A test probe includes a main body extending along an axis, and a contact unit connected to the main body. The contact unit includes a plurality of structural components surrounding the axis and extending outwardly from the main body along the axis. Each structural component has a pointed tip suitable for contact with an object to be tested, and at least one ridgeline connected to the pointed tip. The at least one ridgeline is inclined with respect to a reference surface that passes through said pointed tip and that is perpendicular to the axis, and is configured to form an included angle with the reference surface. The included angle is smaller than 30 degrees.

A test probe includes a main body extending along an axis, and a contact unit connected to the main body. The contact unit includes a plurality of structural components surrounding the axis and extending outwardly from the main body along the axis. Each structural component has a pointed tip suitable for contact with an object to be tested, and at least one ridgeline connected to the pointed tip. The at least one ridgeline is inclined with respect to a reference surface that passes through said pointed tip and that is perpendicular to the axis, and is configured to form an included angle with the reference surface. The included angle is smaller than 30 degrees.

A method for producing a device for measuring current intensities, including: providing a resistor arrangement having connection elements and a resistor element arranged therebetween in a current flow direction. The resistor element and the connection elements consist of different electrically conductive materials; forming a contact pin from the material of at least one connection element; positioning a printed circuit board with a conductor track and a passage bore on the resistor arrangement such that the contact pin projects through the passage bore and has on the side of the printed circuit board facing away from the resistor arrangement a protrusion; laterally widening the contact pin in the region of the protrusion by deforming the material such that the printed circuit board is mechanically fixed to the resistor arrangement; and producing an electrically conductive connection between the contact pin and the conductor track of the printed circuit board.

A semiconductor manufacturing method includes forming a first redistribution structure with a fine redistribution circuitry over a first temporary carrier; forming testing tips on a first surface of the fine redistribution circuitry; transferring the testing tips and the first redistribution structure to a second temporary carrier provided with a temporary adhesive layer, where the testing tips are embedded in the temporary adhesive layer with the second temporary carrier disposed on the temporary adhesive layer; releasing the first temporary carrier to expose a second surface of the fine redistribution circuitry; coupling a second redistribution structure with a coarse redistribution circuitry to the first redistribution structure through conductive joints, where the conductive joints are formed on the second surface of the fine redistribution circuitry; and releasing the second temporary carrier and the temporary adhesive layer from the testing tips and the first redistribution structure after coupling the second redistribution structure.

A semiconductor manufacturing method includes forming a first redistribution structure with a fine redistribution circuitry over a first temporary carrier; forming testing tips on a first surface of the fine redistribution circuitry; transferring the testing tips and the first redistribution structure to a second temporary carrier provided with a temporary adhesive layer, where the testing tips are embedded in the temporary adhesive layer with the second temporary carrier disposed on the temporary adhesive layer; releasing the first temporary carrier to expose a second surface of the fine redistribution circuitry; coupling a second redistribution structure with a coarse redistribution circuitry to the first redistribution structure through conductive joints, where the conductive joints are formed on the second surface of the fine redistribution circuitry; and releasing the second temporary carrier and the temporary adhesive layer from the testing tips and the first redistribution structure after coupling the second redistribution structure.

To provide a method of manufacturing an electrical contactor including a volute spring structure extending in upward and downward directions formed integrally using a single material, having mechanical simplicity and excellent functionality, and functioning as an electric circuit achieving connection without loss.

The present disclosure is intended for a method of manufacturing an electrical contactor made of a plate-like member having electrical conductivity, comprising: (1) a first step of forming the plate-like member into a barrel shape by winding the plate-like member in a spiral pattern; (2) a second step of compressing the plate-like member formed into the barrel shape from a vertical direction until the plate-like member assumes a volute shape with an upper spiral structure and a lower spiral structure overlapping each other; and (3) a third step of forming a volute-shaped electrical contactor by performing predetermined hardening treatment on the plate-like member temporarily assuming the volute shape as a result of the second step.

A method for manufacturing a short-circuit protection device, including producing, on a first face of a first substrate, a plurality of first electrically conductive segments; producing, on the first face, a plurality of electrically conductive pads each being in mechanical and electrical contact, through the base thereof, with a single corresponding first segment; producing, on a second face of a second substrate, a plurality of second electrically conductive segments; placing the first face and the second face opposite to each other, to bring a free end of each pad into mechanical and electrical contact with a single corresponding second segment, such that the first segments, the second segments and the pads form a coil.

A method for manufacturing a short-circuit protection device, including producing, on a first face of a first substrate, a plurality of first electrically conductive segments; producing, on the first face, a plurality of electrically conductive pads each being in mechanical and electrical contact, through the base thereof, with a single corresponding first segment; producing, on a second face of a second substrate, a plurality of second electrically conductive segments; placing the first face and the second face opposite to each other, to bring a free end of each pad into mechanical and electrical contact with a single corresponding second segment, such that the first segments, the second segments and the pads form a coil.

A device probe includes a primary probe arm and a subsequent probe arm with a slip plane spacing between the primary probe arm and subsequent probe arm. Each probe arm is integrally part of a probe base that is attachable to a probe card. During probe use on a semiconductive device or a semiconductor device package substrate, overtravel of the probe tip allows the primary and subsequent probe arms to deflect, while sufficient resistance to deflection creates a useful contact with an electrical structure such as an electrical bump or a bond pad.

A device probe includes a primary probe arm and a subsequent probe arm with a slip plane spacing between the primary probe arm and subsequent probe arm. Each probe arm is integrally part of a probe base that is attachable to a probe card. During probe use on a semiconductive device or a semiconductor device package substrate, overtravel of the probe tip allows the primary and subsequent probe arms to deflect, while sufficient resistance to deflection creates a useful contact with an electrical structure such as an electrical bump or a bond pad.