An object is to provide an alignment chip for forming an alignment symbol on a wiring board of a probe card. Provided are: a substrate 51 having a pasting surface to be pasted to a probe installation surface 17 of a wiring board 14 constituting a probe card 10 via an adhesive 54; and an alignment symbol 501 made of a metal film 52 formed on a symbol surface on a side opposite to the pasting surface of the substrate 51. The symbol surface includes a symbol peripheral region 502 surrounding the alignment symbol 501, and the symbol peripheral region 502 has a lower reflectance than the alignment symbol 501.

In a general aspect, gettering elements are disclosed for absorbing gas species from a cavity of a vapor cell. In certain aspects, a vapor cell includes a dielectric body having interior and exterior surfaces. The interior surface defines a cavity in the dielectric body, and the exterior surface defines an opening to the cavity. The dielectric body also includes a channel having a porous layer that is configured to absorb a gas species from the cavity. The vapor cell also includes a vapor or a source of vapor residing in the cavity as well as an optical window that covers the opening to the cavity. The optical window has a surface bonded to the exterior surface of the dielectric body to form a bonded interface of the vapor cell. The bonded interface includes a seal around the opening, and the vapor or the source of vapor includes alkali metal atoms.

In a general aspect, gettering elements are disclosed for absorbing gas species from a cavity of a vapor cell. In certain aspects, a vapor cell includes a dielectric body having interior and exterior surfaces. The interior surface defines a cavity in the dielectric body, and the exterior surface defines an opening to the cavity. The dielectric body also includes a channel having a porous layer that is configured to absorb a gas species from the cavity. The vapor cell also includes a vapor or a source of vapor residing in the cavity as well as an optical window that covers the opening to the cavity. The optical window has a surface bonded to the exterior surface of the dielectric body to form a bonded interface of the vapor cell. The bonded interface includes a seal around the opening, and the vapor or the source of vapor includes alkali metal atoms.

A test socket for testing integrated circuit (IC) chips and a manufacturing method for the test socket are disclosed. The test socket comprises an insulating support structure having a plurality of through holes and a plurality of elastic conductive posts. The conductive posts are partially embedded in the support structure and extend through the through holes to accommodate variations due to IC package warpage and ball grid array (BGA) solder ball size tolerances. The insulating support structure further includes grooves adjacent to the through holes to securely fasten the conductive posts. Each conductive post features an elastic structure with at least a portion of its circumferential surface covered by an insulating material layer to prevent short circuits. The test socket further comprises a rigid support framepotentially made of polyimide, PCB material, or ceramicand a soft support frame made of silicone, which is both durable and flexible.

A test socket for testing integrated circuit (IC) chips and a manufacturing method for the test socket are disclosed. The test socket comprises an insulating support structure having a plurality of through holes and a plurality of elastic conductive posts. The conductive posts are partially embedded in the support structure and extend through the through holes to accommodate variations due to IC package warpage and ball grid array (BGA) solder ball size tolerances. The insulating support structure further includes grooves adjacent to the through holes to securely fasten the conductive posts. Each conductive post features an elastic structure with at least a portion of its circumferential surface covered by an insulating material layer to prevent short circuits. The test socket further comprises a rigid support framepotentially made of polyimide, PCB material, or ceramicand a soft support frame made of silicone, which is both durable and flexible.

A probe head for performing an electrical test on a device under test (DUT) includes an upper substrate including a plurality of upper through holes, a lower substrate assembly disposed under the upper substrate and including a plurality of lower through holes corresponding to the plurality of upper through holes respectively, a spacer connected between the upper substrate and the lower substrate assembly to maintain a gap between the upper substrate and the lower substrate assembly, a plurality of first probes extending through the plurality of upper through holes and the plurality of lower through holes respectively, an interconnect structure disposed on the lower substrate assembly and comprising a dielectric layer and a circuit layer, and a plurality of second probes disposed on the interconnect structure and electrically connected to one another through the circuit layer.

A probe head for performing an electrical test on a device under test (DUT) includes an upper substrate including a plurality of upper through holes, a lower substrate assembly disposed under the upper substrate and including a plurality of lower through holes corresponding to the plurality of upper through holes respectively, a spacer connected between the upper substrate and the lower substrate assembly to maintain a gap between the upper substrate and the lower substrate assembly, a plurality of first probes extending through the plurality of upper through holes and the plurality of lower through holes respectively, an interconnect structure disposed on the lower substrate assembly and comprising a dielectric layer and a circuit layer, and a plurality of second probes disposed on the interconnect structure and electrically connected to one another through the circuit layer.

An interface device is provided between a test head and a device under test (DUT). A socket board includes sockets each configured to mount a DUT, and a socket PCB having a first face that mounts the sockets and a second face provided with multiple back face electrodes. An interposer has a first face provided with multiple deformable electrodes and a second face provided with multiple non-deformable electrodes and is configured such that the multiple deformable electrodes are in contact with the multiple back face electrodes of the socket PCB. An FPC cable has multiple electrode pads to be coupled with the multiple non-deformable electrodes on the second face of the first interposer.

Proposed is an electroconductive contact pin, and the objective is to manufacture a metal molded product with a high aspect ratio, the metal molded product using a mold made of an anodized film material so that deformation of the electroconductive contact pin is prevented, and being capable of effectively improving current carrying capacity.

Proposed is an electroconductive contact pin, and the objective is to manufacture a metal molded product with a high aspect ratio, the metal molded product using a mold made of an anodized film material so that deformation of the electroconductive contact pin is prevented, and being capable of effectively improving current carrying capacity.