape.

This probe includes: a first metal portion and a plate-shaped second metal portion. On one end side in a longitudinal direction X of the first metal portion, the second metal portion is buried along the longitudinal direction in a predetermined range, and protrudes in the longitudinal direction from the first metal portion so as to have a contact portion to contact with an electrode of a semiconductor device. A cross-section of the contact portion perpendicular to the longitudinal direction has a circular shape, and a cross-section perpendicular to the longitudinal direction at an end of the second metal portion on a side opposite to the contact portion in the longitudinal direction has a rectangular shape.

A method for retrieving a probe pin includes following operations. A probe head is received in a carrier. The probe head includes an upper die, a lower die, and at least a probe pin extending in a direction from the lower die to the upper die. A first bending delta between a probe tip of the probe pin and a pin tip of the probe pin is measured. The probe pin is bended by a bending fixture when the first bending delta is greater than a value to obtain a second bending delta between the pin tip and the pin head. The probe pin is pushed in the direction from the lower die to the upper die by a plate. The probe pin is picked from the probe head by an arm.

A method for retrieving a probe pin includes following operations. A probe head is received in a carrier. The probe head includes an upper die, a lower die, and at least a probe pin extending in a direction from the lower die to the upper die. A first bending delta between a probe tip of the probe pin and a pin tip of the probe pin is measured. The probe pin is bended by a bending fixture when the first bending delta is greater than a value to obtain a second bending delta between the pin tip and the pin head. The probe pin is pushed in the direction from the lower die to the upper die by a plate. The probe pin is picked from the probe head by an arm.

A probe includes a tip portion, an arm portion, a support portion, and a guide portion. The tip portion includes a contact portion that comes into contact with an object to be inspected. The arm portion has a cantilever structure including a connecting arm that links a free end and a fixed end, and the free end is connected to the tip portion. The support portion is connected to the fixed end. The guide portion is connected to an installation area of the arm portion oriented in a tip direction where the object to be inspected is located as viewed from the contact portion, and protrudes in the tip direction from the installation area.

A probe includes a tip portion, an arm portion, a support portion, and a guide portion. The tip portion includes a contact portion that comes into contact with an object to be inspected. The arm portion has a cantilever structure including a connecting arm that links a free end and a fixed end, and the free end is connected to the tip portion. The support portion is connected to the fixed end. The guide portion is connected to an installation area of the arm portion oriented in a tip direction where the object to be inspected is located as viewed from the contact portion, and protrudes in the tip direction from the installation area.