Systems, circuits, and methods provide core-based closed-loop current sensors utilizing a coil connected to an IC having a magnetic field sensor configured to measure current in one or more conductors such as busbars. A closed-loop current sensor includes a magnetic core having first and second ends separated by a gap and an aperture receiving the one or more conductors; a magnetic field sensor disposed on a substrate and integrated in an IC is disposed in the gap, where the magnetic field sensor is configured to receive magnetic flux from the gap, where the IC is configured to measure AC current in the one or more conductors; and a coil integrated with the substrate and coupled to the IC, wherein the coil is configured to provide negative magnetic feedback for closed-loop compensation.

Systems, circuits, and methods provide core-based closed-loop current sensors utilizing a coil connected to an IC having a magnetic field sensor configured to measure current in one or more conductors such as busbars. A closed-loop current sensor includes a magnetic core having first and second ends separated by a gap and an aperture receiving the one or more conductors; a magnetic field sensor disposed on a substrate and integrated in an IC is disposed in the gap, where the magnetic field sensor is configured to receive magnetic flux from the gap, where the IC is configured to measure AC current in the one or more conductors; and a coil integrated with the substrate and coupled to the IC, wherein the coil is configured to provide negative magnetic feedback for closed-loop compensation.

An optical coupling between optical components and, more particularly, an optical probe for optical testing of at least one micro-optical component, a method for producing an optical probe, and a method for optical testing of at least one micro-optical component. The optical probe comprising: a probe head, wherein the probe head comprises a test component; at least one micro-optical element, wherein the micro-optical element is a separate element with regard to the test component and in mechanical contact with the test component, wherein the micro-optical element is configured to optically couple light between the test component and the micro-optical component, thereby being configured to determine an optical performance of the micro-optical component, and wherein the micro-optical element is configured to be operated in an index matching liquid.

An optical coupling between optical components and, more particularly, an optical probe for optical testing of at least one micro-optical component, a method for producing an optical probe, and a method for optical testing of at least one micro-optical component. The optical probe comprising: a probe head, wherein the probe head comprises a test component; at least one micro-optical element, wherein the micro-optical element is a separate element with regard to the test component and in mechanical contact with the test component, wherein the micro-optical element is configured to optically couple light between the test component and the micro-optical component, thereby being configured to determine an optical performance of the micro-optical component, and wherein the micro-optical element is configured to be operated in an index matching liquid.

An alloy material for probe pins that can suppress diffusion of components between solder in a circuit connecting portion of an inspection target and a probe material during probe inspection. The alloy material for probe pins includes more than 20 mass % and 60 mass % or less of Pd, 3 mass % or more and less than 20 mass % of Ag, 3 mass % or more and 50 mass % or less of Ni, and 3 mass % or more and 74 mass % or less of Cu. Alternatively, the alloy material for probe pins includes more than 20 mass % and 60 mass % or less of Pd, 20 mass % or more and 35 mass % or less of Ag, 7 mass % or more and 50 mass % or less of Ni, and 3 mass % or more and 53 mass % or less of Cu.

An electronic device includes a substrate, an electronic element, a layer, a plurality of first bonding pads, a transistor and a plurality of second bonding pads. The electronic element is disposed on the substrate. The layer is disposed between the substrate and the electronic element. The plurality of first bonding pads are disposed corresponding to the electronic element. The transistor is electrically connected with the electronic element through the plurality of first bonding pads. The substrate is disposed between the plurality of first bonding pads and the plurality of second bonding pads. The transistor is disposed between the plurality of first bonding pads and the substrate.

The present invention provides a probe card. A module cap, on the probe card substrate, is designed to have a chute and the probe module can be installed on or uninstalled from the module cap via the chute. That simplifies the operations of assembling and disassembling the probe card and avoids positioning error.

The present invention relates to a manufacturing method of a semiconductor test device. A semiconductor test device according to one embodiment of the present invention, which is a semiconductor test device for testing an electrical connection of a semiconductor, may include: a first membrane portion including a plurality of first aperture patterns in a thickness direction; a second membrane portion connected to the first membrane portion and including a plurality of second aperture patterns in a thickness direction; and a holder portion including a hollow region and being connected to an edge of the first membrane portion.

The present invention relates to a manufacturing method of a semiconductor test device. A semiconductor test device according to one embodiment of the present invention, which is a semiconductor test device for testing an electrical connection of a semiconductor, may include: a first membrane portion including a plurality of first aperture patterns in a thickness direction; a second membrane portion connected to the first membrane portion and including a plurality of second aperture patterns in a thickness direction; and a holder portion including a hollow region and being connected to an edge of the first membrane portion.

Provided is a semiconductor test device. A semiconductor test device according to an embodiment is designed for testing an electrical connection of a semiconductor and includes a membrane portion comprising a first surface and a plurality of aperture patterns extending in a direction of a second surface opposite to the first surface, wherein the membrane portion comprises a metal thin film portion having the plurality of aperture patterns, and an insulating layer portion having an insulating material coated on a surface of the metal thin film portion, a contact protrusion portion is formed to protrude from the first surface of the metal thin film portion, neighboring aperture patterns are insulated from each other, and an electrical connection path is formed from the top to the bottom of each of the aperture patterns.