G01R3/00

Probe device of floating structure
11320460 · 2022-05-03 · ·

Disclosed is a probe device of a floating structure including a probe unit having a groove formed at one end thereof into which a needle for transmitting an electrical signal is inserted, and a guide portion formed at the other end thereof and a plate unit having an inner space which is inserted with the guide portion and formed to support a part of the guide portion, wherein the guide portion is spaced apart from the inner space at a predetermined interval by an external force applied to the needle.

PROBE PIN MATERIAL INCLUDING Ag-Pd-Cu-BASED ALLOY

A probe pin material including a Ag—Pd—Cu-based alloy essentially including Ag, Pd and Cu, B as a first additive element, and at least any element of Zn, Bi and Sn, as a second additive element. A concentration of the first additive element is 0.1 mass % or more and 1.5 mass % or less, and a concentration of the second additive element is 0.1 mass % or more and 1.0 mass % or less. A Ag concentration, a Pd concentration and a Cu concentration in the Ag—Pd—Cu-based alloy are required as follows: a Ag concentration (S.sub.Ag), a Pd concentration (S.sub.Pd) and a Cu concentration (S.sub.Cu) converted as given that a Ag—Pd—Cu ternary alloy is formed from only such three elements all fall within a predetermined range in a Ag—Pd—Cu ternary system phase diagram. The probe pin material is excellent in resistance value and hardness/wear resistance, and also is enhanced in bending resistance.

Rogowski Coil Integrated in Glass Substrate

A method of forming a current measurement device includes providing a glass substrate having first and second substantially planar surfaces that are opposite one another, forming a plurality of through-vias in the glass substrate that each extend between the first and second substantially planar surfaces, and forming conductive tracks on the glass substrate that connect adjacent ones of the through-vias together. Forming the plurality of through-vias includes applying radiation to the glass substrate, and the conductive tracks and the through-vias collectively form a coil structure in the glass substrate.

TEST DEVICE AND PROBE POLISHING METHOD
20220128603 · 2022-04-28 ·

A test device for testing a substrate is provided. The device comprises: a mounting table for test on which the substrate under test is mounted; a transportation mechanism to transport the substrate under test; a mounting table for polishing on which a polishing substrate is mounted; a first forward or backward movement mechanism to move the mounting table for test with respect to a probe; and a second forward or backward movement mechanism to move the mounting table for polishing with respect to the probe, wherein the mounting table for polishing is provided separately from the mounting table for test, a retreat region of the mounting table for test is opposite to a retreat region of the mounting table for polishing, and the second forward or backward movement mechanism is configured such that a portion of the polishing substrate overlaps the probe while the other portion of the polishing substrate does not overlap the probe.

TEST DEVICE AND PROBE POLISHING METHOD
20220128603 · 2022-04-28 ·

A test device for testing a substrate is provided. The device comprises: a mounting table for test on which the substrate under test is mounted; a transportation mechanism to transport the substrate under test; a mounting table for polishing on which a polishing substrate is mounted; a first forward or backward movement mechanism to move the mounting table for test with respect to a probe; and a second forward or backward movement mechanism to move the mounting table for polishing with respect to the probe, wherein the mounting table for polishing is provided separately from the mounting table for test, a retreat region of the mounting table for test is opposite to a retreat region of the mounting table for polishing, and the second forward or backward movement mechanism is configured such that a portion of the polishing substrate overlaps the probe while the other portion of the polishing substrate does not overlap the probe.

METHOD FOR PRODUCING A PULSE INVERTER, CURRENT MEASURING DEVICE FOR A PULSE INVERTER, PULSE INVERTER AND MOTOR VEHICLE
20230243873 · 2023-08-03 ·

A method for producing a pulse inverter comprising a module with electronic components, a contact bar sticking out from the side of the module for contacting the pulse inverter with a contact external to the pulse inverter, a current measuring device arranged on the contact bar for detecting a measurement signal regarding the current strength in the contact bar and a control board arranged on the top or bottom of the module with a driver circuit for control of the electronic components with the aid of the measurement signal, wherein the driver circuit makes contact with the module across control contacting pins of the module and with the current measuring device across measurement contacting pins of the current measuring device, wherein the current measuring device is attached to the contact bar such that it is movably mounted with respect to it, after which the control board is positioned such that the control contacting pins are led through control contact openings of the control board and the current measuring device is oriented by displacing it such that the measurement contacting pins are led through measurement contact openings of the control board, after which the current measuring device is secured to the contact bar and/or the control board.

METHOD FOR PRODUCING A PULSE INVERTER, CURRENT MEASURING DEVICE FOR A PULSE INVERTER, PULSE INVERTER AND MOTOR VEHICLE
20230243873 · 2023-08-03 ·

A method for producing a pulse inverter comprising a module with electronic components, a contact bar sticking out from the side of the module for contacting the pulse inverter with a contact external to the pulse inverter, a current measuring device arranged on the contact bar for detecting a measurement signal regarding the current strength in the contact bar and a control board arranged on the top or bottom of the module with a driver circuit for control of the electronic components with the aid of the measurement signal, wherein the driver circuit makes contact with the module across control contacting pins of the module and with the current measuring device across measurement contacting pins of the current measuring device, wherein the current measuring device is attached to the contact bar such that it is movably mounted with respect to it, after which the control board is positioned such that the control contacting pins are led through control contact openings of the control board and the current measuring device is oriented by displacing it such that the measurement contacting pins are led through measurement contact openings of the control board, after which the current measuring device is secured to the contact bar and/or the control board.

METHOD OF MANUFACTURING ELECTRONIC DEVICE

A method of manufacturing an electronic device includes the following steps. A substrate is provided, and the substrate has a first surface, a second surface opposite to the first surface and a side surface between the first surface and the second surface. A first circuit is formed on the first surface. A second circuit is formed on the second surface. The first circuit is made to electrically connect with the second circuit. A testing signal is applied to the first circuit and received from the second circuit to verify the electrical connection between the first circuit and the second circuit.

DEVICE FOR HARNESSING WASTED POTENTIAL ENERGY
20220120787 · 2022-04-21 ·

An energy measuring device made of two same size blocks. The outline of two metal ball bearings are traced onto the blocks which are then drilled out where the tracings are marked. Ball bearings are inserted into the resulting holes. With the bearings fitted in place a dowel is inserted through the centers of the bearings to check out the fitting. The dowel is then removed and replaced with a roller. Next, a generator and gear assembly is fabricated comprising two gears and a band, the selected gears having a 10:1 ratio. A string is now loosely attached to the dowel so it can be wound up and released to measure an amount of energy created. The string is marked from 12-24 inches, in 6 inch increments, and these markings are used to control speed and turns for tests related to harnessing otherwise wasted energy.

DEVICE FOR HARNESSING WASTED POTENTIAL ENERGY
20220120787 · 2022-04-21 ·

An energy measuring device made of two same size blocks. The outline of two metal ball bearings are traced onto the blocks which are then drilled out where the tracings are marked. Ball bearings are inserted into the resulting holes. With the bearings fitted in place a dowel is inserted through the centers of the bearings to check out the fitting. The dowel is then removed and replaced with a roller. Next, a generator and gear assembly is fabricated comprising two gears and a band, the selected gears having a 10:1 ratio. A string is now loosely attached to the dowel so it can be wound up and released to measure an amount of energy created. The string is marked from 12-24 inches, in 6 inch increments, and these markings are used to control speed and turns for tests related to harnessing otherwise wasted energy.