A probe card device is provided, including a thin film substrate, a first circuit board, and a plurality of probes. The thin film substrate has opposite first and second surface. The first circuit board is disposed over the second surface of the thin film substrate to electrically connect the thin film substrate. The probes are disposed over the first surface of the thin film substrate and are not deformable.

A probe card device is provided, including a thin film substrate, a first circuit board, and a plurality of probes. The thin film substrate has opposite first and second surface. The first circuit board is disposed over the second surface of the thin film substrate to electrically connect the thin film substrate. The probes are disposed over the first surface of the thin film substrate and are not deformable.

An apparatus for measuring a current in a conductor. The apparatus has at least one first and one second coil and the at least two coils have an identical coil body and have been wound with the same type of wire with the same number of winding layers and the same number of windings. The at least two coils are arranged electrically connected in series and spatially on top of one another. The at least two coils differ in the orientation of their windings such that the at least two coils form a supercoil. The conductor is passed through the supercoil in order to measure the current.

An apparatus for measuring a current in a conductor. The apparatus has at least one first and one second coil and the at least two coils have an identical coil body and have been wound with the same type of wire with the same number of winding layers and the same number of windings. The at least two coils are arranged electrically connected in series and spatially on top of one another. The at least two coils differ in the orientation of their windings such that the at least two coils form a supercoil. The conductor is passed through the supercoil in order to measure the current.

A method for re-using a probe pin includes following operations. A first probe head including an upper die, a lower die, and at least a probe pin is received. A first bending delta between a pin tip and a pin head of the probe pin is compared with a value. The probe pin is bended to obtain a second bending delta when the first bending delta is greater than the value. The probe pin is pushed in a first direction from the lower die to the upper die after the bending of the probe pin, or when the first bending delta is less than the value. The probe pin is retrieved from the first probe head, and assembled to a second probe head. A third bending delta of the probe pin in the second probe head is less than the first bending delta.

A method for re-using a probe pin includes following operations. A first probe head including an upper die, a lower die, and at least a probe pin is received. A first bending delta between a pin tip and a pin head of the probe pin is compared with a value. The probe pin is bended to obtain a second bending delta when the first bending delta is greater than the value. The probe pin is pushed in a first direction from the lower die to the upper die after the bending of the probe pin, or when the first bending delta is less than the value. The probe pin is retrieved from the first probe head, and assembled to a second probe head. A third bending delta of the probe pin in the second probe head is less than the first bending delta.

A testing apparatus includes a circuit board, a socket and a conductive pad. The circuit board is provided with a plurality of contacts. The socket is mounted on the circuit board and provided with a receiving groove thereon. The conductive pad includes a three-dimensional stepped-stage structure and a plurality of elastic conductive pillars. The three-dimensional stepped-stage structure is received within the receiving groove, and provided with a plurality of annular steps which are arranged as concentric rectangles in sequence. Heights of the annular steps are sequentially modified according to a direction from a center point of the concentric rectangles towards the socket. These elastic conductive pillars are respectively inserted into the three-dimensional stepped-stage structure so as to be arranged separately on the annular steps. Each of the elastic conductive pillars is electrically connected to the packaged module and one of the contacts, respectively.

A testing apparatus includes a circuit board, a socket and a conductive pad. The circuit board is provided with a plurality of contacts. The socket is mounted on the circuit board and provided with a receiving groove thereon. The conductive pad includes a three-dimensional stepped-stage structure and a plurality of elastic conductive pillars. The three-dimensional stepped-stage structure is received within the receiving groove, and provided with a plurality of annular steps which are arranged as concentric rectangles in sequence. Heights of the annular steps are sequentially modified according to a direction from a center point of the concentric rectangles towards the socket. These elastic conductive pillars are respectively inserted into the three-dimensional stepped-stage structure so as to be arranged separately on the annular steps. Each of the elastic conductive pillars is electrically connected to the packaged module and one of the contacts, respectively.

The disclosure provides a probe card comprising a circuit substrate, a space transformer, and a first coaxial cable. The circuit substrate has a first surface and a second surface, wherein a through hole penetrates the circuit substrate from the first surface to the second surface. The space transformer is arranged on the second surface corresponding to the through hole and has a probe setting surface opposite to the second surface. The first coaxial cable has a first conducting part and a first insulating part, wherein the first coaxial cable is inserted into the through hole, and a first end surface of the first conducting part is flush with the probe setting surface.

The disclosure provides a probe card comprising a circuit substrate, a space transformer, and a first coaxial cable. The circuit substrate has a first surface and a second surface, wherein a through hole penetrates the circuit substrate from the first surface to the second surface. The space transformer is arranged on the second surface corresponding to the through hole and has a probe setting surface opposite to the second surface. The first coaxial cable has a first conducting part and a first insulating part, wherein the first coaxial cable is inserted into the through hole, and a first end surface of the first conducting part is flush with the probe setting surface.