The present invention relates to a semiconductor test device and a manufacturing method thereof. The semiconductor test device according to an embodiment of the present invention is a semiconductor test device which is interposed between semiconductor memories, or between a semiconductor memory and an interposer, to perform a test of an electrical connection, and may include: a membrane portion comprising a plurality of aperture patterns in a thickness direction; and a holder portion having a hollow region and connected to an edge of the membrane portion, wherein neighboring aperture patterns are insulated from each other and an electrical connection path is formed from a top to a bottom of each aperture pattern.

A method of manufacturing a contact probe includes: forming external shapes of a plurality of main body part base materials on a plate material, each of the plurality of main body part base materials being connected to a base part via a connection part and used for forming a main body part of a pipe member; forming a plurality of protrusions on each of the plurality of main body part base materials; forming the pipe member by bending each of the plurality of main body part base materials into a C-shape such that the protrusions protrude toward an inner side of the pipe member; assembling the contact probe by inserting first and second plungers and a coil spring into the pipe member connected to the connection part; and cutting the pipe member from the connection part.

A method of manufacturing a contact probe includes: forming external shapes of a plurality of main body part base materials on a plate material, each of the plurality of main body part base materials being connected to a base part via a connection part and used for forming a main body part of a pipe member; forming a plurality of protrusions on each of the plurality of main body part base materials; forming the pipe member by bending each of the plurality of main body part base materials into a C-shape such that the protrusions protrude toward an inner side of the pipe member; assembling the contact probe by inserting first and second plungers and a coil spring into the pipe member connected to the connection part; and cutting the pipe member from the connection part.

An interface device is provided between a test head and a DUT. In the interface device, each pin electronics IC is coupled to a DUT via an FPC cable.

Proposed are a test device and a manufacturing method of the test device capable of testing a test object that is provided with an electrode which has a size and/or a pitch distance ranging from 1 to 100 micrometers (m).

A method for testing an insulation of a conductor segment for an electrical machine for defects by: a) electrically connecting a conductor segment connection of the conductor segment to a test connection; b) capacitive charging of the conductor segment; c) relatively moving the conductor segment and a test contact in order to scan the area to be tested of the insulation with the test contact, and d) checking whether an electrical connection exists between the test connection and the test contact during step c) in order to conclude that there is a defect in the insulation. Step b) occurs before or during step c). Also a device for performing such a test method.

Proposed are an anodic aluminum oxide mold capable of manufacturing a molded article having at least a portion with a dimensional range of several tens of m, and a mold structure including the same. Additionally, proposed are a method of manufacturing a molded article with a dimensional range of several tens of m using the anodic aluminum oxide mold, and a molded article manufactured thereby.

A probe assembly is provided and includes a probe card, an interposer body disposed on a surface of the probe card, probe pins arranged in a grouping and extending from the interposer body away from the probe card, each probe pin including an elongate element and a tip at a distal end of the elongate element, a mold supportable on the interposer body to fit around the grouping of the probe pins and non-conductive elastic material introduced into and cured within an interior region defined by the mold to surround at least the elongate element of each probe pin.

A probe assembly is provided and includes a probe card, an interposer body disposed on a surface of the probe card, probe pins arranged in a grouping and extending from the interposer body away from the probe card, each probe pin including an elongate element and a tip at a distal end of the elongate element, a mold supportable on the interposer body to fit around the grouping of the probe pins and non-conductive elastic material introduced into and cured within an interior region defined by the mold to surround at least the elongate element of each probe pin.

A jig and a method for grinding probe pins of a probe card. The jig includes a carrier and a connecting part. The carrier carries a support body with a grinding sheet, and the carrier includes an opening. The support body with the grinding sheet straddles above the opening. The opening may expose a plurality of probe pins of the probe card.